公开(公告)号：US07338854B2

公开(公告)日：2008-03-04

申请号：US11002183

申请日：2004-12-03

申请人： Ho Sung Choo ,  Seung Hyun Ra ,  Yong Suk Kim ,  Jung Woo Lee ,  Hyo Soon Shin ,  Hyoung Ho Kim

发明人： Ho Sung Choo ,  Seung Hyun Ra ,  Yong Suk Kim ,  Jung Woo Lee ,  Hyo Soon Shin ,  Hyoung Ho Kim

IPC分类号： H01L21/8242

CPC分类号： H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  Y10T29/417

摘要： A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.

摘要翻译： 一种制造多层陶瓷电容器的方法，其中印刷在多个电介质片材的每一个上的内部电极使用吸收构件具有减小的厚度，从而允许多层陶瓷电容器具有高容量并且被最小化。 该方法包括在每个电介质片上印刷内部电极，并叠放电介质片，其中形成在每个电介质片上的内部电极通过使吸收构件接触每个电介质片的表面而具有减小的厚度 设置有内部电极，然后将吸收构件从表面分离，使得部分具有指定厚度的内部电极被去除，并且设置有具有减小的厚度的内部电极的电介质层被堆叠以形成芯片元件。

公开(公告)号：US06525406B1

公开(公告)日：2003-02-25

申请号：US09687049

申请日：2000-10-13

申请人： Young Suk Chung ,  Sung Sik Jang ,  Jae Jin Lee ,  Tae Heon Lee ,  Hyung Ju Lee ,  Jung Woo Lee ,  Mu Hwan Seo ,  Jae Hak Yee ,  Ku Sun Hong

发明人： Young Suk Chung ,  Sung Sik Jang ,  Jae Jin Lee ,  Tae Heon Lee ,  Hyung Ju Lee ,  Jung Woo Lee ,  Mu Hwan Seo ,  Jae Hak Yee ,  Ku Sun Hong

IPC分类号： H01L23495

CPC分类号： H01L23/544 ,  H01L21/4842 ,  H01L23/3114 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface of the die pad is half-etched to increase the moisture-permeation path of the finished package. A plurality of rectangular leads extends from the leadframe toward the die pad without contacting the die pad. A silver-plating layer may be formed on the upper surface of the leadframe. A semiconductor chip is mounted on the upper surface of the die pad in the leadframe. After deflashing, the package is treated with a sulfuric (H2SO4)-based solution to restore the internal leads to their original color. Prior to singulation, the externally exposed bottom surfaces of the leads are plated with copper, gold, solder, tin, nickel, palladium, or an alloy thereof to form a predetermined thickness of a plating layer. The singulation step comprises forming a burr at a peripheral side surface of the leads in the upward direction. The finished package may be marked with a recognition mark to enable a user to more easily identify the first lead.

摘要翻译： 公开了一种半导体封装及其制造方法。 平面或基本上平面的管芯焊盘设置在引线框架内，并且通过多个连接条连接到引线框架。 芯片焊盘的上表面和下表面的周边被半蚀刻以增加成品封装的透湿路径。 多个矩形引线从引线框架朝向管芯焊盘延伸，而不接触管芯焊盘。 可以在引线框架的上表面上形成镀银层。 半导体芯片安装在引线框架中的管芯焊盘的上表面上。 在消融后，将包装用硫酸（H 2 SO 4）的溶液处理，以将内部引线恢复到其原始颜色。 在分割之前，引线的外露的底表面镀有铜，金，焊料，锡，镍，钯或其合金，以形成预定厚度的镀层。 分割步骤包括在引线的周向侧表面沿向上方向形成毛刺。 完成的包装可以标记有识别标记，以使用户能够更容易地识别第一个引线。

公开(公告)号：US09145900B2

公开(公告)日：2015-09-29

申请号：US13308806

申请日：2011-12-01

申请人： Jung Hoon Kim ,  Dong Soo Moon ,  Jung Woo Lee ,  Mi Jin Jung

发明人： Jung Hoon Kim ,  Dong Soo Moon ,  Jung Woo Lee ,  Mi Jin Jung

IPC分类号： F04D29/42 ,  F04D29/44

CPC分类号： F04D29/441 ,  F04D29/4226 ,  F04D29/4233

摘要： Provided is an air blower for an air conditioner. The air blower for the air conditioner includes a centrifugal fan and a fan housing. The fan housing covers the centrifugal fan, and forms a scroll-type flow path having a varying cross-sectional area and guiding air forcibly blown by the centrifugal fan to an outlet. Here, a bottom surface of the scroll-type flow path inclines and is thinnest near a region where the scroll-type flow path ends. The thickness of the bottom surface progressively increases along a straight line running from a region where the bottom surface is thinnest to an opposite outer side of the scroll-type flow path through a center of the centrifugal fan.

