公开(公告)号：US20190207640A1

公开(公告)日：2019-07-04

申请号：US16152391

申请日：2018-10-04

Applicant: MEDIATEK INC.

Inventor： Jui-Lin Hsu ,  Chao-Ching Hung ,  Tzu-Chin Lin ,  Wei-Hsiu Hsu ,  Yu-Li Hsueh ,  Jing-Hong Conan Zhan ,  Chih-Ming Hung

IPC: H04B1/403 ,  H03B5/12 ,  G01S7/03

CPC classification number: H04B1/403 ,  G01S7/03 ,  G01S7/032 ,  H03B5/12 ,  H03B2200/008 ,  H03K5/135 ,  H04B7/2662

Abstract: A wireless system includes an active oscillator and a front-end circuit. The active oscillator is used to generate and output a reference clock. The active oscillator includes at least one active component, and does not include an electromechanical resonator. The front-end circuit is used to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal. The LO signal is derived from the reference clock.

公开(公告)号：US20190129023A1

公开(公告)日：2019-05-02

申请号：US16143470

申请日：2018-09-27

Applicant: MEDIATEK INC.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu

IPC: G01S13/02 ,  H01L23/12 ,  H01L23/28 ,  H05K1/02 ,  H01Q1/24

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

公开(公告)号：US12028099B2

公开(公告)日：2024-07-02

申请号：US18104761

申请日：2023-02-01

Applicant: MEDIATEK INC.

Inventor： Jui-Lin Hsu ,  Hsiang-Yun Chu ,  Yen-Tso Chen ,  Jen-Hao Cheng ,  Wei-Hsiu Hsu ,  Tzu-Chin Lin ,  Chih-Ming Hung ,  Jing-Hong Conan Zhan

IPC: H04B1/04 ,  H01P5/10 ,  H03H7/42 ,  H04B1/30 ,  H04B1/3805

CPC classification number: H04B1/0483 ,  H01P5/10 ,  H03H7/42 ,  H04B1/30 ,  H04B1/3805 ,  H04B2001/307

Abstract: A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.

公开(公告)号：US11837552B2

公开(公告)日：2023-12-05

申请号：US17748308

申请日：2022-05-19

Applicant: MediaTek Inc.

Inventor： Wen-Sung Hsu ,  Tao Cheng ,  Nan-Cheng Chen ,  Che-Ya Chou ,  Wen-Chou Wu ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Wei-Hsiu Hsu

IPC: H01L23/373 ,  H01L21/52 ,  H01L23/31 ,  H01L23/433 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/00 ,  H01L29/739 ,  H01L29/861 ,  H01L23/051 ,  H01L25/18 ,  H01L23/495 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L25/10 ,  H01L25/16 ,  H01L23/50 ,  H01L21/683 ,  H01Q9/04 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/14 ,  H01Q21/06

CPC classification number: H01L23/5389 ,  H01L21/486 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/10 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L25/50 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/0414 ,  H01L23/145 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1533 ,  H01L2924/1579 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01Q21/065 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.

公开(公告)号：US11835645B2

公开(公告)日：2023-12-05

申请号：US15620854

申请日：2017-06-13

Applicant: MediaTek Inc.

Inventor： Tzu-Chin Lin ,  Chih-Ming Hung

IPC: G01S7/40 ,  G01S13/931 ,  H01Q3/24 ,  H01Q21/06 ,  H01Q25/00 ,  H01Q1/32 ,  H01Q21/00 ,  G01S13/02 ,  G01S7/02

CPC classification number: G01S7/4004 ,  G01S13/931 ,  H01Q3/24 ,  H01Q21/06 ,  H01Q21/061 ,  H01Q25/002 ,  G01S7/027 ,  G01S2013/0245 ,  G01S2013/93271 ,  G01S2013/93272 ,  H01Q1/3233 ,  H01Q21/0006 ,  H01Q21/065

Abstract: Concepts and examples pertaining to reconfigurable radio frequency (RF) front end and antenna arrays for radar mode switching are described. A processor associated with a radar system selects a mode of a plurality of modes in which to operate the radar system. The processor then controls the radar system to operate in the selected mode by utilizing a plurality of antennas in a respective configuration of a plurality of configurations of the antennas which corresponds to the selected mode. Each configuration of the plurality of configurations of the antennas results in respective antenna characteristics. Each configuration of the plurality of configurations of the antennas utilizes a respective number of antennas of the plurality of antennas.

公开(公告)号：US11821975B2

公开(公告)日：2023-11-21

申请号：US17495769

申请日：2021-10-06

Applicant: MediaTek Inc.

