公开(公告)号：US08643833B1

公开(公告)日：2014-02-04

申请号：US13600726

申请日：2012-08-31

Applicant: Min-Wei Hung ,  Hsin-Yi Tsai ,  Kuo-Cheng Huang ,  Chun-Yao Huang

Inventor： Min-Wei Hung ,  Hsin-Yi Tsai ,  Kuo-Cheng Huang ,  Chun-Yao Huang

IPC: G01N21/00

CPC classification number: G01N21/9501

Abstract: An inspection system and method for inspecting the surface defects of the specimen is provided. The inspection system includes a laser focus module, a microscope objective module, an image pick-up module, and a process module. The laser focus module configured to emit laser beam on the specimen by a predetermined angle relative to a surface of the specimen, and to generate scattered light and reflected light when the laser beam irradiates on the surface defects of the specimen. The process module can calculate the real size of the defects by using the intensity information obtained from the image pick-up module and the microscope objective module or using the diameter information obtained from the reflected light image while the reflected light projects on a screen.

Abstract translation: 提供了一种用于检查样品表面缺陷的检查系统和方法。 检查系统包括激光聚焦模块，显微镜物镜模块，图像拾取模块和处理模块。 所述激光聚焦模块被配置为相对于所述检体的表面在所述试样上发射预定角度的激光束，并且当所述激光束照射在所述试样的表面缺陷上时产生散射光和反射光。 处理模块可以通过使用从图像拾取模块和显微镜物镜模块获得的强度信息或使用从反射光图像获得的直径信息来计算缺陷的实际大小，同时反射光投射在屏幕上。

公开(公告)号：US20130337629A1

公开(公告)日：2013-12-19

申请号：US13523912

申请日：2012-06-15

Applicant: Tieh-Chiang Wu ,  Wei-Ming Liao ,  Jei-Cheng Huang ,  Shin-Yu Nieh

Inventor： Tieh-Chiang Wu ,  Wei-Ming Liao ,  Jei-Cheng Huang ,  Shin-Yu Nieh

IPC: H01L21/02

CPC classification number: H01L29/66181 ,  H01L27/0629 ,  H01L27/108 ,  H01L27/10861 ,  H01L29/945

Abstract: A method of fabricating a semiconductor device is described. A substrate having first and second areas is provided. A first patterned mask layer having at least one first opening in the first area and at least one second opening in the second area is formed over the substrate, wherein the first opening is smaller than the second opening. A portion of the substrate is removed with the first patterned mask layer as a mask to form first and second trenches respectively in the substrate in the first and second areas, wherein the width and the depth of the first trench are less than those of the second trench. A first dielectric layer is formed at least in the first and second trenches. A conductive structure is formed on the first dielectric layer on at least a portion of the sidewall of each of the first and second trenches.

Abstract translation: 描述制造半导体器件的方法。 提供具有第一和第二区域的基板。 第一图案化掩模层在第一区域中具有至少一个第一开口和第二区域中的至少一个第二开口形成在衬底上，其中第一开口小于第二开口。 用第一图案化掩模层作为掩模去除衬底的一部分，以分别在第一和第二区域中的衬底中形成第一和第二沟槽，其中第一沟槽的宽度和深度小于第二沟槽的宽度和深度 沟。 至少在第一和第二沟槽中形成第一介电层。 在所述第一和第二沟槽中的每一个的侧壁的至少一部分上的第一介电层上形成导电结构。

公开(公告)号：US08604503B2

公开(公告)日：2013-12-10

申请号：US13600137

申请日：2012-08-30

Applicant: Chia-Hung Huang ,  Shih-Cheng Huang ,  Po-Min Tu ,  Ya-Wen Lin ,  Shun-Kuei Yang

Inventor： Chia-Hung Huang ,  Shih-Cheng Huang ,  Po-Min Tu ,  Ya-Wen Lin ,  Shun-Kuei Yang

