公开(公告)号：US06975022B2

公开(公告)日：2005-12-13

申请号：US09809917

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L23/28 ,  H01L21/48 ,  H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H01L23/50 ,  H01L23/495

CPC分类号： H01L24/32 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48669 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48769 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85469 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A device containing a flat member is provided, having a pattern for a bonding pad, a wiring, and an electrode, by half-etching through the flat member.

摘要翻译： 提供一种包含平坦部件的装置，其具有用于焊盘，布线和电极的图案，通过半平板部件的半蚀刻。

公开(公告)号：US20050206014A1

公开(公告)日：2005-09-22

申请号：US11119439

申请日：2005-04-29

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi ,  Takeshi Nakamura

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi ,  Takeshi Nakamura

IPC分类号： H01L21/48 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495

CPC分类号： H01L23/3121 ,  H01L21/4828 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012

摘要： As conductive patterns 11A to 11D are formed burying in a insulating resin 10 and a conductive foil 20 is formed being half-etched, thickness of the device is made thin. As an electrode for radiation 11D is provided, a semiconductor device superior in radiation is provided.

公开(公告)号：US06933604B2

公开(公告)日：2005-08-23

申请号：US09810117

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L23/28 ,  H01L21/48 ,  H01L23/12 ,  H01L23/29 ,  H01L23/36 ,  H01L23/42 ,  H01L23/433 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H01L23/34 ,  H01L23/995 ,  H01L921/4763

CPC分类号： H05K1/021 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73257 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K1/0204 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the metal plate (23) and the second supporting member (24).

摘要翻译： 半导体芯片（16）的背面从绝缘树脂（13）的背面露出，金属板（23）固定在该半导体芯片（16）上。 该金属板（23）的后表面和第一支撑构件（11）的后表面基本上位于同一平面内，从而容易地固定在第二支撑构件（24）上。 因此，可以通过金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。

公开(公告)号：US20050104198A1

公开(公告)日：2005-05-19

申请号：US10953299

申请日：2004-09-29

申请人： Kouji Takahashi

发明人： Kouji Takahashi

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/20 ,  H01L21/44 ,  H01L21/50 ,  H01L21/76 ,  H01L23/043

CPC分类号： H01L24/97 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/202 ,  H05K2203/0353 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： Provided is a circuit device having conductive patterns which are equally spaced apart and a manufacturing method thereof. A method for manufacturing a circuit device of the present invention includes the steps of: preparing a conductive foil; forming conductive patterns, which are included in a unit having at least regions for mounting circuit elements, by forming isolation trenches having a uniform width in the conductive foil; electrically connecting the conductive patterns to the circuit elements; sealing with a sealing resin so as to cover the circuit elements and to be filled in the isolation trenches; and removing the conductive foil in its thickness portions where no isolation trenches are provided.

摘要翻译： 提供了具有等距间隔的导电图案的电路装置及其制造方法。 本发明的电路装置的制造方法包括以下步骤：制备导电箔; 形成导电图案，其通过形成在导电箔中具有均匀宽度的隔离沟槽而包括在至少具有用于安装电路元件的区域的单元中; 将导电图案电连接到电路元件; 用密封树脂密封以覆盖电路元件并填充在隔离沟槽中; 并且在其不设置隔离沟槽的厚度部分中去除导电箔。

公开(公告)号：US06852010B2

公开(公告)日：2005-02-08

申请号：US10345228

申请日：2003-01-16

申请人： Kouji Takahashi ,  Takemi Miyamoto ,  Hiroshi Tomiyasu ,  Genshichi Hata ,  Tomotaka Yokoyama

发明人： Kouji Takahashi ,  Takemi Miyamoto ,  Hiroshi Tomiyasu ,  Genshichi Hata ,  Tomotaka Yokoyama

