公开(公告)号：US07286367B2

公开(公告)日：2007-10-23

申请号：US10339655

申请日：2003-01-10

申请人： Toshihiro Miyake ,  Satoshi Takeuchi ,  Koji Kondo ,  Toshikazu Harada ,  Masayuki Aoyama ,  Yoshitaro Yazaki ,  Kazuo Tada ,  Yoshihiko Shiraishi ,  Yosuke Ozaki ,  Katsumi Yamazaki ,  Seiji Konishi ,  Seiichi Shindou

发明人： Toshihiro Miyake ,  Satoshi Takeuchi ,  Koji Kondo ,  Toshikazu Harada ,  Masayuki Aoyama ,  Yoshitaro Yazaki ,  Kazuo Tada ,  Yoshihiko Shiraishi ,  Yosuke Ozaki ,  Katsumi Yamazaki ,  Seiji Konishi ,  Seiichi Shindou

IPC分类号： H05K1/16

CPC分类号： H05K3/4632 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4688 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09672 ,  H05K2203/0361 ,  H01L2924/00

摘要： A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

摘要翻译： 具有内置电容器的多层印刷电路板包括多个树脂膜，每个树脂膜由热塑性树脂制成，并且在预定位置具有多个通孔，多个导电图案位于树脂上 膜和多个导电图案互连构件，它们位于通孔中，以电连接由树脂膜电分离的导电图案。 两个导电图案分别位于一个树脂膜上彼此相对的两个表面上，同时重叠。 导电图案中的两个和树脂膜中的一个构成电容器。

公开(公告)号：US07240429B2

公开(公告)日：2007-07-10

申请号：US10909434

申请日：2004-08-03

申请人： Yoshihiko Shiraishi ,  Koji Kondo

发明人： Yoshihiko Shiraishi ,  Koji Kondo

IPC分类号： H01K3/10

CPC分类号： H05K3/4632 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0394 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49211 ,  H01L2224/0401

摘要： A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.

摘要翻译： 在由热塑性树脂制成的树脂膜上形成导体图案。 每个单面导体图案膜具有填充有导电浆料的通孔。 印刷导体图案和印刷电阻器形成在陶瓷基板上。 单面导体图案膜层叠在陶瓷基板上。 然后，将多层组件从其两侧加热并压制，得到印刷电路板。 在热压处理期间，在导体图案之间以及在导体图案和印刷导体图案之间获得层间连接的情况下，各自的单面导体图案膜和陶瓷基板结合在一起。

公开(公告)号：US07165321B2

公开(公告)日：2007-01-23

申请号：US10701441

申请日：2003-11-06

申请人： Koji Kondo ,  Tomohiro Yokochi ,  Toshihiro Miyake ,  Satoshi Takeuchi

发明人： Koji Kondo ,  Tomohiro Yokochi ,  Toshihiro Miyake ,  Satoshi Takeuchi

IPC分类号： H05K3/30

CPC分类号： H05K1/186 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05624

摘要： A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

摘要翻译： 具有嵌入式电气装置的印刷电路板的制造方法如下。 具有开口部的第一树脂膜或具有凹部的片状部件与多个第二树脂膜一起堆积，形成有多个导电层。 第一和第二树脂膜和片状构件包括热塑性树脂。 电气装置插入开口或凹槽中。 然后，将包括电气装置的堆叠体按压并加热以使堆叠体整合。 当堆叠体被按压和加热时，电气装置的电极与导电层电连接，同时第一和第二树脂膜和片构件塑性变形以密封电子装置。

公开(公告)号：US06680441B2

公开(公告)日：2004-01-20

申请号：US10166731

申请日：2002-06-12

申请人： Koji Kondo ,  Tomohiro Yokochi ,  Toshihiro Miyake ,  Satoshi Takeuchi

发明人： Koji Kondo ,  Tomohiro Yokochi ,  Toshihiro Miyake ,  Satoshi Takeuchi

IPC分类号： H05K116

CPC分类号： H05K1/186 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05624

摘要： A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

摘要翻译： 具有嵌入式电气装置的印刷电路板如下制造。 具有开口的第一树脂膜或具有凹部的片状构件与多个第二树脂膜一起堆叠，其上形成有多个导电层。 第一和第二树脂膜和片状构件包括热塑性树脂。 电气装置插入开口或凹槽中。 然后，将包括电气装置的堆叠体按压并加热以使堆叠体整合。 当堆叠体被按压和加热时，电气装置的多个电极电连接到导电层，同时第一和第二树脂膜和片构件塑性变形以密封电子装置。

