公开(公告)号：US09964719B1

公开(公告)日：2018-05-08

申请号：US15582370

申请日：2017-04-28

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Vipulkumar Patel ,  Matthew J. Traverso

IPC: G02B6/42 ,  G02B6/138 ,  G02B6/34 ,  H01L21/56 ,  H01L23/00 ,  H01L25/16 ,  H01L21/768 ,  H01L21/78 ,  H01L23/31 ,  H01L23/538

CPC classification number: G02B6/4255 ,  G02B6/138 ,  G02B6/34 ,  G02B6/428 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/03 ,  H01L25/167 ,  H01L2224/0231 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/16145

Abstract: The present disclosure discloses an assembly. The assembly includes a photonic chip and an electrical chip disposed side by side. The assembly also includes mold compound that encapsulates the photonic chip and the electrical chip. The assembly further includes a redistribution layer (RDL) that extends across the top surface of the photonic chip and the top surface of the electrical chip and connects the photonic chip with the electrical chip. Moreover, the photonic chip includes an exposed optical interface for transmitting optical signals between the photonic chip and an external optical device.

公开(公告)号：US09933566B2

公开(公告)日：2018-04-03

申请号：US15143944

申请日：2016-05-02

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Mark Webster ,  Ravi Tummidi ,  Mary Nadeau

IPC: G02B6/12 ,  G02B6/30 ,  G02B6/42 ,  G02B6/122

CPC classification number: G02B6/12004 ,  G02B6/12002 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/125 ,  G02B6/305 ,  G02B6/34 ,  G02B6/4206 ,  G02B6/4274 ,  G02B6/4291

Abstract: Embodiments herein describe a photonic chip which includes a coupling interface for evanescently coupling the chip to a waveguide on an external substrate. In one embodiment, the photonic chip includes a tapered waveguide that aligns with a tapered waveguide on the external substrate. The respective tapers of the two waveguides are inverted such that as the width of the waveguide in the photonic chip decreases, the width of the waveguide on the external substrate increases. In one embodiment, these two waveguides form an adiabatic structure where the optical signal transfers between the waveguides with minimal or no coupling of the optical signal to other non-intended modes. Using the two waveguides, optical signals can be transmitted between the photonic chip and the external substrate.

公开(公告)号：US09618699B2

公开(公告)日：2017-04-11

申请号：US14658220

申请日：2015-03-15

Applicant: Cisco Technology, Inc.

Inventor： Ravi Sekhar Tummidi ,  Mark Webster ,  Vipulkumar Patel

IPC: G02B6/12 ,  G02B6/30 ,  G02B6/10 ,  G02B6/122 ,  G02B6/136

CPC classification number: G02B6/30 ,  G02B6/107 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/121 ,  G02B2006/12142

Abstract: Embodiments herein describe disposing a waveguide adapter onto an SOI device after the components on a silicon surface layer have been formed. That is, the waveguide adapter is disposed above optical components (e.g., optical modulators, detectors, waveguides, etc) formed in a surface layer. In one embodiment, a waveguide in a bottom layer of the waveguide adapter overlaps a silicon waveguide in the surface layer such that the silicon waveguide and the waveguide in the bottom layer are optically coupled. The waveguide adapter also includes other layers above the bottom layer (e.g., middle and top layers) that also contain waveguides which form an adiabatic optical system for transmitting an optical signal. At least one of the waveguides in the multi-layer adapter is exposed at an optical interface of the SOI device, thereby permitting the SOI device to transmit optical signals to, or receive optical signals from, an external optical component.

公开(公告)号：US09575266B2

公开(公告)日：2017-02-21

申请号：US14687119

申请日：2015-04-15

Applicant: Cisco Technology, Inc.

Inventor： Kishor Desai ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

IPC: G02B6/12 ,  G02B6/42 ,  H01L33/52 ,  G02B6/43 ,  H01L23/04 ,  H01L23/48 ,  H01L25/16 ,  H01L31/0203 ,  G02B6/13 ,  H05K1/02 ,  H01L21/50

CPC classification number: G02B6/4255 ,  G02B6/12 ,  G02B6/13 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4292 ,  G02B6/43 ,  H01L21/50 ,  H01L23/04 ,  H01L23/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/52 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/165 ,  H01L2924/16788 ,  H05K1/0268 ,  H05K1/0274 ,  H05K2201/10121 ,  H01L2924/0105 ,  H01L2924/01079

Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

公开(公告)号：US09261652B2

公开(公告)日：2016-02-16

申请号：US13742483

申请日：2013-01-16

Applicant: Cisco Technology, Inc.

Inventor： John Fangman ,  Vipulkumar Patel ,  Ravinder Kachru

IPC: G02B6/42 ,  G02B6/36 ,  G02B6/32 ,  B32B37/12

CPC classification number: G02B6/36 ,  B32B37/1292 ,  G02B6/32 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/4244 ,  G02B6/4246

Abstract: An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.