IPC分类号： G11B5/73 ,  G11B23/00 ,  B24B1/00 ,  G11B5/82

CPC分类号： G11B5/7315 ,  G11B23/0021 ,  Y10S428/90 ,  Y10T428/21 ,  Y10T428/24355

摘要： A substrate for an information recording medium has a microwaviness average height Ra′ not greater than 0.05 microinch as measured by a contactless laser interference technique for measurement points within a measurement region of 50 μm□-4 mm□ on a surface of the substrate. The microwaviness average height Ra′ is given by: Ra ′ = 1 n ⁢ ∑ i = 1 n ⁢   | xi - x _ | , where xi represents a measurement point value of each measurement point, {overscore (x)} representing an average value of the measurement point values, n representing the number of said measurement points. Alternatively, the substrate has a waviness period between 300 μm and 5 mm and a waviness average height Wa of 1.0 nm or less as measured by the contactless laser interference technique for measurement points in a measurement region surrounded by two concentric circles which is spaced from a center of a surface of the substrate by a predetermined distance. The waviness average height Wa is given by: Wa = 1 N ⁢ ∑ i = 1 N ⁢   | Xi - X _ | where Xi represents a measurement point value of each measurement point, {overscore (X)} representing an average value of the measurement point values, n representing the number of said measurement points.

摘要翻译： 用于信息记录介质的基板具有通过非接触式激光干涉技术测量的微波平均高度Ra'不大于0.05微英寸，用于在基板表面上的测量区域内的测量点为50um□-4mm□。 微波平均高度Ra'由下式给出：其中xi表示每个测量点的测量点值，{overscore（x表示测量点值的平均值，n表示所述测量点的数量，或者，衬底具有 通过非接触式激光干涉技术测量的测量点在300mum至5mm之间的波纹度以及1.0nm或更小的波纹度平均高度Wa，测量点由与两个表面的中心间隔开的两个同心圆包围的测量区域 波纹平均高度Wa由下式给出：其中Xi表示每个测量点的测量点值，（超标（X表示测量点值的平均值，n表示所述测量点的数量） 。

公开(公告)号：US06756131B2

公开(公告)日：2004-06-29

申请号：US10316070

申请日：2002-12-11

申请人： Hidetaka Oguma ,  Ikuo Okada ,  Taiji Torigoe ,  Kouji Takahashi

发明人： Hidetaka Oguma ,  Ikuo Okada ,  Taiji Torigoe ,  Kouji Takahashi

IPC分类号： F03B312

CPC分类号： C23C28/3215 ,  C22C19/058 ,  C23C4/02 ,  C23C4/073 ,  C23C28/345 ,  C23C28/3455 ,  C23C30/00 ,  Y02T50/67 ,  Y10T428/12535 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/12944

摘要： A high temperature corrosion resistant alloy composition comprising, in addition to Ni, 0.1 to 12% by weight of Co, 10 to 30% by weight of Cr, 4 to 15% by weight of Al, 0.1 to 5% by weight of Y, and 0.5 to 10% by weight of Re. The high temperature corrosion resistant alloy composition has an excellent oxidation resistance and ductility and is suitable for use in a bonding layer of a thermal barrier coating material.

摘要翻译： 一种高温耐腐蚀合金组合物，除了Ni之外还包含0.1〜12重量％的Co，10〜30重量％的Cr，4〜15重量％的Al，0.1〜5重量％的Y， 和0.5〜10重量％的Re。 高温耐腐蚀合金组合物具有优异的抗氧化性和延展性，并且适用于热障涂层材料的粘合层。

公开(公告)号：US06501162B2

公开(公告)日：2002-12-31

申请号：US09809918

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L2302

CPC分类号： H01L24/32 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to the heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

摘要翻译： 散热电极（15）从绝缘树脂（13）的背面露出，金属板（23）固定在散热电极（15）上。 该金属板（23）的后表面和第一支撑构件（11）的后表面基本上位于同一平面内，从而容易地固定在第二支撑构件（24）上。 因此，可以通过散热电极（15），金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。