摘要翻译： 提供一种用于空调的鼓风机。 用于空调的鼓风机包括离心式风扇和风扇外壳。 风扇壳体覆盖离心风扇，并形成具有变化的横截面积的涡旋式流路，并且将由离心风扇强制吹送的空气引导到出口。 这里，涡旋型流路的底面在涡旋型流路结束的区域附近倾斜而最薄。 底面的厚度沿着从底面最薄的区域通过离心式风扇的中心向涡旋型流路的相反的外侧沿着直线逐渐增加。

公开(公告)号：US20150251255A1

公开(公告)日：2015-09-10

申请号：US14362910

申请日：2012-10-25

申请人： Jung Woo Lee ,  Taeg Won Lee ,  Byung Sun Choi ,  Dong Ryong Ji ,  Dong Bok Park

发明人： Jung Woo Lee ,  Taeg Won Lee ,  Byung Sun Choi ,  Dong Ryong Ji ,  Dong Bok Park

IPC分类号： B23C5/22 ,  B23C5/02

CPC分类号： B23C5/22 ,  B23C5/02 ,  B23C5/08 ,  B23C5/2221 ,  B23C2200/0455 ,  B23C2200/128 ,  B23C2200/165 ,  B23C2200/367 ,  B23C2210/168 ,  B23C2210/325 ,  Y10T407/1936 ,  Y10T407/1942

摘要： The present invention relates to an insert for slot milling, and more specifically, to an insert for slot milling which can smoothly form a front end surface of a concave portion of a slot formed at a cutting target, and provides a safe use thereof by preventing the erroneous installation of cutting inserts coupled with insert-installation seats on both sides of a milling cutter body to prevent damage of the cutting inserts and the milling cutter. To this end, the present invention is characterized in that the plurality of cutting inserts are provided around the slot milling cutter body, one of two cutting inserts protrudes with respect to one side of the milling cutter body and the other protrudes with respect to the opposite side of the milling cutter body, and two cutting inserts are formed with different structures to prevent the erroneous installation thereof on the insert-installation seats prepared on both sides of the milling cutter body.

摘要翻译： 本发明涉及一种用于槽铣的刀片，更具体地说，涉及一种用于槽铣的刀片，其可以平滑地形成形成在切割靶上的槽的凹部的前端面，并且通过防止 在铣刀主体的两侧错误地安装切削刀片与刀片安装座相结合以防止切削刀片和铣刀的损坏。 为此，本发明的特征在于，多个切削刀片设置在槽铣刀主体周围，两个切削刀片中的一个相对于铣刀主体的一侧突出，而另一个切削刀片相对于相对的铣刀主体突出 并且两个切削刀片形成有不同的结构，以防止错误地安装在铣刀主体两侧准备的刀片安装座上。

公开(公告)号：US20120268660A1

公开(公告)日：2012-10-25

申请号：US12524986

申请日：2008-07-23

申请人： Jung Woo Lee

发明人： Jung Woo Lee

IPC分类号： H04N5/44

CPC分类号： G08C17/02 ,  G08C23/04 ,  G08C2201/94 ,  H04N5/4403 ,  H04N21/4184 ,  H04N21/42206 ,  H04N21/43637 ,  H04N21/4382

摘要： A remote controller (100) and a system and method for remotely controlling a digital TV are disclosed. A memory card (110) is mounted in the remote controller (100), and the remote controller (100) receives video or audio data inputted from the memory card (110) and transmits the received data to a TV body (300). The remote controller (100) receives the video or audio data from the memory card (110) modulates the received data into a wireless signal and transmits the modulated wireless signal, and the TV body (300) receives the wireless signal transmitted from the remote controller (100), demodulates the received wireless signal into the video or audio data and reproduces the demodulated video or audio data. Therefore, the user can remotely control the TV body (300) without personally inserting the memory card (110) into the TV body (300). As a result, the user does not need to move to a place where the TV body (300) is located resulting in convenience in use.

