公开(公告)号：US08710653B2

公开(公告)日：2014-04-29

申请号：US13397098

申请日：2012-02-15

申请人： Masatoshi Fukuda ,  Hiroshi Watabe

发明人： Masatoshi Fukuda ,  Hiroshi Watabe

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1412 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81444 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device, includes: a wiring substrate, a stacked body mounted on the wiring substrate, an underfill layer filled into gaps between respective semiconductor chips of the stacked body; and a molding body made up of a molding resin covered and formed at outside of the stacked body and so on. The underfill layer is made up of a cured product of a resin material containing an amine-based curing agent, and the cured product has a Tg of 65° C. or more and 100° C. or less.

摘要翻译： 一种半导体器件，包括：布线基板，安装在布线基板上的层叠体，填充在层叠体的各半导体芯片之间的间隙中的底部填充层; 以及由在层叠体的外部被覆盖并形成的成型树脂等构成的成型体。 底部填充层由含有胺类固化剂的树脂材料的固化物构成，固化物的Tg为65℃以上且100℃以下。

公开(公告)号：US08445321B2

公开(公告)日：2013-05-21

申请号：US12887772

申请日：2010-09-22

申请人： Masatoshi Fukuda

发明人： Masatoshi Fukuda

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/81 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/562 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/731 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81007 ,  H01L2224/81065 ,  H01L2224/81097 ,  H01L2224/81194 ,  H01L2224/81815 ,  H01L2224/9212 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a method of manufacturing a semiconductor device is disclosed. The method includes forming a cured film of an insulation resin on a surface of a first semiconductor chip and flip-chip bonding a second semiconductor via a bump on the first semiconductor chip on which the cured film of the insulation resin is formed. The insulation resin can be cured at temperature range from (A−50)° C. to (A+50)° C., wherein “A” is a solidification point of the bump.

摘要翻译： 在一个实施例中，公开了制造半导体器件的方法。 该方法包括在第一半导体芯片的表面上形成绝缘树脂的固化膜，并且在其上形成有绝缘树脂的固化膜的第一半导体芯片上经由凸块将第二半导体结合到第二半导体。 绝缘树脂可以在（A-50）℃至（A + 50）℃的温度范围内固化，其中“A”是凸点的凝固点。

公开(公告)号：US20120001324A1

公开(公告)日：2012-01-05

申请号：US13175247

申请日：2011-07-01

申请人： Hideo AOKI ,  Hideko Mukaida ,  Masatoshi Fukuda ,  Yasuhiro Koshio ,  Hiroshi Watabe

发明人： Hideo AOKI ,  Hideko Mukaida ,  Masatoshi Fukuda ,  Yasuhiro Koshio ,  Hiroshi Watabe

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L23/562 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3171 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/85375 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a semiconductor device includes a circuit substrate, and first and second semiconductor chips mounted on it. The first semiconductor chip and the second semiconductor chip are flip-chip connected, and an underfill resin is filled between them. The underfill resin has a fillet portion. A thickness T1 of the first semiconductor chip and a thickness T2 of the second semiconductor chip satisfy a relationship of T1/(T1+T2)≦0.6.

摘要翻译： 在一个实施例中，半导体器件包括电路基板，以及安装在其上的第一和第二半导体芯片。 第一半导体芯片和第二半导体芯片被倒装连接，并且在它们之间填充底部填充树脂。 底部填充树脂具有圆角部分。 第一半导体芯片的厚度T1和第二半导体芯片的厚度T2满足T1 /（T1 + T2）＆nlE; 0.6的关系。

公开(公告)号：US07883960B2

公开(公告)日：2011-02-08

申请号：US12409979

申请日：2009-03-24

申请人： Masatoshi Fukuda ,  Akiyoshi Hatada ,  Katsuaki Ookoshi ,  Kenichi Okabe ,  Tomonari Yamamoto

发明人： Masatoshi Fukuda ,  Akiyoshi Hatada ,  Katsuaki Ookoshi ,  Kenichi Okabe ,  Tomonari Yamamoto

IPC分类号： H01L21/8234 ,  H01L21/8244 ,  H01L21/8242 ,  H01L21/336

CPC分类号： H01L27/0629

摘要： A method of manufacturing a semiconductor device includes forming a conductive layer over a semiconductor substrate, selectively removing the conductive layer for forming a resistance element and a gate electrode, forming sidewall spacers over sidewalls of the remaining conductive layer, forming a first insulating film containing a nitrogen over the semiconductor substrate having the sidewall spacers, implanting ions in the semiconductor substrate through the first insulating film, forming a second insulating film containing a nitrogen over the first insulating film after implanting ions in the semiconductor substrate through the first insulating film, and selectively removing the first and the second insulating film such that at least a part of the first and the second insulating films is remained over the semiconductor substrate and over the conductive layer.