公开(公告)号：US5843587A

公开(公告)日：1998-12-01

申请号：US874252

申请日：1997-06-13

申请人： Masaharu Nakamori ,  Kouji Takahashi

发明人： Masaharu Nakamori ,  Kouji Takahashi

IPC分类号： C23C4/08 ,  C23C4/18 ,  C23C28/02 ,  B32B15/01 ,  C23C4/12

CPC分类号： C23C4/18 ,  Y10S428/937 ,  Y10T428/12646 ,  Y10T428/12931

摘要： A process for treating a high temperature corrosion resistant composite surface is disclosed. The process includes the steps of forming a first alloy layer by coating a metallic base material with a NiCr alloy or a MCrAlY alloy (M being made of one or more selected from the group consisting of Fe, Ni and Co) with low pressure plasma spraying, forming a second alloy layer on the first alloy layer by coating the first layer with an alloy having identical composition with atmospheric plasma spraying and then subjecting these layers to thermal diffusion treatment in a vacuum furnace or an inert gas atmosphere furnace. Thus, high temperature corrosion resistance is provided for a metallic material used at high temperatures.

摘要翻译： 公开了一种处理高温耐腐蚀复合材料表面的方法。 该方法包括通过用NiCr合金或MCrAlY合金（M由选自Fe，Ni和Co中的一种或多种制成）与金属基材进行低压等离子体喷涂而形成第一合金层的步骤 通过用具有相同组成的合金与大气等离子体喷涂一起涂覆第一层，然后在真空炉或惰性气体气氛炉中对这些层进行热扩散处理，在第一合金层上形成第二合金层。 因此，为高温下使用的金属材料提供高温耐腐蚀性。

公开(公告)号：US5204574A

公开(公告)日：1993-04-20

申请号：US799109

申请日：1991-11-27

申请人： Kazunobu Kanno ,  Kouji Takahashi

发明人： Kazunobu Kanno ,  Kouji Takahashi

IPC分类号： H01R39/04 ,  H01R43/08 ,  H02K13/00 ,  H02K15/02

CPC分类号： H01R39/04 ,  H01R43/08

摘要： Four side walls surrounding a recess in the center of a commutator segment are extended to overhang toward the recess comprising claws and cut-and-raised protrusions, thereby ensuring that the commutator segment is securely engaged with the resin filled in the recess against any of the triaxial stresses due to centrifugal force, rotating force, and tensile force. The volume of cutting in the insulating resin at undercut portions is reduced. The internal and cut-and-raised protrusions are molded by cylindrically bending oriented progressive dies made of plate material.

摘要翻译： 围绕换向片中心的凹部的四个侧壁延伸到朝向包括爪和切起凸起的凹部伸出，从而确保换向器片与填充在凹部中的树脂牢牢接合 由于离心力，旋转力和张力引起的三轴应力。 底切部分的绝缘树脂中的切割体积减小。 内部和切起的凸起由通过板材制成的圆柱形弯曲定向的渐进模具成型。

公开(公告)号：US5198933A

公开(公告)日：1993-03-30

申请号：US666166

申请日：1991-03-07

申请人： Hiroshi Matsushita ,  Koichiro Nanke ,  Kouji Takahashi

发明人： Hiroshi Matsushita ,  Koichiro Nanke ,  Kouji Takahashi

IPC分类号： G11B17/04 ,  G11B17/043

CPC分类号： G11B17/0438

摘要： The invention is an information reproduction apparatus provided with supporting means for supporting a recording medium, a drive source for moving the recording medium between the initial insertion position and the reproduction position by driving said supporting means, transmission means for transmitting the driving force of said drive source to said supporting means, retraction means operable to force a transmission element to retract from said transmission means, said transmission element being a part of said transmission means, and motion means operable to force the recording medium to move from the reproduction position to the initial insertion position under the condition that said transmission element is not engaged in said transmission means. In forcibly moving said supporting means, when the drive is out of operation, said supporting means are released from the drive force by means of said retraction means, freeing the supporting means from the resistance force of the drive force.