IPC: H01L33/22

CPC classification number: H01L33/58 ,  H01L33/10 ,  H01L33/22 ,  H01L33/32

Abstract: A light emitting diode includes a substrate, a transitional layer on the substrate and an epitaxial layer on the transitional layer. The transitional layer includes a planar area with a flat top surface and a patterned area with a rugged top surface. An AlN material includes a first part consisting of a plurality of spheres and a second part consisting of a plurality of slugs. The spheres are on a top surface of the transitional layer, both at the planar area and the patterned area. The slugs are in grooves defined in the patterned area. Air gaps are formed between the slugs and a bottom surface of the epitaxial layer. The spheres and slugs of the AlN material help reflection of light generated by the epitaxial layer to a light output surface of the LED.

Abstract translation: 发光二极管包括衬底，衬底上的过渡层和过渡层上的外延层。 过渡层包括具有平坦顶表面的平坦区域和具有粗糙顶表面的图案区域。 AlN材料包括由多个球体组成的第一部分和由多个球团组成的第二部分。 球体在平坦区域和图案化区域处于过渡层的顶表面上。 s条位于图案区域中限定的凹槽中。 在s条和外延层的底表面之间形成气隙。 AlN材料的球体和块状物有助于将由外延层产生的光反射到LED的光输出表面。

公开(公告)号：US08574939B2

公开(公告)日：2013-11-05

申请号：US12836075

申请日：2010-07-14

Applicant: Shih Cheng Huang ,  Po Min Tu ,  Peng Yi Wu ,  Wen Yu Lin ,  Chih Pang Ma ,  Tzu Chien Hong ,  Chia Hui Shen

Inventor： Shih Cheng Huang ,  Po Min Tu ,  Peng Yi Wu ,  Wen Yu Lin ,  Chih Pang Ma ,  Tzu Chien Hong ,  Chia Hui Shen

IPC: H01L33/22

CPC classification number: H01L33/36 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/10 ,  H01L33/20 ,  H01L33/22

Abstract: A semiconductor optoelectronic structure with increased light extraction efficiency and a fabrication method thereof are presented. The semiconductor optoelectronic structure includes continuous grooves formed under an active layer of the semiconductor optoelectronic structure to reflect light from the active layer and thereby direct more light through a light output surface so as to increase the light intensity from the semiconductor optoelectronic structure.

Abstract translation: 提出了一种提高光提取效率的半导体光电结构及其制造方法。 半导体光电结构包括形成在半导体光电子结构的有源层下方的连续沟槽，以反射来自有源层的光，从而通过光输出表面引导更多的光，从而增加来自半导体光电子结构的光强度。

公开(公告)号：US20130263151A1

公开(公告)日：2013-10-03

申请号：US13438465

申请日：2012-04-03

Applicant: Jin Li ,  Cheng Huang ,  Sudipta Sengupta ,  Christopher Broder Wilson

Inventor： Jin Li ,  Cheng Huang ,  Sudipta Sengupta ,  Christopher Broder Wilson

IPC: G06F9/46

CPC classification number: G06F9/5083

Abstract: Described is a technology by which a consistent hashing table of bins maintains values representing nodes of a distributed system. An assignment stage uses a consistent hashing function and a selection algorithm to assign values that represent the nodes to the bins. In an independent mapping stage, a mapping mechanism deterministically maps an object identifier/key to one of the bins as a mapped-to bin.