摘要翻译： 一种制造半导体器件的方法包括在半导体衬底上形成导电层，选择性地去除用于形成电阻元件和栅电极的导电层，在剩余导电层的侧壁上形成侧壁间隔物，形成第一绝缘膜， 在具有侧壁间隔物的半导体衬底上的氮气，通过第一绝缘膜在半导体衬底中注入离子，在通过第一绝缘膜植入离子到半导体衬底中之后，在第一绝缘膜上形成含有氮的第二绝缘膜，并且选择性地 去除第一和第二绝缘膜，使得第一和第二绝缘膜的至少一部分保留在半导体衬底上并在导电层上方。

公开(公告)号：US20100280535A1

公开(公告)日：2010-11-04

申请号：US12597384

申请日：2008-04-25

申请人： Akio Yamaguchi ,  Masatoshi Fukuda ,  Masahiko Saito

发明人： Akio Yamaguchi ,  Masatoshi Fukuda ,  Masahiko Saito

IPC分类号： A61B17/32

CPC分类号： A61F9/0133 ,  A61B17/3211

摘要： [Problems] To ensure the sharpness of a stripping knife whereby a part of a living tissue is incised and stripped while preventing a cut along the thickness direction.[Means for Solving Problems] A stripping knife (A) having a plate-shaped blade (3) having an edge (1) around the periphery, a shank (5) connected to the blade (3), and a handle (7) holding the shank (5) in the integrated state, wherein the blade (3) is composed of the edge (1) formed at the front end and a guide face (2) which is formed between the edge (1) and the front face (3b) of the connected plate constituting the blade (3) and brought into contact with the surface (13) of the remaining tissue.

摘要翻译： [问题]为了确保剥离刀的清晰度，由此一边活动组织被切开并剥离，同时防止沿着厚度方向的切割。 解决问题的手段具有围绕周边具有边缘（1）的板状刀片（3）的剥离刀（A），连接到刀片（3）的柄（5）和手柄（7） 将所述柄（5）保持在一体状态，其中所述刀片（3）由形成在所述前端的边缘（1）和形成在所述边缘（1）和所述前表面 （3）的连接板（3b）并与其余组织的表面（13）接触。

公开(公告)号：US06498055B2

公开(公告)日：2002-12-24

申请号：US09855529

申请日：2001-05-16

申请人： Masatoshi Fukuda ,  Susumu Harada ,  Tetsuya Sato ,  Hidenobu Sato ,  Atsushi Nakano

发明人： Masatoshi Fukuda ,  Susumu Harada ,  Tetsuya Sato ,  Hidenobu Sato ,  Atsushi Nakano

IPC分类号： H01L2144

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

摘要翻译： 在半导体器件制造方法中，至少半导体元件设置在树脂成型模具的空腔中。 将树脂供给到与空腔直接接触的树脂储存器，然后注入以充分填充空腔。 填充在空腔中的树脂形成用于封装半导体元件的树脂密封件。 树脂密封件具有作为树脂储存器的剩余部分的凹部或突起。

公开(公告)号：US06322570B1

公开(公告)日：2001-11-27

申请号：US09365234

申请日：1999-07-30

申请人： Kanji Matsutani ,  Masatoshi Fukuda

发明人： Kanji Matsutani ,  Masatoshi Fukuda

IPC分类号： A61B1704

CPC分类号： A61B17/0469 ,  A61B17/0483 ,  A61B17/062

摘要： A needle holder for guiding a surgical needle having a suture attached to the needle, in which the surgical needle is transferred from a first shaft to a second shaft, comprising a needle stand formed on the first shaft and a needle receiver formed on the second shaft, receiving the needle made upright at the needle stand. Further, the needle holder comprises a guide passage formed on the first shaft for guiding the suture attached to the needle from the needle stand in a prescribed direction to at least the vicinity of the needle stand, the guide passage having a surface that has no edge damaging the suture in a cross direction with respect to the direction of the tension exerted to the suture.