公开(公告)号：US06667443B2

公开(公告)日：2003-12-23

申请号：US10007703

申请日：2001-12-10

申请人： Koji Kondo ,  Tetsuaki Kamiya ,  Toshikazu Harada ,  Ryuichi Onoda ,  Yasutaka Kamiya ,  Gentaro Masuda ,  Yoshitaro Yazaki ,  Tomohiro Yokochi

发明人： Koji Kondo ,  Tetsuaki Kamiya ,  Toshikazu Harada ,  Ryuichi Onoda ,  Yasutaka Kamiya ,  Gentaro Masuda ,  Yoshitaro Yazaki ,  Tomohiro Yokochi

IPC分类号： H05K100

CPC分类号： H05K3/4638 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/063 ,  H05K2203/065 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T156/1064

摘要： Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.

公开(公告)号：US06636989B1

公开(公告)日：2003-10-21

申请号：US09494400

申请日：2000-01-31

申请人： Koji Kondo ,  Naoki Shibayama

发明人： Koji Kondo ,  Naoki Shibayama

IPC分类号： G06F1100

CPC分类号： G05B19/0421 ,  B60W2050/0005 ,  G05B2219/23411 ,  G05B2219/2637

摘要： An electronic control apparatus for vehicles has at least two microcomputers, each having a non-volatile flash memory which stores a vehicle control program and data. Each microcomputer is reset when an abnormality is detected. Each microcomputer is applied with an identification signal indicative of a main one or sub one. When a data rewriting instruction is applied from an external writing device, one microcomputer which receives the identification signal indicative of the main one operates to release the other microcomputer from the reset condition after an elapse of a delay time period. A new control program and data transmitted from the external writing device is written into the corresponding flash memory in place of the previously stored control program and data.

摘要翻译： 用于车辆的电子控制装置具有至少两个微型计算机，每个微型计算机具有存储车辆控制程序和数据的非易失性闪速存储器。 当检测到异常时，每个微计算机复位。 每个微计算机都应用指示主要或次要的识别信号。 当从外部写入装置应用数据重写指令时，接收到指示主装置的识别信号的一个微计算机在经过延迟时间段之后操作以将其他微计算机从复位状态释放。 将新的控制程序和从外部写入装置发送的数据代替先前存储的控制程序和数据写入对应的闪速存储器。

公开(公告)号：US06485369B2

公开(公告)日：2002-11-26

申请号：US09880111

申请日：2001-06-14

申请人： Koji Kondo ,  Yoji Inagaki ,  Hideaki Shimizu

发明人： Koji Kondo ,  Yoji Inagaki ,  Hideaki Shimizu

IPC分类号： A63F924

CPC分类号： A63F13/54 ,  A63F13/10 ,  A63F13/822 ,  A63F2300/6063 ,  A63F2300/807

摘要： A video game apparatus includes an external ROM. This external ROM has a sound memory area storing sound sequence data. The sound sequence data includes a plurality of block sequences for each of three status of “move”, “fight” and “stop” of a player object. A CPU detects a status of the player object according to a mode flag, and read a block sequence to a RAM in compliance with the status detected. It is possible to output a series of game melodies in a manner matching the status of the player object by the repetition of using the plurality of block sequences.

摘要翻译： 视频游戏装置包括外部ROM。 该外部ROM具有存储声音序列数据的声音存储区域。 声音序列数据包括用于玩家对象的“移动”，“起搏”和“停止”的三种状态中的每一种的多个块序列。 CPU根据模式标志检测播放器对象的状态，并根据检测到的状态将块顺序读取到RAM。 可以通过重复使用多个块序列，以与播放器对象的状态相匹配的方式输出一系列游戏旋律。

公开(公告)号：US5669548A

公开(公告)日：1997-09-23

申请号：US620212

申请日：1996-03-22

申请人： Toshihiro Miyake ,  Koji Kondo ,  Takashi Kurahashi ,  Nozomu Okumura ,  Makoto Takagi

发明人： Toshihiro Miyake ,  Koji Kondo ,  Takashi Kurahashi ,  Nozomu Okumura ,  Makoto Takagi

IPC分类号： B23K1/015 ,  B23K35/14 ,  B23K35/36 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  B23K35/363

CPC分类号： B23K35/3612 ,  B23K1/015 ,  H01L24/13 ,  H01L24/81 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L24/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10S428/939 ,  Y10T428/12514 ,  Y10T428/12556 ,  Y10T428/1259

摘要： A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C.sub.14 H.sub.30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning. An excellent electrical joint which is moisture-resistant as well as highly reliable is attained.