Abstract translation: 描述了一种技术，通过该技术，一致的散列表的哈希表保持代表分布式系统的节点的值。 分配阶段使用一致的散列函数和选择算法来将表示节点的值分配给分组。 在独立的映射阶段，映射机制确定性地将对象标识符/密钥映射到一个存储区，作为映射到bin。

公开(公告)号：US08535976B2

公开(公告)日：2013-09-17

申请号：US10454972

申请日：2003-06-04

Applicant: Jin-Yuan Lee ,  Mou-Shiung Lin ,  Ching-Cheng Huang

Inventor： Jin-Yuan Lee ,  Mou-Shiung Lin ,  Ching-Cheng Huang

IPC: H01L21/44

CPC classification number: H01L24/82 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

Abstract: An integrated chip package structure and method of manufacturing the same is by adhering dies on a ceramic substrate and forming a thin-film circuit layer on top of the dies and the ceramic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

Abstract translation: 集成芯片封装结构及其制造方法是通过将模具附着在陶瓷基板上并在模具和陶瓷基板的顶部上形成薄膜电路层。 其中薄膜电路层具有电连接到模具的金属焊盘的外部电路，其延伸到模具的有效表面外部的区域，以扇出模具的金属焊盘。 此外，多个有源器件和内部电路位于管芯的有效表面上。 有源器件的信号通过内部电路传输到外部电路，并通过内部电路从外部电路传输回其他有源器件。 此外，芯片封装结构允许将具有不同功能的多个裸片封装在集成封装中并通过外部电路电连接裸片。

公开(公告)号：US20130238664A1

公开(公告)日：2013-09-12

申请号：US13415585

申请日：2012-03-08

Applicant: Yi-Chen Hsu ,  Wenwey Hseush ,  Shih-Chang Hsu ,  Yi-Cheng Huang ,  Michael Chih Huong Fong

Inventor： Yi-Chen Hsu ,  Wenwey Hseush ,  Shih-Chang Hsu ,  Yi-Cheng Huang ,  Michael Chih Huong Fong

IPC: G06F17/30

CPC classification number: G06F17/30592

Abstract: A large-scale data processing system, a large-scale data processing method, and a non-transitory tangible machine-readable medium are provided. The large-scale data processing system comprises an interface and a processor. The interface accesses a multi-dimensional data model, wherein the multi-dimensional data model comprises a plurality of dimensions, the dimensions form a multi-dimensional space of measures, each dimension is a single space comprising a plurality of members with a common set of attributes, and each measure is a data element organized and accessible through the multi-dimensional space of the cross-product of all dimensions. The processor builds at least one Tree Object (TO), wherein the TO is derived by converting the multi-dimensional data model into an N-level tree data structure according to a level order of N attributes, each tree node in the TO meets all conditions of attributes for all ancestor nodes, and N is a positive integer.

Abstract translation: 提供大规模数据处理系统，大规模数据处理方法和非暂时有形机器可读介质。 大规模数据处理系统包括接口和处理器。 所述界面访问多维数据模型，其中所述多维数据模型包括多个维度，所述维度形成度量的多维空间，每个维度是包括多个成员的单个空间，所述多个成员具有共同的 属性，并且每个度量是通过所有维度的交叉乘积的多维空间组织和访问的数据元素。 处理器构建至少一个树对象（TO），其中通过根据N个属性的级别顺序将多维数据模型转换为N级树数据结构来导出TO，TO中的每个树节点满足所有 所有祖先节点的属性条件，N是正整数。

公开(公告)号：US20130235389A1

公开(公告)日：2013-09-12

申请号：US13416229

申请日：2012-03-09

Applicant: Yi-Yuh Hwang ,  Chin-Der Hwang ,  Chih-Ming Liao ,  Ting-Wei Chiang ,  Wei-Guo Chang ,  Wen-Cheng Huang

Inventor： Yi-Yuh Hwang ,  Chin-Der Hwang ,  Chih-Ming Liao ,  Ting-Wei Chiang ,  Wei-Guo Chang ,  Wen-Cheng Huang

IPC: G01C21/00

CPC classification number: G01D5/34

Abstract: An actuating apparatus includes a motion driving module rigidly coupled to a platform, a working stage driven by the motion driving module to move relative to the platform, a speckle image capturing module rigidly coupled to the working stage and capable of capturing a speckle image of a sub-region of a reference region of the platform, and a control module operable in a positioning mode, where the control module obtains a current position of the working stage in a coordinate system associated with the platform based on a comparison between the captured speckle image and reference speckle image information that is associated with and unique to the reference region, and controls the motion driving module to drive the working stage toward a target position in the coordinate system based on a difference between the current position and the target position.