Inventor： Yen-Ju Lu ,  Chih-Ming Hung ,  Wen-Chou Wu

IPC: G01S13/02 ,  H01Q15/14 ,  G01S7/03 ,  H01Q1/38 ,  H01Q1/32 ,  H01Q1/52 ,  G01S13/931 ,  H01Q1/22 ,  H01Q17/00 ,  H01L23/12 ,  H01L23/28 ,  H01Q1/24 ,  H05K1/02 ,  G01S7/02

CPC classification number: G01S13/02 ,  G01S7/03 ,  G01S13/931 ,  H01L23/12 ,  H01L23/28 ,  H01Q1/2283 ,  H01Q1/245 ,  H01Q1/3233 ,  H01Q1/38 ,  H01Q1/525 ,  H01Q15/14 ,  H01Q17/001 ,  H05K1/0213 ,  G01S7/027 ,  G01S7/028

Abstract: A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

公开(公告)号：US11693089B2

公开(公告)日：2023-07-04

申请号：US17558502

申请日：2021-12-21

Applicant: MEDIATEK INC.

Inventor： Tzu-Chin Lin ,  Chih-Ming Hung ,  Jui-Lin Hsu ,  Chao-Ching Hung ,  Bao-Chi Peng

IPC: G01S7/40 ,  H03J7/04 ,  H03J7/06 ,  H03L7/183 ,  H04B17/21 ,  G01S13/02 ,  G01S13/88

CPC classification number: G01S7/4021 ,  G01S7/4008 ,  G01S7/4056 ,  G01S13/0209 ,  G01S13/88 ,  H03J7/04 ,  H03J7/065 ,  H03L7/183 ,  H04B17/21

Abstract: A system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock, and includes an active oscillator that generates the reference clock. The active oscillator includes at least one active component. The RX circuit generates a processed RX signal by processing an RX input signal according to the LO signal. The calibration circuit checks a signal characteristic of the processed RX signal by detecting if a calibration tone exists within a receiver bandwidth, set a frequency calibration control output in response to the calibration tone being not found in the receiver bandwidth, and output the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

公开(公告)号：US20230187377A1

公开(公告)日：2023-06-15

申请号：US17987873

申请日：2022-11-16

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung Lin ,  Chih-Ming Hung ,  Shih-Chia Chiu

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/38

CPC classification number: H01L23/552 ,  H01L25/0655 ,  H01L24/16 ,  H01L25/105 ,  H01L23/49833 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49816 ,  H01L23/66 ,  H01Q1/38 ,  H01L2924/1431 ,  H01L2924/1421 ,  H01L2924/2027 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L2224/1601 ,  H01L2225/1023 ,  H01L23/145

Abstract: A semiconductor package includes a base film, a semiconductor die on the base film, metal studs on the semiconductor die, shielding pillars on the base film and around the semiconductor die, a first molding compound encapsulating the semiconductor die, the metal studs, and the shielding pillars, a first re-distribution structure on the first molding compound, a second molding compound on the first re-distribution structure, through-mold-vias in the second molding compound, and a second re-distribution structure on the second molding compound and electrically connected to the through-mold-vias. The second re-distribution structure comprises an antenna.

公开(公告)号：US11359943B2

公开(公告)日：2022-06-14

申请号：US16280018

申请日：2019-02-19

Applicant: MediaTek Inc.

Inventor： Chih-Ming Hung ,  ChiaYu Lin

IPC: G01D18/00 ,  G01D21/00

Abstract: Various examples pertaining to a sensor system interconnect for automatic configuration of sensors of the sensor system are described. A sensor senses at least one parameter. The sensor also determines its respective position among a series of sensors. Based on a result of the determining, the sensor performing either a first procedure, responsive to the sensor being a first sensor in the series of sensors, or a second procedure, responsive to the sensor not being the first sensor in the series of sensors. The first procedure involves the sensor transmitting first data of the sensed at least one parameter via a second input/output (I/O) pin of the sensor. The second procedure involves the sensor receiving second data from a preceding sensor in the series of sensors via a first I/O pin of the sensor and transmitting the first data and the second data via the second I/O pin.

公开(公告)号：US20220140849A1

公开(公告)日：2022-05-05

申请号：US17505605

申请日：2021-10-19

Applicant: MEDIATEK INC.

Inventor： Jui-Lin Hsu ,  Yen-Tso Chen ,  Hsiang-Yun Chu ,  Jen-Hao Cheng ,  Wei-Hsiu Hsu ,  Tzu-Chin Lin ,  Chih-Ming Hung ,  Jing-Hong Conan Zhan

IPC: H04B1/08 ,  H04W92/00 ,  H01L23/66

Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.