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90 条记录 (耗时 0.031 秒)

    Transformer having the heat radiation function
    32.
    发明授权
    Transformer having the heat radiation function 失效
    具有放热功能的变压器

    公开(公告)号：US08493167B2

    公开(公告)日：2013-07-23

    申请号：US12981066

    申请日：2010-12-29

    申请人： Jong Man Kim ,  Kyu Bum Han ,  Seog Moon Choi

    发明人： Jong Man Kim ,  Kyu Bum Han ,  Seog Moon Choi

    IPC分类号： H01F27/08

    CPC分类号： H01F27/085

    摘要： Disclosed herein is a transformer having a heat radiation function. The transformer includes a pair of cores having an E-shape and facing and contacting each other to form central pillars and outer peripheral parts, a transforming coil part wound on the central pillars of the pair of cores and dropping voltage, and a heat radiation pipe formed to have a cylindrical shape and positioned inward from the transforming coil part to radiate heat generated from the transforming coil part, thereby well discharging heat generated from the coil.

    摘要翻译： 这里公开了具有散热功能的变压器。 变压器包括一对具有E形并且彼此面对并相互接触以形成中心柱和外围部分的一对铁芯，缠绕在一对铁芯的中心柱上的变压线圈部分和降压电压，以及散热管 形成为具有圆筒形状并且位于从变压线圈部向内的位置，以辐射由变压线圈部产生的热量，从而充分地排出线圈产生的热量。

    Method forming a semiconductor light emitting device with perforations formed within
    33.
    发明授权
    Method forming a semiconductor light emitting device with perforations formed within 有权
    形成其中形成有穿孔的半导体发光器件的方法

    公开(公告)号：US08476090B2

    公开(公告)日：2013-07-02

    申请号：US12952760

    申请日：2010-11-23

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： H01L33/52 ,  H05K3/10

    CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

    摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。

    PACKAGE SUBSTRATE FOR PTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    35.
    发明申请
    PACKAGE SUBSTRATE FOR PTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 有权
    用于塑料元件的包装基材及其制造方法

    公开(公告)号：US20120225508A1

    公开(公告)日：2012-09-06

    申请号：US13418241

    申请日：2012-03-12

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/48

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE
    36.
    发明申请
    HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE 有权
    电源转换模块的散热装置

    公开(公告)号：US20120103589A1

    公开(公告)日：2012-05-03

    申请号：US13037803

    申请日：2011-03-01

    申请人： Young Ho Sohn ,  Kyu Bum Han ,  Young Jin Cho ,  Seog Moon Choi

    发明人： Young Ho Sohn ,  Kyu Bum Han ,  Young Jin Cho ,  Seog Moon Choi

    IPC分类号： F28F7/00

    CPC分类号： H05K7/209 ,  H05K7/20409

    摘要： Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.

    摘要翻译： 这里公开了一种用于电力转换模块的散热装置。 该装置包括壳体，高散热散热器和电路板。 壳体包括散热翅片单元，其散热片布置在彼此间隔预定间隔的位置处。 壳体在其中具有安装空间。 高散热散热器安装在外壳的安装空间中。 电路板耦合到壳体的下表面。 因此，可以减小散热装置的重量和尺寸。 此外，散热片和具有散热片的壳体同时散热，从而提高散热效率。 此外，在最佳设计中，高散热散热器位于与产生高热量的部分相对应的位置，从而可以使散热效率最大化。

    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    37.
    发明申请
    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
    加热基板及其制造方法

    公开(公告)号：US20110304990A1

    公开(公告)日：2011-12-15

    申请号：US12884058

    申请日：2010-09-16

    申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    IPC分类号： H05K7/20 ,  B32B38/04 ,  B32B38/10 ,  H05K1/00 ,  B32B37/02

    CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

    摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

    Light emitting diode package having anodized insulation layer and fabrication method therefor
    38.
    发明授权
    Light emitting diode package having anodized insulation layer and fabrication method therefor 有权
    具有阳极氧化绝缘层的发光二极管封装及其制造方法

    公开(公告)号：US08030762B2

    公开(公告)日：2011-10-04

    申请号：US11730966

    申请日：2007-04-05

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L23/34 ,  H01L33/00

    CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

    摘要翻译： 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

    Insulation structure for high temperature conditions and manufacturing method thereof
    39.
    发明授权
    Insulation structure for high temperature conditions and manufacturing method thereof 有权
    高温条件的绝缘结构及其制造方法

    公开(公告)号：US07998879B2

    公开(公告)日：2011-08-16

    申请号：US11723236

    申请日：2007-03-19

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L21/31

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

    摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

    摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。