摘要翻译： 公开了遥控器（100）以及远程控制数字电视的系统和方法。 存储卡（110）安装在遥控器（100）中，遥控器（100）接收从存储卡（110）输入的视频或音频数据，并将接收到的数据发送到电视机身（300）。 遥控器（100）从存储卡（110）接收视频或音频数据，将接收的数据调制成无线信号，并发送调制的无线信号，并且电视机体（300）接收从遥控器发送的无线信号 （100），将接收到的无线信号解调为视频或音频数据，并再现解调的视频或音频数据。 因此，用户无需将存储卡（110）插入电视机体（300）即可远程控制电视机身（300）。 结果，用户不需要移动到电视机身（300）所在的地方，从而方便使用。

公开(公告)号：US08088356B2

公开(公告)日：2012-01-03

申请号：US11987953

申请日：2007-12-06

申请人： Jeung Ku Kang ,  Yoon Jeong Choi ,  Jung Woo Lee ,  Jung Hoon Choi

发明人： Jeung Ku Kang ,  Yoon Jeong Choi ,  Jung Woo Lee ,  Jung Hoon Choi

IPC分类号： B01J20/00 ,  C07F5/02

CPC分类号： C01B3/0015 ,  B01J20/226 ,  Y02E60/327 ,  Y02E60/328 ,  Y10S502/526

摘要： Disclosed are a novel hydrogen storage material with enhanced hydrogen storage capacity prepared by doping an organic framework material with light metal cations, and a method of using the same for hydrogen storage. The present inventive material has at least one phenyl group at each face of a triangular building unit, which is doped with metal cations such as alkali metal cations, alkali-earth metal cations, etc., so that the material exhibits greatly improved capacity of hydrogen absorption and desorption at room temperature and can provide hydrogen storage materials practically adapted for fuel batteries useable even at room temperature.

摘要翻译： 公开了一种具有通过用轻金属阳离子掺杂有机骨架材料制备的具有增强的储氢能力的新型储氢材料，以及将其用于储氢的方法。 本发明的材料在三角形建筑单元的每个面上具有至少一个苯基，其被掺杂有金属阳离子如碱金属阳离子，碱土金属阳离子等，使得该材料显示出大大提高的氢容量 在室温下吸收和解吸，并且可以提供实际适用于甚至在室温下可用的燃料电池的储氢材料。

公开(公告)号：US07923443B2

公开(公告)日：2011-04-12

申请号：US11631828

申请日：2005-07-05

申请人： Jei Man Ryu ,  Jin Soo Lee ,  Sae Kwang Ku ,  Jung Woo Lee ,  Hee Bog Yang

发明人： Jei Man Ryu ,  Jin Soo Lee ,  Sae Kwang Ku ,  Jung Woo Lee ,  Hee Bog Yang

IPC分类号： A01N43/00 ,  A61K31/33

CPC分类号： A61K31/426

摘要： Disclosed herein is a composition for the treatment bone fracture comprising N-hydroxy-4-{5-[4-( 5-isopropyl-2-methyl-1,3-thiazol-4-yl)phenoxy]pentoxyl-benzamidine, 4-{5-[4-(5-isopropyl-2-methyl-1,3-thiazol-4-yl) phenoxy]pentoxy}-benzamidine or pharmaceutically acceptable salts thereof as a medicinally effective ingredient. The composition of the present invention can significantly reduce the volume of bony callus, and increase bony density and strength of bony callus, and decrease the contents of connective tissue and cartilage tissue in bony callus, and thus promote loss and ossification of the bony callus formed during the fracture healing process. Therefore, the composition of the present invention is useful for the treatment of bone fracture.

摘要翻译： 本文公开了一种用于治疗骨折的组合物，其包含N-羟基-4- {5- [4-（5-异丙基-2-甲基-1,3-噻唑-4-基）苯氧基]戊氧基 - 苄脒，4- {5- [4-（5-异丙基-2-甲基-1,3-噻唑-4-基）苯氧基]戊氧基} - 苄脒或其药学上可接受的盐作为药物有效成分。 本发明的组合物可显着减少骨愈伤组织的体积，增加骨愈伤组织的骨密度和强度，并减少骨愈伤组织中结缔组织和软骨组织的含量，从而促进形成的骨愈伤组织的损失和骨化 在骨折愈合过程中。 因此，本发明的组合物可用于治疗骨折。

公开(公告)号：US20100132982A1

公开(公告)日：2010-06-03

申请号：US12379687

申请日：2009-02-26

申请人： Seung Hyun Cho ,  Je Gwang Yoo ,  Tae Eun Chang ,  Sang Soo Lee ,  Jung Woo Lee ,  Dae Young Lee ,  Jae Joon Lee

发明人： Seung Hyun Cho ,  Je Gwang Yoo ,  Tae Eun Chang ,  Sang Soo Lee ,  Jung Woo Lee ,  Dae Young Lee ,  Jae Joon Lee

IPC分类号： H05K1/00 ,  B05D5/12 ,  H01B13/00

CPC分类号： H05K1/0209 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K3/285 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/09045 ,  H05K2201/0959 ,  H01L2924/00

摘要： Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate.

