公开(公告)号：US20200212291A1

公开(公告)日：2020-07-02

申请号：US16236060

申请日：2018-12-28

Applicant: Intel Corporation

Inventor： Chia-Ching LIN ,  Sasikanth MANIPATRUNI ,  Tanay GOSAVI ,  Dmitri NIKONOV ,  Kaan OGUZ ,  Ian A. YOUNG

IPC: H01L43/02 ,  H01L43/10 ,  H01L43/12 ,  H01L27/22 ,  H01F10/32 ,  H01L27/11 ,  G11C11/16 ,  G11C11/14

Abstract: A memory device comprises an interconnect comprises a spin orbit coupling (SOC) material. A free magnetic layer is on the interconnect, a barrier material is over the free magnetic layer and a fixed magnetic layer is over the barrier material, wherein the free magnetic layer comprises an antiferromagnet. In another embodiment, memory device comprises a spin orbit coupling (SOC) interconnect and an antiferromagnet (AFM) free magnetic layer is on the interconnect. A ferromagnetic magnetic tunnel junction (MTJ) device is on the AFM free magnetic layer, wherein the ferromagnetic MTJ comprises a free magnet layer, a fixed magnet layer, and a barrier material between the free magnet layer and the fixed magnet layer.

公开(公告)号：US20200212224A1

公开(公告)日：2020-07-02

申请号：US16232615

申请日：2018-12-26

Applicant: Intel Corporation

Inventor： Ashish Verma PENUMATCHA ,  Tanay GOSAVI ,  Uygar AVCI ,  Ian A. YOUNG

IPC: H01L29/78 ,  H01L29/51 ,  H01L29/66 ,  H01L29/417 ,  H01L21/28 ,  G11C11/22

Abstract: Embodiments herein describe techniques for a semiconductor device including a gate stack with a ferroelectric-oxide layer above a channel layer and in contact with the channel layer, and a top electrode above the ferroelectric-oxide layer. The ferroelectric-oxide layer includes a domain wall between an area under a nucleation point of the top electrode and above a separation line of the channel layer between an ON state portion and an OFF state portion of the channel layer. A resistance between a source electrode and a drain electrode is modulated in a range between a first resistance value and a second resistance value, dependent on a position of the domain wall within the ferroelectric-oxide layer, a position of the ON state portion of the channel layer, and a position of the OFF state portion of the channel layer. Other embodiments may be described and/or claimed.

公开(公告)号：US20200118616A1

公开(公告)日：2020-04-16

申请号：US16732951

申请日：2020-01-02

Applicant: Intel Corporation

Inventor： Daniel H. MORRIS ,  Uygar E. AVCI ,  Ian A. YOUNG

IPC: G11C11/412 ,  H01L27/11 ,  G11C11/419 ,  G11C8/16

Abstract: One embodiment provides an apparatus. The apparatus includes a first inverter comprising a first pull up transistor and a first pull down transistor; a second inverter cross coupled to the first inverter, the second inverter comprising a second pull up transistor and a second pull down transistor; a first access transistor coupled to the first inverter; and a second access transistor coupled to the second inverter. A gate electrode of one transistor of each inverter comprises a polarization layer.

公开(公告)号：US20190243662A1

公开(公告)日：2019-08-08

申请号：US16384715

申请日：2019-04-15

Applicant: Intel Corporation

Inventor： Vaidyanathan KAUSHIK ,  Daniel H. MORRIS ,  Uygar E. AVCI ,  Ian A. YOUNG ,  Tanay KARNIK ,  Huichi LIU

IPC: G06F9/445 ,  G06F1/26 ,  H03K19/0185

CPC classification number: G06F9/445 ,  G06F1/26 ,  G06F1/324 ,  G06F1/3296 ,  G06F9/4411 ,  H03K19/018585

Abstract: Described is an apparatus which comprises: a first electrical path comprising at least one driver and receiver; and a second electrical path comprising at least one driver and receiver, wherein the first and second electrical paths are to receive a same input signal, wherein the first electrical path and the second electrical path are parallel to one another and have substantially the same propagation delays, and wherein the second electrical path is enabled during a first operation mode and disabled during a second operation mode.

