公开(公告)号：US5336444A

公开(公告)日：1994-08-09

申请号：US890898

申请日：1992-05-29

Applicant: Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

Inventor： Jon A. Casey ,  Renuka S. Divakaruni ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Manfred Sammet

IPC: C04B37/00 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/46 ,  H01B1/00 ,  H01B1/02

CPC classification number: H05K1/092 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract translation: 一种用于陶瓷的新型金属填充通孔组合物。 可以将通孔组合物配制成具有接近于陶瓷材料的体积收缩率，从而克服了烧结时通孔（特别是铜填充的通孔）和陶瓷之间体积收缩失配的问题。 该新型通孔组合物表现出增强的对陶瓷的附着力。 还公开了通过控制新型通孔组合物的收缩并提高粘合性的烧结方法。

公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

Applicant: John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

Inventor： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC: H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC classification number: H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Abstract translation: 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US20140024465A1

公开(公告)日：2014-01-23

申请号：US13551693

申请日：2012-07-18

Applicant: Paul F. BODENWEBER ,  Jon A. CASEY ,  Chenzhou LIAN ,  Kathryn C. RIVERA ,  Kamal K. SIKKA

Inventor： Paul F. BODENWEBER ,  Jon A. CASEY ,  Chenzhou LIAN ,  Kathryn C. RIVERA ,  Kamal K. SIKKA

IPC: F24F7/04 ,  H05K7/20 ,  H05K13/00 ,  H05K5/02 ,  A63F11/00

CPC classification number: H05K1/0203 ,  H05K7/20127 ,  Y10T29/49002

Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

Abstract translation: 电子设备控制台包括容纳芯片封装的控制台主体和从控制台主体延伸的导管。 管道的内部容积与控制台主体的内部容积流体连通。 第一个排气口位于管道的远端。 第二个通风口位于控制台的墙壁上。 控制台可以在第一方向和第二方向上定向。 当控制台在第一方向上定向时，管道用作烟囱用于芯片封装的自然对流冷却。 当控制台朝向第二方位时，控制台主体用作烟囱用于芯片封装的自然对流冷却。

公开(公告)号：US08421217B2

公开(公告)日：2013-04-16

申请号：US13419949

申请日：2012-03-14

Applicant: Jon A. Casey ,  John S. Corbin, Jr. ,  David Danovitch ,  Isabelle Depatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

Inventor： Jon A. Casey ,  John S. Corbin, Jr. ,  David Danovitch ,  Isabelle Depatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

IPC: H01L23/12 ,  H01L23/34

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract translation: 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。

公开(公告)号：US20120175766A1

公开(公告)日：2012-07-12

申请号：US13419949

申请日：2012-03-14

Applicant: Jon A. Casey ,  John S. Corbin, JR. ,  David Danovitch ,  Isabelle Dépatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

Inventor： Jon A. Casey ,  John S. Corbin, JR. ,  David Danovitch ,  Isabelle Dépatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

IPC: H01L23/34

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract translation: 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。

公开(公告)号：US08214658B2

公开(公告)日：2012-07-03

申请号：US12194620

申请日：2008-08-20

Applicant: Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcolm S. Ware ,  Roger D. Weekly

Inventor： Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcolm S. Ware ,  Roger D. Weekly

IPC: G06F1/00

CPC classification number: G06F1/3203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system.

Abstract translation: 提供了数据处理系统中组件分层的缓解效应。 从数据处理系统中的一个或多个传感器接收信号。 确定信号是否指示已经达到或超过多个阈值中的一个阈值。 响应于指示已经达到或超过多个阈值中的一个阈值的信号，确定一个阈值是低温阈值还是高温阈值。 响应于一个阈值是低温阈值，开始多个动作之一以增加数据处理系统的温度，从而减轻数据处理系统中组件的分层影响。

公开(公告)号：US08202765B2

公开(公告)日：2012-06-19

申请号：US12357716

申请日：2009-01-22

Applicant: Jon A. Casey ,  John S. Corbin, Jr. ,  David Danovitch ,  Isabelle Depatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

Inventor： Jon A. Casey ,  John S. Corbin, Jr. ,  David Danovitch ,  Isabelle Depatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L23/04 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Abstract translation: 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。