摘要翻译： 公开了一种包括具有图案部分的阻焊层及其制造方法的封装基板，其中，图案部分形成在阻焊层上，从而增加散热效率并使基板翘曲最小化。

公开(公告)号：US07562447B2

公开(公告)日：2009-07-21

申请号：US11727587

申请日：2007-03-27

申请人： Choon Keun Lee ,  Seung Hyun Ra ,  Sang Moon Lee ,  Jung Woo Lee ,  Jeong Bok Kwak ,  Jae Choon Cho ,  Chi Seong Kim

发明人： Choon Keun Lee ,  Seung Hyun Ra ,  Sang Moon Lee ,  Jung Woo Lee ,  Jeong Bok Kwak ,  Jae Choon Cho ,  Chi Seong Kim

IPC分类号： H01K3/10

CPC分类号： H05K3/045 ,  H05K3/06 ,  H05K3/107 ,  H05K2203/025 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed is a method of manufacturing a printed circuit board for fine circuit formation, in which an unnecessary metal layer formed on the upper portion of a circuit pattern is removed through mechanical polishing and then chemical etching. In place of expensive chemical mechanical polishing, in the method of the invention, mechanical polishing and chemical etching are continuously applied to thus sequentially remove and planarize the unnecessary metal layer. Thereby, through an inexpensive, simple, and continuous process, the planarization procedure can be precisely performed, thus making it possible to apply the method to large areas and economically realize a fine circuit pattern.

摘要翻译： 公开了一种制造用于精细电路形成的印刷电路板的方法，其中通过机械抛光然后化学蚀刻除去形成在电路图案的上部上的不必要的金属层。 代替昂贵的化学机械抛光，在本发明的方法中，连续施加机械抛光和化学蚀刻，从而顺序地除去和平坦化不需要的金属层。 因此，通过廉价，简单且连续的过程，可以精确地执行平面化处理，从而可以将该方法应用于大面积并且经济地实现精细电路图案。

公开(公告)号：US20080287509A1

公开(公告)日：2008-11-20

申请号：US11631828

申请日：2005-07-05

申请人： Jei Man Ryu ,  Jin Soo Lee ,  Sae Kwang Ku ,  Jung Woo Lee ,  Hee Bog Yang

发明人： Jei Man Ryu ,  Jin Soo Lee ,  Sae Kwang Ku ,  Jung Woo Lee ,  Hee Bog Yang

IPC分类号： A61K31/426 ,  C07D277/28 ,  A61P19/00

CPC分类号： A61K31/426

摘要： Disclosed herein is a composition for the treatment bone fracture comprising N-hydroxy-4-{5-[4-(5-isopropyl-2-methyl-1,3-thiazol-4-yl)phenoxy]pentoxyl-benzamidine, 4-{5-[4-(5-isopropyl-2-methyl-1,3-thiazol-4-yl)phenoxy]pentoxy}-benzamidine or pharmaceutically acceptable salts thereof as a medicinally effective ingredient. The composition of the present invention can significantly reduce the volume of bony callus, and increase bony density and strength of bony callus, and decrease the contents of connective tissue and cartilage tissue in bony callus, and thus promote loss and ossification of the bony callus formed during the fracture healing process. Therefore, the composition of the present invention is useful for the treatment of bone fracture.

摘要翻译： 本文公开了一种用于治疗骨折的组合物，其包含N-羟基-4- {5- [4-（5-异丙基-2-甲基-1,3-噻唑-4-基）苯氧基]戊氧基 - 苄脒，4- {5- [4-（5-异丙基-2-甲基-1,3-噻唑-4-基）苯氧基]戊氧基} - 苄脒或其药学上可接受的盐作为药物有效成分。 本发明的组合物可显着减少骨愈伤组织的体积，增加骨愈伤组织的骨密度和强度，并减少骨愈伤组织中结缔组织和软骨组织的含量，从而促进形成的骨愈伤组织的损失和骨化 在骨折愈合过程中。 因此，本发明的组合物可用于治疗骨折。