公开(公告)号：US20190102170A1

公开(公告)日：2019-04-04

申请号：US16146430

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Gregory K. CHEN ,  Raghavan KUMAR ,  Huseyin Ekin SUMBUL ,  Phil KNAG ,  Ram KRISHNAMURTHY ,  Sasikanth MANIPATRUNI ,  Amrita MATHURIYA ,  Abhishek SHARMA ,  Ian A. YOUNG

IPC: G06F9/30 ,  G06F9/38 ,  G11C11/419 ,  G11C13/00

Abstract: A compute-in-memory (CIM) circuit that enables a multiply-accumulate (MAC) operation based on a current-sensing readout technique. An operational amplifier coupled with a bitline of a column of bitcells included in a memory array of the CIM circuit to cause the bitcells to act like ideal current sources for use in determining an analog voltage value outputted from the operational amplifier for given states stored in the bitcells and for given input activations for the bitcells. The analog voltage value sensed by processing circuitry of the CIM circuit and converted to a digital value to compute a multiply-accumulate (MAC) value.

公开(公告)号：US20190042160A1

公开(公告)日：2019-02-07

申请号：US16147024

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Raghavan KUMAR ,  Phil KNAG ,  Gregory K. CHEN ,  Huseyin Ekin SUMBUL ,  Sasikanth MANIPATRUNI ,  Amrita MATHURIYA ,  Abhishek SHARMA ,  Ram KRISHNAMURTHY ,  Ian A. YOUNG

IPC: G06F3/06 ,  G04F10/00 ,  G11C11/419 ,  G11C13/00 ,  G11C11/418

Abstract: A memory circuit has compute-in-memory (CIM) circuitry that performs computations based on time-to-digital conversion (TDC). The memory circuit includes an array of memory cells addressable with column address and row address. The memory circuit includes CIM sense circuitry to sense a voltage for multiple memory cells triggered together. The CIM sense circuitry including a TDC circuit to convert a time for discharge of the multiple memory cells to a digital value. A processing circuit determines a value of the multiple memory cells based on the digital value.

公开(公告)号：US20180151578A1

公开(公告)日：2018-05-31

申请号：US15576269

申请日：2015-06-26

Applicant: INTEL CORPORATION

Inventor： Uygar E. AVCI ,  Daniel H. MORRIS ,  Ian A. YOUNG ,  Stephen M. RAMEY

IPC: H01L27/11521 ,  H01L29/788 ,  H01L29/78 ,  H01L27/11526 ,  H01L27/02 ,  H01L29/49 ,  H01L21/28 ,  H01L29/66 ,  G11C16/04 ,  G11C16/10 ,  G11C16/26 ,  G11C16/14

CPC classification number: H01L27/11521 ,  G11C16/0408 ,  G11C16/0433 ,  G11C16/10 ,  G11C16/14 ,  G11C16/26 ,  H01L21/28079 ,  H01L21/28088 ,  H01L21/28273 ,  H01L21/76224 ,  H01L27/0207 ,  H01L27/0886 ,  H01L27/11519 ,  H01L27/11526 ,  H01L27/11558 ,  H01L29/0649 ,  H01L29/4916 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/66795 ,  H01L29/66825 ,  H01L29/78 ,  H01L29/7851 ,  H01L29/788 ,  H01L29/7881

Abstract: Embodiments of the present disclosure provide techniques and configurations for semi-volatile embedded memory with between-fin floating gates. In one embodiment, an apparatus includes a semiconductor substrate and a floating-gate memory structure formed on the semiconductor substrate including a bitcell having first, second, and third fin structures extending from the substrate, an oxide layer disposed between the first and second fin structures and between the second and third fin structures, a gate of a first transistor disposed on the oxide layer and coupled with and extending over a top of the first fin structure, and a floating gate of a second transistor disposed on the oxide layer between the second and third fin structures. Other embodiments may be described and/or claimed.