Abstract translation: 光电设备包括用于支撑形成光电组件的多个部件的基板和用粘合剂材料（例如焊料或环氧树脂）附接到基板的光学部件。 光学部件被形成为包括平行地布置在光学部件的底表面的至少一部分上的多个接合槽，多个接合槽提供用于液体粘合剂材料的路径并且提高了使液体移位的能力 作为组分的粘合剂材料在附着过程中被压入基材的表面。

公开(公告)号：US09213152B2

公开(公告)日：2015-12-15

申请号：US13737029

申请日：2013-01-09

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/38

CPC classification number: G02B6/42 ,  G02B6/12 ,  G02B6/3886 ,  G02B6/4214 ,  G02B6/4259 ,  G02B6/4292 ,  Y10T29/49155

Abstract: An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.

Abstract translation: 一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。 外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。 磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。 这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。

公开(公告)号：US20150125110A1

公开(公告)日：2015-05-07

申请号：US14070962

申请日：2013-11-04

Applicant: Cisco Technology, Inc.

Inventor： Sean Philip Anderson ,  Vipulkumar Patel ,  David Piede

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/13

CPC classification number: G02B6/122 ,  G02B6/124 ,  G02B6/13 ,  G02B6/136 ,  G02B6/3897 ,  G02B6/4228 ,  G02B6/423 ,  G02B2006/12176 ,  Y10T29/49826

Abstract: An optical integrated circuit (IC) is provided that includes a waveguide to propagate light in the IC. A diffractive element, such as a grating, couples light between the waveguide and an external optical connector. At least one alignment feature is lithographically formed in the optical IC to facilitate precise positioning of the optical connector on the optical IC. Since the alignment feature is lithographically formed in a precise relation to the diffractive element, the optical connector can be accurately positioned and optically coupled to the optical IC. Complex optical-feedback-based alignment equipment and operations to achieve optical coupling of the optical connector with the waveguide in the optical IC are not necessary.

Abstract translation: 提供了一种包括在IC中传播光的波导的光学集成电路（IC）。 诸如光栅的衍射元件在波导和外部光学连接器之间耦合光。 在光学IC中光刻地形成至少一个对准特征以促进光学连接器在光学IC上的精确定位。 由于对准特征以与衍射元件精确关系的方式光刻形成，因此可以将光学连接器精确地定位并光学耦合到光学IC。 基于光学反馈的基于光学反馈的对准设备和光学连接器与光学IC中的波导的光耦合的操作是不必要的。

公开(公告)号：US20140003457A1

公开(公告)日：2014-01-02

申请号：US13687021

申请日：2012-11-28

Applicant: Cisco Technology, Inc

Inventor： Kalpendu Shastri ,  Soham Pathak ,  Vipulkumar Patel ,  Bipin Dama ,  Kishor Desai

IPC: H01S5/024

CPC classification number: H01S5/02415 ,  G02B6/42 ,  G02B6/4273 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/4025

Abstract: An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.

Abstract translation: 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。

公开(公告)号：US10996405B2

公开(公告)日：2021-05-04

申请号：US15946930

申请日：2018-04-06

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Kumar Satya Harinadh Potluri ,  Jock T. Bovington ,  Ashley J. Maker

IPC: G02B6/38 ,  G02B6/28 ,  G02B6/26 ,  H04B10/25 ,  B23K1/005 ,  B23K103/00

Abstract: Embodiments herein describe a fiber array unit (FAU) configured to optically couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into or completely through a non-transparent layer that overlap the epoxy disposed on the photonic chip. UV radiation can be emitted through the optical windows to cure the underlying epoxy. In one example, the windows can also be used for dispensing epoxy. In addition to the optical windows, the FAU can include alignment protrusions (e.g., frustums) which mate or interlock with respective alignment receivers in the photonic chip. Doing so may facilitate passive alignment of the optical fibers in the FAU to an optical interface in the photonic chip.

公开(公告)号：US10914892B2

公开(公告)日：2021-02-09

申请号：US16164695

申请日：2018-10-18

Applicant: Cisco Technology, Inc.

Inventor： Igal I. Bayn ,  Vipulkumar Patel ,  Prakash B. Gothoskar ,  Sean P. Anderson

IPC: G02B6/12 ,  H01L31/0232 ,  H01L31/105 ,  G02B6/122 ,  H01L31/028

Abstract: A photonic device can include an optical detector (e.g., a photodetector) coupled to silicon waveguides. Unlike silicon, germanium is an efficient detector at the wavelength of optical signals typically used for data communication. Instead of directly coupling the waveguide to the germanium, in one embodiment, the waveguide extends below the germanium but is spaced sufficiently away from the germanium so that the optical signal is not transferred. Instead, an optical transfer structure (e.g., a tapered waveguide or an optical grating) is disposed between the germanium and the waveguide. The waveguide first transfers the optical signal into the optical transfer structure which then transfers the optical signal into the germanium.