摘要翻译： 公开了一种焊接方法，其在不使用焊剂的情况下固定可靠的接头。 使用能够物理破坏和分散氧化膜的辅助连接材料来进行焊接，该氧化膜自然生长在诸如焊料的主要连接材料的表面上，或者在两个端子之间钎焊，以实现可靠的焊料润湿 主要连接材料融合和混合）。 对于辅助连接材料，可以使用例如正十四烷（C 14 H 30）的烃。 连接表面之间的十四烷沸腾并立即膨胀; 由此产生的能量物理地分散氧化膜并引起新鲜的表面暴露; 两端的焊料混合; 并牢固地实现了电气和机械接头。 辅助连接材料的残留物是绝缘材料，因此不需要清洁。 获得耐湿性好，可靠性高的优良电接头。

公开(公告)号：US5446764A

公开(公告)日：1995-08-29

申请号：US21343

申请日：1993-02-23

申请人： Koji Kondo

发明人： Koji Kondo

IPC分类号： H04L7/00 ,  H04J3/07 ,  H04L29/06 ,  H04L29/08

CPC分类号： H04J3/07

摘要： A communication control device includes (a) a rate adapting unit for inputting thereto a receive clock for receiving a signal and outputting the receive clock of which waveform is partially deformed; and (b) a receiver for receiving the signal based on the receive clock outputted from the rate adapting unit.

摘要翻译： 通信控制装置包括：（a）速率适配单元，用于向其输入用于接收信号的接收时钟，并输出波形部分变形的接收时钟; 以及（b）接收机，用于基于从速率适配单元输出的接收时钟接收信号。

公开(公告)号：US5039338A

公开(公告)日：1991-08-13

申请号：US456659

申请日：1989-12-29

申请人： Koji Kondo ,  Seiji Amakusa ,  Katuhiko Murakawa ,  Katsuaki Kojima ,  Nobumasa Ishida ,  Junji Ishikawa ,  Futoshi Ishikawa

发明人： Koji Kondo ,  Seiji Amakusa ,  Katuhiko Murakawa ,  Katsuaki Kojima ,  Nobumasa Ishida ,  Junji Ishikawa ,  Futoshi Ishikawa

IPC分类号： C23C18/40

CPC分类号： C23C18/405

摘要： Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.-3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyidine, 1,6-naphthyridine, tetrathiafurvalene, .alpha.,.alpha.,.alpha.-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution.

摘要翻译： 公开了包含铜离子，铜离子络合剂，还原剂和pH调节剂的无电镀铜溶液，所述镀溶液包含三烷醇单胺或其盐作为络合剂和促进剂，其量为 当三烷醇单胺或其盐以足以使铜离子复合但不足以起促进剂的量存在时获得的铜沉积速度高的铜沉积速度，以及1.2×10 -4至1.2×10 -3摩尔/升的 作为反应引发剂的铁离子化合物和/或1.92×10 -4至1.92×10 -3摩尔/升的选自哒嗪，甲基哌啶，1,2-二（2-吡啶基）乙烯的至少一种化合物 ，1,2-二（吡啶基）乙烯，2,2'-二吡啶基胺，2,2'-联吡啶基，2,2'-联嘧啶，6,6'-二甲基-2,2'-联吡啶，二-2 吡啶基酮，N，N，N'，N'-四乙基乙二胺，萘，1,8-萘啶，1,6-萘啶，四糠醛，α，α ，α-三联吡啶，邻苯二甲酸，间苯二甲酸和2,2'-二苯甲酸作为改善电镀膜的物理性能的试剂，以及使用该化学镀铜溶液形成无电解铜沉积膜的方法。