公开(公告)号：US20170148903A1

公开(公告)日：2017-05-25

申请号：US15427968

申请日：2017-02-08

Applicant: Intel Corporation

Inventor： Sasikanth MANIPATRUNI ,  Dmitri E. NIKONOV ,  Ian A. YOUNG

IPC: H01L29/66 ,  H01L27/22 ,  H01L43/10 ,  H01L43/12 ,  G11C11/16 ,  H01L43/08

CPC classification number: H01L29/66984 ,  G11C11/16 ,  G11C11/161 ,  G11C11/1653 ,  G11C11/1659 ,  G11C11/1673 ,  G11C11/1675 ,  G11C11/1697 ,  H01L27/226 ,  H01L43/08 ,  H01L43/10 ,  H01L43/12 ,  H03K19/16

Abstract: Described is an apparatus, for spin state element device, which comprises: a variable resistive magnetic (VRM) device to receive a magnetic control signal to adjust resistance of the VRM device; and a magnetic logic gating (MLG) device, coupled to the VRM device, to receive a magnetic logic input and perform logic operation on the magnetic logic input and to drive an output magnetic signal based on the resistance of the VRM device. Described is a magnetic de-multiplexer which comprises: a first VRM device to receive a magnetic control signal to adjust resistance of the first VRM; a second VRM device to receive the magnetic control signal to adjust resistance of the second VRM device; and an MLG device, coupled to the first and second VRM devices, the MLG device having at least two output magnets to output magnetic signals based on the resistances of the first and second VRM devices.

公开(公告)号：US20150228323A1

公开(公告)日：2015-08-13

申请号：US14696965

申请日：2015-04-27

Applicant: Intel Corporation

Inventor： Sasikanth MANIPATRUNI ,  Dmitri E. NIKONOV ,  Ian A. YOUNG

IPC: G11C11/16

CPC classification number: H01L29/66984 ,  G11C11/16 ,  G11C11/161 ,  G11C11/1653 ,  G11C11/1659 ,  G11C11/1673 ,  G11C11/1675 ,  G11C11/1697 ,  H01L27/226 ,  H01L43/08 ,  H01L43/10 ,  H01L43/12 ,  H03K19/16

Abstract: Described is an apparatus, for spin state element device, which comprises: a variable resistive magnetic (VRM) device to receive a magnetic control signal to adjust resistance of the VRM device; and a magnetic logic gating (MLG) device, coupled to the VRM device, to receive a magnetic logic input and perform logic operation on the magnetic logic input and to drive an output magnetic signal based on the resistance of the VRM device. Described is a magnetic de-multiplexer which comprises: a first VRM device to receive a magnetic control signal to adjust resistance of the first VRM; a second VRM device to receive the magnetic control signal to adjust resistance of the second VRM device; and an MLG device, coupled to the first and second VRM devices, the MLG device having at least two output magnets to output magnetic signals based on the resistances of the first and second VRM devices.

Abstract translation: 描述了一种用于自旋状态元件器件的装置，其包括：可变电阻磁极（VRM）器件，用于接收磁控制信号以调节VRM器件的电阻; 以及耦合到VRM装置的磁逻辑门控（MLG）装置，以接收磁逻辑输入并对磁逻辑输入执行逻辑运算，并且基于VRM装置的电阻来驱动输出磁信号。 描述的磁解除多路复用器包括：第一VRM装置，用于接收磁控制信号以调整第一VRM的电阻; 第二VRM装置，用于接收所述磁控信号以调整所述第二VRM装置的电阻; 以及耦合到第一和第二VRM装置的MLG装置，MLG装置具有至少两个输出磁体，以基于第一和第二VRM装置的电阻输出磁信号。

公开(公告)号：US20230411443A1

公开(公告)日：2023-12-21

申请号：US18129258

申请日：2023-03-31

Applicant: Intel Corporation

Inventor： Kaan OGUZ ,  Chia-Ching LIN ,  Arnab SEN GUPTA ,  I-Cheng TUNG ,  Sou-Chi CHANG ,  Sudarat LEE ,  Matthew V. METZ ,  Uygar E. AVCI ,  Scott B. CLENDENNING ,  Ian A. YOUNG

IPC: H01L21/02 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L28/56 ,  H01L28/92 ,  H01L28/91 ,  H01L28/75 ,  H01L23/5223 ,  H01L23/5226 ,  H01L24/32 ,  H01L28/65 ,  H01L2224/32225 ,  H01L24/73 ,  H01L2224/16227 ,  H01L24/16 ,  H01L2224/73204

Abstract: Metal insulator metal capacitors are described. In an example, a metal-insulator-metal (MIM) capacitor includes a first electrode. An insulator is over the first electrode. The insulator includes a first layer, and a second layer over the first layer. The first layer has a leakage current that is less than a leakage current of the second layer. The second layer has a dielectric constant that is greater than a dielectric constant of the first layer. A second electrode is over the insulator.