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    Micro-scale part positioning by surface interlocking
    34.
    发明授权
    Micro-scale part positioning by surface interlocking 失效
    通过表面互锁的微尺寸部件定位

    公开(公告)号：US6029881A

    公开(公告)日：2000-02-29

    申请号：US796405

    申请日：1997-02-06

    Applicant: Pedro A. Chalco ,  Bruce Kenneth Furman ,  Raymond Robert Horton ,  Chandrasekhar Narayan

    Inventor： Pedro A. Chalco ,  Bruce Kenneth Furman ,  Raymond Robert Horton ,  Chandrasekhar Narayan

    IPC: B23K20/10 ,  H01L21/00

    CPC classification number: H01L21/67138 ,  B23K20/10 ,  B23K20/106 ,  B23K2201/38 ,  B23K2201/40

    Abstract: A principle of surface interlocking wherein the imperfections of two parallel surfaces deform and interlock under pressure. The surface interlocking enables the combination of a bridging element and a bonding tip of a diffusion bonding apparatus to pick up, transport, position at a unique location, and bond the bridging element in place to the conductors or pads. In the invention a single point bonding tip as part of a bonding apparatus is used to pick up the, to be, bridging metal object transport it to the bonding site and perform the entire bridging bonding operation all in one sequence of steps.

    Abstract translation: 表面互锁的原理，其中两个平行表面的缺陷在压力下变形和互锁。 表面互锁使得桥接元件和扩散接合装置的接合尖端的组合能够在独特的位置拾取，传输，定位，并将桥接元件固定到导体或焊盘上。 在本发明中，作为接合装置的一部分的单点接合尖端用于拾取桥接金属物体将其传送到接合位置，并且以一系列步骤完成整个桥接接合操作。

    Method for ultrasonic bonding flexible circuits
    35.
    发明授权
    Method for ultrasonic bonding flexible circuits 失效
    超声波接合柔性电路的方法

    公开(公告)号：US6019271A

    公开(公告)日：2000-02-01

    申请号：US893714

    申请日：1997-07-11

    Applicant: Brian John Hayden ,  Cuong Van Pham ,  Rosa Lynda Nuno ,  Mark Stephen Topping

    Inventor： Brian John Hayden ,  Cuong Van Pham ,  Rosa Lynda Nuno ,  Mark Stephen Topping

    IPC: B23K20/10 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  B23K1/06 ,  B23K31/02 ,  B32B31/16 ,  H05K1/16

    CPC classification number: H05K3/361 ,  B23K20/103 ,  B23K2201/38 ,  B23K2201/42 ,  H05K2201/10356 ,  H05K2203/0285 ,  H05K2203/1189 ,  H05K3/328 ,  H05K3/4084

    Abstract: A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor. The members are then held together until each joint solidifies, and then the horn and/or anvil are retracted.

    Abstract translation: 一种用于将至少两个导电构件20结合在一起的方法，其中每个构件包括具有相应接合区域24的至少一个金属22.至少一个构件在每个接合区域附近附着到每个相应导体上的金属接合材料26的沉积， 并且至少一个构件具有附接到每个相应接合区域的塑料元件28。 构件20定位在预定取向上，夹在超声波喇叭和砧座之间，压力和正交的超声能量被施加到其上，使得每个塑料元件28被加热，这再次熔化接合材料26.任何塑料元件 导体之间的材料被挤压掉，各导体22彼此接近，使得接合材料的熔融接头物理地接触每个相应的导体。 然后将构件保持在一起直到每个接头固化，然后将喇叭和/或砧座缩回。

    Method and device for contacting the winding wire of a coil
    37.
    发明授权
    Method and device for contacting the winding wire of a coil 失效
    用于接触线圈的绕组线的方法和装置

    公开(公告)号：US5908568A

    公开(公告)日：1999-06-01

    申请号：US836531

    申请日：1997-05-02

    Applicant: Michael Dittmann ,  Erich Vojta

    Inventor： Michael Dittmann ,  Erich Vojta

    IPC: B23K1/00 ,  B23K3/06 ,  H01F41/10 ,  H01R4/02 ,  H01R43/02 ,  B23K9/167

    CPC classification number: H01R43/0242 ,  B23K1/0008 ,  H01F41/10 ,  H01R4/023 ,  B23K2201/38

    Abstract: A connecting pin of a coil, which has an end section with an end section of a winding wire wound thereon with a plurality of turns, is initially provided with a drop of a fluxless soft solder and then arranged in the vicinity of the points of two opposite electrodes. An arc of a specific strength and duration is struck between the electrodes, so that the soft solder is fused and connects the winding wire to the connecting pin. The result is a fluxless soldering of the winding end in conjunction with low thermal loading of the coil former and of the connecting pin.

