公开(公告)号：US07199450B2

公开(公告)日：2007-04-03

申请号：US10908480

申请日：2005-05-13

申请人： Jon A. Casey ,  Michael Berger ,  Leena P. Buchwalter ,  Donald F. Canaperi ,  Raymond R. Horton ,  Anurag Jain ,  Eric D. Perfecto ,  James A. Tornello

发明人： Jon A. Casey ,  Michael Berger ,  Leena P. Buchwalter ,  Donald F. Canaperi ,  Raymond R. Horton ,  Anurag Jain ,  Eric D. Perfecto ,  James A. Tornello

IPC分类号： H01L29/06 ,  H01L23/58

CPC分类号： H01L23/147 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.

摘要翻译： 使用无粘性，低粘度，高温稳定的聚合物或低粘度的高固含量聚合物溶液密封通孔，其中聚合物材料在高温下浸渍在通孔内。 引入供应室以在升高的温度下施用聚合物材料，通常在高至足以液化聚合物材料的温度下。 聚合物材料通过来自泵，活塞或保持在所述供应室内的真空的力的加热供应管线引入。

公开(公告)号：US06156091A

公开(公告)日：2000-12-05

申请号：US378624

申请日：1999-08-20

申请人： Jon A. Casey

发明人： Jon A. Casey

IPC分类号： B22F3/10 ,  B22F3/11 ,  C04B35/638 ,  C04B35/64 ,  C04B38/06 ,  B29C65/00

CPC分类号： B22F3/1021 ,  B22F3/1121 ,  C04B35/638 ,  C04B35/64 ,  C04B38/06 ,  C04B38/068 ,  C04B2111/00267 ,  C04B2111/00482 ,  C04B2111/00793

摘要： A ceramic contact sheet and setter tile with controlled porosity is introduced, along with the method for making the same. The amount of porosity is controlled by the volume percentage, particle size, and particle shape of a fugitive phase which can be added to the original refractory material slurry used to fabricate setter tiles and contact sheets. The fugitive phase can be used independently to introduce porosity in setter tiles and contact sheets or in conjunction with partial densification. Since porosity is not solely dependent upon partial sintering, higher porosity levels can be achieved with less impact on subsequent mechanical properties of the resultant refractory material.

公开(公告)号：US5866470A

公开(公告)日：1999-02-02

申请号：US727109

申请日：1996-10-08

申请人： Jon A. Casey ,  Michael A. Cohn ,  John J. Garant ,  Abubaker S. Shagan ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

发明人： Jon A. Casey ,  Michael A. Cohn ,  John J. Garant ,  Abubaker S. Shagan ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

IPC分类号： H01G4/30 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H01L21/30 ,  H01L21/46

CPC分类号： H01G4/30 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/49894 ,  H05K3/0097 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1536 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S156/925 ,  Y10T156/1163 ,  Y10T156/1911

摘要： A process for making multiple microelectronic ceramic substrates uses an interface layer between stacked layers of green sheets that are laminated with the interface layer, then fired to produce the ceramic substrates. The interface layer acts to protect the substrates, and to hold them together before firing, then thermally degrades at a desired point in the firing cycle to separate the individual substrates. The invention also includes the ceramic substrates produced by the method.

摘要翻译： 制造多个微电子陶瓷基板的方法使用与界面层层叠的生片层叠层之间的界面层，然后烧制以制造陶瓷基板。 界面层用于保护基底，并在烧制之前将它们保持在一起，然后在烧制循环中的所需点处热分解以分离各个基底。 本发明还包括通过该方法制造的陶瓷基板。

公开(公告)号：US5552232A

公开(公告)日：1996-09-03

申请号：US361351

申请日：1994-12-21

申请人： Jon A. Casey ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Jonathan H. Harris ,  Lester W. Herron ,  Gregory M. Johnson ,  Niranjan M. Patel ,  Andrew M. Reitter ,  Subhash L. Shinde ,  Rao V. Vallabhaneni ,  Robert A. Youngman

发明人： Jon A. Casey ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Jonathan H. Harris ,  Lester W. Herron ,  Gregory M. Johnson ,  Niranjan M. Patel ,  Andrew M. Reitter ,  Subhash L. Shinde ,  Rao V. Vallabhaneni ,  Robert A. Youngman

IPC分类号： B32B18/00 ,  B22F7/02 ,  C04B35/581 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B22F3/00

CPC分类号： C04B41/009 ,  B22F7/02 ,  C04B41/5133 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3731 ,  H05K3/4061 ,  B22F2998/00 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/035 ,  H05K2201/09981 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/12021 ,  Y10T428/12028 ,  Y10T428/12056 ,  Y10T428/31678

摘要： Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.