Abstract translation: 驱动装置包括刚性地联接到平台的运动驱动模块，由运动驱动模块驱动以相对于平台移动的工作台，刚性地耦合到工作台的散斑图像捕获模块，并能够捕获 所述平台的参考区域的子区域和可以定位模式操作的控制模块，其中所述控制模块基于所捕获的散斑图像之间的比较来获得与所述平台相关联的坐标系中的所述工作台的当前位置 以及参考斑点图像信息，其与参考区域相关联并且是唯一的，并且基于当前位置和目标位置之间的差异来控制运动驱动模块朝向坐标系中的目标位置驱动工作台。

公开(公告)号：US08520391B2

公开(公告)日：2013-08-27

申请号：US13112253

申请日：2011-05-20

Applicant: Huei-Nuan Huang ,  Pin-Cheng Huang ,  Chun-Hung Lu ,  Chun-Chieh Chao ,  Chi-Hsin Chiu

Inventor： Huei-Nuan Huang ,  Pin-Cheng Huang ,  Chun-Hung Lu ,  Chun-Chieh Chao ,  Chi-Hsin Chiu

IPC: H05K7/20

CPC classification number: H01L25/0657 ,  B82Y30/00 ,  H01L21/486 ,  H01L23/142 ,  H01L23/367 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/00014 ,  Y10T29/49139 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2224/05552

Abstract: An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.

Abstract translation: 公开了一种内层散热板和具有内层散热板的多芯片堆叠封装结构。 内层散热板包括形成有多个穿透导电通孔的金属板体，每个穿透导电通孔包括多个纳米线，以及具有填充有纳米线的纳米孔的氧化块。 多芯片堆叠封装结构包括分别设置在内层散热板上的第一芯片和电子部件，从而促进多芯片堆叠结构中的散热以及增加整体封装刚性。

公开(公告)号：US20130195142A1

公开(公告)日：2013-08-01

申请号：US13428549

申请日：2012-03-23

Applicant: Yung-Chow PENG ,  Ching-Ho CHANG ,  Jui-Cheng HUANG

Inventor： Yung-Chow PENG ,  Ching-Ho CHANG ,  Jui-Cheng HUANG

IPC: G01K7/01 ,  G01K7/00 ,  H02B1/00

CPC classification number: G01K7/01 ,  Y10T307/76

Abstract: A thermal sensing system includes a circuit having a layout including standard cells arranged in rows and columns. First and second current sources provide first and second currents, respectively. The thermal sensing system includes thermal sensing units, first and second switching modules, and an analog to digital converter (ADC). Each thermal sensing unit is configured to provide a voltage drop dependent on a temperature at that thermal sensing unit. The first switching module is configured to select one of the thermal sensing units. The second switching module includes at least one switch controllable by a control signal. The at least one switch is configured to selectively couple the thermal sensing units, based on the control signal, to one of the first and second current sources, via the first switching module. The ADC is configured to convert an analog voltage, provided by the selected thermal sensing unit, to a digital value.

Abstract translation: 热感测系统包括具有布置成行和列的标准单元的布局的电路。 第一和第二电流源分别提供第一和第二电流。 热感测系统包括热敏单元，第一和第二开关模块以及模数转换器（ADC）。 每个热敏单元被配置成提供取决于该热感测单元处的温度的电压降。 第一开关模块被配置为选择一个热感测单元。 第二开关模块包括可由控制信号控制的至少一个开关。 所述至少一个开关被配置为经由所述第一开关模块将所述热感测单元基于所述控制信号选择性地耦合到所述第一和第二电流源之一。 ADC配置为将所选热敏单元提供的模拟电压转换为数字值。