摘要翻译： 一种用于引导具有附接到所述针的缝合线的外科用针的针保持器，其中所述外科用针从第一轴转移到第二轴，包括形成在所述第一轴上的针架和形成在所述第二轴上的针架 接收在针架上直立的针头。 此外，针保持器包括形成在第一轴上的引导通道，用于将从针架附接到针的缝合线沿规定方向引导至至少在针架附近，引导通道具有没有边缘的表面 相对于施加到缝合线的张力方向在横向上损伤缝合线。

公开(公告)号：US6107761A

公开(公告)日：2000-08-22

申请号：US788642

申请日：1997-01-27

申请人： Takeshi Seto ,  Akihito Uetake ,  Tatsuya Shimoda ,  Masao Ono ,  Masatoshi Fukuda ,  Satoshi Yamazaki

发明人： Takeshi Seto ,  Akihito Uetake ,  Tatsuya Shimoda ,  Masao Ono ,  Masatoshi Fukuda ,  Satoshi Yamazaki

IPC分类号： B60K17/06 ,  B60K1/02 ,  B60K17/04 ,  B60K17/356 ,  B60L3/12 ,  B60L7/24 ,  B60L11/18 ,  B60L15/20 ,  H02P15/00 ,  H02P1/00

CPC分类号： B60K1/02 ,  B60K17/043 ,  B60L15/2009 ,  B60L15/2054 ,  B60L3/102 ,  B60L3/12 ,  B60L7/14 ,  B60W10/00 ,  B60L2240/12 ,  B60L2240/423 ,  B60L2240/461 ,  B60L2240/463 ,  B60L2240/465 ,  B60L2250/26 ,  B60L2270/145 ,  Y02T10/645 ,  Y02T10/7275

摘要： A drive for an electric vehicle includes by forming a drive unit 8 having a transmission by combining a single propelling motor 7 with the transmission, respectively interconnecting the drive unit 8 with propelling wheels to be a drive wheel, and separately controlling the drive units 8. Besides, traveling speed detecting means are provided on the respective drive units 8, 8, and the respective drive units are simultaneously controlled according to a revolution signal from one of the traveling speed detecting means. A method for controlling an electric vehicle by separately controlling the drive units 8, 8, making the output torque of the motor zero or minimum during the gear change, and producing again the output torque of the motor after completing the gear change.

摘要翻译： 用于电动车辆的驱动器包括通过组合单个推进马达7与变速器形成具有变速器的驱动单元8，分别将驱动单元8与作为驱动轮的推进轮互连，并且分别控制驱动单元8。 此外，行驶速度检测装置设置在各个驱动单元8,8上，并且根据来自行驶速度检测装置中的一个的转速信号同时控制各个驱动单元。 一种通过单独控制驱动单元8,8来控制电动车辆的方法，使变速器中的电动机的输出转矩为零或最小，并且在完成变速后再次产生电动机的输出转矩。

公开(公告)号：US5143269A

公开(公告)日：1992-09-01

申请号：US824105

申请日：1992-01-22

申请人： Kanji Matsutani ,  Kimio Suzuki ,  Masatoshi Fukuda ,  Katsutoshi Sato

发明人： Kanji Matsutani ,  Kimio Suzuki ,  Masatoshi Fukuda ,  Katsutoshi Sato

IPC分类号： A61B17/068 ,  B25C5/02 ,  B25C5/11

CPC分类号： A61B17/0684 ,  B25C5/11

摘要： A medical stapler includes a front wall having an opening at a lower end portion thereof. A mirror is mounted in the vicinity of an upper edge of this opening. A straight line, representing a wound pinched by a pincette by the operator, is reflected on the mirror. The operator adjusts the posture of the stapler so that the straight line of the actual wound can be aligned with the straight line reflected on the mirror, and in this condition the staple is shaped so as to effect the suturing of the wound.

公开(公告)号：US09132036B2

公开(公告)日：2015-09-15

申请号：US12597384

申请日：2008-04-25

申请人： Akio Yamaguchi ,  Masatoshi Fukuda ,  Masahiko Saito

发明人： Akio Yamaguchi ,  Masatoshi Fukuda ,  Masahiko Saito

IPC分类号： A61F9/007 ,  A61B17/3211 ,  A61F9/013

CPC分类号： A61F9/0133 ,  A61B17/3211

摘要： [Problems] To ensure the sharpness of a stripping knife whereby a part of a living tissue is incised and stripped while preventing a cut along the thickness direction.[Means for Solving Problems] A stripping knife (A) having a plate-shaped blade (3) having an edge (1) around the periphery, a shank (5) connected to the blade (3), and a handle (7) holding the shank (5) in the integrated state, wherein the blade (3) is composed of the edge (1) formed at the front end and a guide face (2) which is formed between the edge (1) and the front face (3b) of the connected plate constituting the blade (3) and brought into contact with the surface (13) of the remaining tissue.

摘要翻译： [问题]为了确保剥离刀的清晰度，由此一边活动组织被切开并剥离，同时防止沿着厚度方向的切割。 解决问题的手段具有围绕周边具有边缘（1）的板状刀片（3）的剥离刀（A），连接到刀片（3）的柄（5）和手柄（7） 将所述柄（5）保持在一体状态，其中所述刀片（3）由形成在所述前端的边缘（1）和形成在所述边缘（1）和所述前表面 （3）的连接板（3b）并与其余组织的表面（13）接触。