公开(公告)号：US5304517A

公开(公告)日：1994-04-19

申请号：US11577

申请日：1993-02-01

申请人： Jon A. Casey ,  Sylvia M. DeCarr ,  Srinivasa S. N. Reddy ,  Subhash L. Shinde ,  Vivek M. Sura ,  Rao R. Tummala

发明人： Jon A. Casey ,  Sylvia M. DeCarr ,  Srinivasa S. N. Reddy ,  Subhash L. Shinde ,  Vivek M. Sura ,  Rao R. Tummala

IPC分类号： C03C14/00 ,  C04B35/195 ,  H01L23/08 ,  C03C8/18

CPC分类号： C03C14/004 ,  C03C2214/08 ,  C03C2214/20

摘要： A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of:______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--Al Nb--Al Ni--Cr Cu--Al Ni--Al Cu--Al--Cr Fe--Al ______________________________________ The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000.degree. C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.

摘要翻译： 使用包含合金粉末或选自由以下组成的合金的薄片的玻璃 - 陶瓷浆料来描述烧结工艺：-Fe-CrCu-Ti-Fe-Cr-NiAg-Ti-Cr-AlNb-Al-Ni-CrCu -Al-Ni-AlCu-Al-Cr-Fe-Al-该浆料被模制，随后在约1000℃的温度下在蒸汽气氛中烧结，以产生增韧的抗裂纹扩展的玻璃陶瓷基体，并且可用于 半导体器件芯片的封装。

公开(公告)号：US4987211A

公开(公告)日：1991-01-22

申请号：US423505

申请日：1989-10-13

申请人： Constance J. Araps ,  Jon A. Casey ,  Renuka S. Divakaruni ,  Steven M. Kandetzke ,  Chatherine A. Lotsko

发明人： Constance J. Araps ,  Jon A. Casey ,  Renuka S. Divakaruni ,  Steven M. Kandetzke ,  Chatherine A. Lotsko

IPC分类号： C04B41/48 ,  C04B41/51 ,  C04B41/83 ,  C04B41/88 ,  C08F2/38 ,  C08F8/50 ,  G03F7/039

CPC分类号： C04B41/48 ,  C04B41/51 ,  C04B41/83 ,  C04B41/88 ,  C08F2/38 ,  C08F8/50 ,  G03F7/039

摘要： Phenyl-endcapped depolymerizable polymers are disclosed. The phenyl endcap eliminates the reactive terminal vinyl group resulting in increased depolymerization threshold temperatures and reduced residue after depolymerization. A multilevel metal lift-off process using the phenyl-endcapped polymers is disclosed. Additionally, the polymers are improved ceramic glass binder resins.

摘要翻译： 公开了苯基封端的可解聚聚合物。 苯基端帽消除反应性末端乙烯基，导致解聚阈值温度升高，解聚后残留物减少。 公开了使用苯基封端的聚合物的多层金属剥离方法。 此外，聚合物是改进的陶瓷玻璃粘合剂树脂。

公开(公告)号：US07917328B2

公开(公告)日：2011-03-29

申请号：US12194606

申请日：2008-08-20

申请人： Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcom S. Ware ,  Roger D. Weekly

发明人： Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcom S. Ware ,  Roger D. Weekly

IPC分类号： G06F19/00

CPC分类号： G06F11/3058

摘要： Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.