公开(公告)号：US20100049995A1

公开(公告)日：2010-02-25

申请号：US12194620

申请日：2008-08-20

Applicant: Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcolm S. Ware ,  Roger D. Weekly

Inventor： Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcolm S. Ware ,  Roger D. Weekly

IPC: G06F1/00

CPC classification number: G06F1/3203 ,  G06F1/206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

Abstract: Mitigating effects of delamination of components in the data processing system is provided. A signal is received from one or more sensors in the data processing system. A determination is made as to whether the signal indicates that one threshold in a plurality of thresholds has been reached or exceeded. Responsive to the signal indicating that one threshold in the plurality of thresholds has been reached or exceeded, a determination is made as to whether the one threshold is a low temperature threshold or a high temperature threshold. Responsive to the one threshold being a low temperature threshold, one of a plurality of actions is initiated to increase a temperature of the data processing system thereby mitigating effects of delamination of the components in the data processing system.

Abstract translation: 提供了数据处理系统中组件分层的缓解效应。 从数据处理系统中的一个或多个传感器接收信号。 确定信号是否指示已经达到或超过多个阈值中的一个阈值。 响应于指示已经达到或超过多个阈值中的一个阈值的信号，确定一个阈值是低温阈值还是高温阈值。 响应于一个阈值是低温阈值，开始多个动作之一以增加数据处理系统的温度，从而减轻数据处理系统中组件的分层影响。

公开(公告)号：US20100049466A1

公开(公告)日：2010-02-25

申请号：US12194606

申请日：2008-08-20

Applicant: Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcom S. Ware ,  Roger D. Weekly

Inventor： Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcom S. Ware ,  Roger D. Weekly

IPC: G06F17/00 ,  G08B1/08

CPC classification number: G06F11/3058

Abstract: Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.

Abstract translation: 提供了组装过程中组装体验的温度偏移。 确定组件是否已经超出预定寿命目标的使用。 响应于组装不能超过预定寿命目标的服务，读取与组件相关联的新的温度值。 计算品质因数（FOM）值的修饰符值，并将其添加到累积品质因数值。 将累积的绩效值与累积压力的绩效预算进行比较。 响应累积绩效值超过累积压力的绩效预算数量，实施了一个确定的压力管理解决方案。

公开(公告)号：US07312523B2

公开(公告)日：2007-12-25

申请号：US11161285

申请日：2005-07-28

Applicant: Jean J. Audet ,  Jon A. Casey ,  Luc Guerin ,  David L. Questad ,  David J. Russell

Inventor： Jean J. Audet ,  Jon A. Casey ,  Luc Guerin ,  David L. Questad ,  David J. Russell

IPC: H01L23/053 ,  H01L23/12 ,  H01L23/48

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H01L2924/00

Abstract: A circuit board comprises a resin-filled plated (RFP) through-hole; a dielectric layer over the RFP through-hole; a substantially circular RFP cap in the dielectric layer and connected to an upper opening of the RFP through-hole; a via stack in the dielectric layer; and a plurality of via lands extending radially outward from the via stack, wherein each of the plurality of via lands is diametrically larger than the RFP cap. Preferably, the RFP cap comprises a diameter of at least 300 μm. Preferably, each of the via lands comprises a substantially circular shape having a diameter of at least 400 μm. Moreover, the circuit board further comprises a ball grid array pad connected to the via stack; and input/output ball grid array pads connected to the ball grid array pad. Additionally, the circuit board further comprises metal planes in the dielectric layer.

Abstract translation: 电路板包括填充树脂的电镀（RFP）通孔; 在RFP通孔上的电介质层; 电介质层中的大致圆形的RFP帽，并连接到RFP通孔的上部开口; 电介质层中的通孔叠层; 以及从所述通孔叠层径向向外延伸的多个通孔焊盘，其中所述多个通路焊盘中的每一个在径向上大于所述RFP盖。 优选地，RFP帽包括至少300μm的直径。 优选地，每个通孔焊盘包括具有至少400μm直径的基本圆形形状。 此外，电路板还包括连接到通孔叠层的球栅阵列垫; 以及连接到球栅阵列垫的输入/输出球栅阵列垫。 此外，电路板还包括电介质层中的金属平面。