    Abstract translation: PCT No.PCT / DE95 / 01527 Sec。 371日期：1997年5月2日 102（e）日期1997年5月2日PCT提交1995年11月3日PCT公布。 公开号WO96 / 14647 日期1996年5月17日具有卷绕在其上的绕组线的端部具有多个匝的线圈的连接销最初设置有一滴无助焊剂软焊料，然后设置在 两个相对电极的点。 在电极之间产生特定的强度和持续时间的电弧，使软焊料熔化并将绕组线连接到连接销上。 结果是绕组端的无焊剂焊接以及线圈架和连接销的低热负荷。

    Technique for joining dissimilar sized electrical leads
    38.
    发明授权
    Technique for joining dissimilar sized electrical leads 失效
    连接不同尺寸电线的技术

    公开(公告)号：US5852872A

    公开(公告)日：1998-12-29

    申请号：US843477

    申请日：1997-04-16

    Applicant: Jeryle L. Walter ,  Terry Sheetz

    Inventor： Jeryle L. Walter ,  Terry Sheetz

    IPC: H01R4/02 ,  H01R43/02

    CPC classification number: H01R43/02 ,  H01R4/027 ,  B23K2201/38 ,  H01R4/021 ,  Y10T29/49179

    Abstract: An electrical joint is provided between first and second electrical leads having different inner diameters. It comprises an electrically conductive transition post including a disk-shaped a separation member, a first cylindrical mounting post having a first diameter integral with the separation member and extending away therefrom in a first direction, and a second cylindrical mounting post having a second diameter integral with the separation member and extending away therefrom in a second direction generally opposite the first direction. The separation member lies in a plane transverse to the longitudinal axis of the first and second mounting posts and has a diameter greater than that of either the first or the second mounting post. A first electrical lead is fittingly received on the first mounting post and a second electrical lead is fittingly received on the second mounting post. In each instance, the free ends of the electrical leads abut the separation member. Thereupon, the first and second electrical leads are welded to the first and second mounting posts, respectively, such that electrical continuity is achieved between the first and second electrical leads. In another embodiment, each of the first and second mounting posts may have a threaded outer peripheral surface for engageably receiving thereon an associated one of the electrical leads.

    Abstract translation: 在具有不同内径的第一和第二电引线之间设置电接头。 它包括导电过渡柱，其包括圆盘状的分离构件，第一圆柱形安装柱，其具有与分离构件一体的第一直径并沿着第一方向从其延伸;以及第二圆柱形安装柱，其具有第二直径积分 与分离构件并且在大致与第一方向相反的第二方向上从其间延伸。 分离构件位于横向于第一和第二安装柱的纵向轴线的平面中，并且具有大于第一或第二安装柱的直径的直径。 第一电引线被适配地容纳在第一安装柱上，并且第二电引线被适配地容纳在第二安装柱上。 在每种情况下，电引线的自由端邻接分离构件。 于是，第一和第二电引线分别焊接到第一和第二安装柱，使得在第一和第二电引线之间实现电连续性。 在另一个实施例中，第一和第二安装柱中的每一个可以具有螺纹的外周表面，用于可接合地在其上接收相关的一个电引线。

    Method for repair of metallization on circuit board substrates
    39.
    发明授权
    Method for repair of metallization on circuit board substrates 失效
    电路板基板上金属化修复方法

    公开(公告)号：US5814174A

    公开(公告)日：1998-09-29

    申请号：US664657

    申请日：1996-06-17

    Applicant: Stewart O. Fong

    Inventor： Stewart O. Fong

    IPC: B23K20/02 ,  H01L21/48 ,  H05K3/10 ,  H05K3/22 ,  H05K3/32 ,  H05K3/38 ,  H05K3/40 ,  B29C73/04 ,  B32B35/00

    CPC classification number: H05K3/103 ,  B23K20/023 ,  H01L21/4846 ,  H05K3/225 ,  B23K2201/38 ,  H05K2201/1028 ,  H05K2203/0191 ,  H05K2203/0195 ,  H05K2203/1115 ,  H05K2203/173 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4092 ,  Y10T29/49718

    Abstract: A method of repairing an area of metallization that has lifted from a circuit board substrate uses a dry film epoxy placed between the lifted metallization and the substrate. Downward pressure and heat are simultaneously applied to the lifted area to rebond it to the substrate. Both metallization pads and traces may be repaired with the method, and the resulting bond may be stronger than that originally present. When heated, the dry film epoxy will melt and cure very quickly, requiring no further processing. The method is particularly useful when repairing circuit boards intended for microwave circuitry, in which conductive ribbons are gap welded to metallization pads. A metallization pad repair operation may be combined with a ribbon attachment operation, accomplishing both with one gap welding operation. The gap welder provides the downward force and heat necessary to bond the ribbon and repair the lifted pad.

    Abstract translation: 修复从电路板基板提起的金属化区域的方法使用放置在提升的金属化和基板之间的干膜环氧树脂。 向下的压力和热量同时施加到提升区域以将其重新粘附到基底。 可以用该方法修复金属化焊盘和迹线，并且所得到的结合可能比原来存在的更强。 当加热时，干膜环氧树脂将非常快速地熔化和固化，不需要进一步处理。 该方法在修理用于微波电路的电路板时特别有用，其中导电带间隙焊接到金属化焊盘。 金属化板修复操作可以与色带附接操作组合，通过一次间隙焊接操作实现两者。 间隙焊机提供粘结带状物并修复提升垫所需的向下的力和热量。

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