摘要翻译： 提供了组装过程中组装体验的温度偏移。 确定组件是否已经超出预定寿命目标的使用。 响应于组装不能超过预定寿命目标的服务，读取与组件相关联的新的温度值。 计算品质因数（FOM）值的修饰符值，并将其添加到累积品质因数值。 将累积的绩效值与累积压力的绩效预算进行比较。 响应累积绩效值超过累积压力的绩效预算数量，实施了一个确定的压力管理解决方案。

公开(公告)号：US07449067B2

公开(公告)日：2008-11-11

申请号：US10700327

申请日：2003-11-03

申请人： Paul S. Andry ,  Jon A. Casey ,  Raymond R. Horton ,  Chiraq S. Patel ,  Edmund J. Sprogis ,  Brian R. Sundlof

发明人： Paul S. Andry ,  Jon A. Casey ,  Raymond R. Horton ,  Chiraq S. Patel ,  Edmund J. Sprogis ,  Brian R. Sundlof

IPC分类号： B05C1/00 ,  B05C3/00 ,  B05C3/18

CPC分类号： H01L21/486 ,  H01L23/147 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00

摘要： A method for filling vias, and in particular initially blind vias, in a wafer, and various apparatus for performing the method, comprising evacuating air from the vias; trapping at least a portion of the wafer and a paste for filling the vias between two surfaces; and pressurizing the paste to fill the vias.

摘要翻译： 一种用于在晶片中填充通孔，特别是初始盲孔的方法，以及用于执行该方法的各种装置，包括从通孔排出空气; 捕获晶片的至少一部分和用于在两个表面之间填充通孔的糊状物; 并对该糊状物加压以填充通孔。

公开(公告)号：US07288474B2

公开(公告)日：2007-10-30

申请号：US11544220

申请日：2006-10-10

申请人： Jon A. Casey ,  Brian R. Sundlof

发明人： Jon A. Casey ,  Brian R. Sundlof

IPC分类号： H01L21/4763

CPC分类号： H05K3/4061 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/068 ,  H01L2924/00012 ,  H01L2924/00

摘要： A metallization process and material system for metallizing either blind or through vias in silicon, involving forming a low coefficient of thermal expansion composite or suspension, relative to pure metals, such as copper, silver, or gold, and filling the via holes in the silicon with the paste or suspension. The suspensions sinter with minimal bulk shrinkage, forming highly conductive structures without the formation of macroscopic voids. The selected suspension maintains a coefficient of thermal expansion closer to that of silicon.

摘要翻译： 一种金属化工艺和材料系统，用于在硅中金属化盲孔或通孔，涉及相对于纯金属（例如铜，银或金）形成低热膨胀复合材料或悬浮系数，并填充硅中的通孔 用糊或悬浮液。 悬浮液以最小的体积收缩率烧结，形成高导电性结构，而不形成宏观空隙。 所选择的悬架保持更接近于硅的热膨胀系数。

公开(公告)号：US5800761A

公开(公告)日：1998-09-01

申请号：US727097

申请日：1996-10-08

申请人： Jon A. Casey ,  Michael A. Cohn ,  Michael E. Cropp ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

发明人： Jon A. Casey ,  Michael A. Cohn ,  Michael E. Cropp ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

IPC分类号： B29C33/68 ,  B29C37/00 ,  H01L21/48 ,  H01L21/68 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  B29D7/01

CPC分类号： H01L21/6836 ,  B29C33/68 ,  B29C37/0067 ,  H01L21/4807 ,  H01L23/49894 ,  H05K3/0097 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1536 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T428/25 ,  Y10T428/30 ,  Y10T428/31855 ,  Y10T428/31942

摘要： An interface layer for separating first and second microelectronic ceramic substrates during firing includes a thermally degradable binder, preferably a polymer, that degrades at temperatures above room temperature and below a firing temperature for the microelectronic ceramic substrates, and a separating material, such as boron nitride or graphite. The method of making the interface layer includes mixing the binder, one or more solvents for the binder, a plasticizer and the separating material for a sufficient period of time to form a homogeneous mass, then casting the material in a thin sheet to form the interface layer.

摘要翻译： 用于在焙烧期间分离第一和第二微电子陶瓷衬底的界面层包括可降解的粘合剂，优选聚合物，其在高于室温且低于微电子陶瓷衬底的烧制温度的温度下降解;以及分离材料，例如氮化硼 或石墨。 制造界面层的方法包括将粘合剂，用于粘合剂的一种或多种溶剂，增塑剂和分离材料混合足够长的时间以形成均匀的质量，然后将该材料浇铸成薄片以形成界面 层。