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41.
公开(公告)号:US12041770B2
公开(公告)日:2024-07-16
申请号:US17562888
申请日:2021-12-27
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Masashi Ishida
CPC classification number: H10B41/35 , G11C16/0483 , H01L29/0649 , H10B41/10 , H10B41/27
Abstract: A field effect transistor includes a source region embedded in a semiconductor material layer, a drain region embedded in the semiconductor material layer and laterally spaced from the source region by a channel, a gate stack including a gate dielectric and a gate electrode, a shallow trench isolation portion embedded in an upper portion of the semiconductor material layer and contacting the drain region and the gate stack, and a concave drain extension region continuously extending underneath the shallow trench isolation portion from a bottom surface of the gate dielectric to a bottom surface of the drain region.
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公开(公告)号:US20240237346A1
公开(公告)日:2024-07-11
申请号:US18355888
申请日:2023-07-20
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Rahul SHARANGPANI , Raghuveer S. MAKALA , Adarsh RAJASHEKHAR , Fei ZHOU , Bing ZHOU , Senaka KANAKAMEDALA , Roshan Jayakhar TIRUKKONDA , Kartik SONDHI
IPC: H10B43/27 , H01L23/522 , H01L23/528 , H10B41/10 , H10B41/27 , H10B41/35 , H10B43/10 , H10B43/35
CPC classification number: H10B43/27 , H01L23/5226 , H01L23/5283 , H10B41/10 , H10B41/27 , H10B41/35 , H10B43/10 , H10B43/35
Abstract: A method of forming a memory device includes forming an alternating stack of insulating layers including a first insulating material and sacrificial material layers including a first sacrificial material over a substrate, forming a memory opening through the alternating stack, performing a first selective material deposition process that selectively grows a second sacrificial material from physically exposed surfaces of the sacrificial material layers to form a vertical stack of sacrificial material portions; forming a memory opening fill structure in the memory opening, where the memory opening fill structure includes a vertical stack of memory elements and a vertical semiconductor channel, and replacing a combination of the vertical stack of sacrificial material portions and the sacrificial material layers with electrically conductive layers.
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43.
公开(公告)号:US20240237343A9
公开(公告)日:2024-07-11
申请号:US18350552
申请日:2023-07-11
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Bing ZHOU , Monica TITUS , Raghuveer S. MAKALA , Rahul SHARANGPANI , Senaka KANAKAMEDALA
Abstract: A etch stop structure is formed a sacrificial memory opening fill structure formed within a first-tier memory opening vertically extending through a first-tier alternating stack of first insulating layers and first spacer material layers. The etch stop structure may include a conductive etch stop plate that is formed over a sacrificial memory opening fill material portion inside the first-tier memory opening, or may include a semiconductor plug which is selectively grown from sidewalls of an etch stop semiconductor material layer that is formed over the first-tier alternating stack. A second-tier alternating stack of second insulating layers and second spacer material layers is formed over the first-tier alternating stack and the etch stop structure.
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公开(公告)号:US20240233841A9
公开(公告)日:2024-07-11
申请号:US18357489
申请日:2023-07-24
Applicant: SanDisk Technologies LLC
Inventor: Abu Naser Zainuddin , Jiahui Yuan , Toru Miwa
CPC classification number: G11C16/3459 , G11C16/0483 , G11C16/08 , G11C16/10 , H01L25/0657
Abstract: A memory system programs memory cells connected to a selected word line by applying doses of programming and performing program-verify between doses. An efficient and low current program-verify operation includes: while scanning the results of a previous program-verify operation, ramp up voltages on the select lines for the next program-verify operation without waiting for the scan to complete and ramp up voltages on unselected word lines for the next program-verify operation following a step signal (so that voltage applied to the unselected word lines rise in steps) without waiting for the scan to complete.
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公开(公告)号:US12032837B2
公开(公告)日:2024-07-09
申请号:US17957424
申请日:2022-09-30
Applicant: SanDisk Technologies LLC
Inventor: Yuki Mizutani , Kazutaka Yoshizawa , Kiyokazu Shishido , Eiichi Fujikura
IPC: G06F3/06
CPC classification number: G06F3/0626 , G06F3/0629 , G06F3/0679
Abstract: A three dimensional non-volatile memory structure includes word lines connected to non-volatile memory cells arranged in blocks. A plurality of word line switches are connected to the word lines and one or more sources of voltage. The word line switches are arranged in groups of X word line switches such that each group of X word line switches is positioned in a line under Y blocks of non-volatile memory cells and has a length that is equal to the width of the Y blocks of non-volatile memory cells. To allow closer placement of word line switches that supply different blocks and support the possible large voltage differences between their transistors, word line switches supplying different blocks are formed over a single active region and separated by an intermediate control gate set to be off.
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公开(公告)号:US12027218B2
公开(公告)日:2024-07-02
申请号:US17554321
申请日:2021-12-17
Applicant: SanDisk Technologies LLC
Inventor: Xue Bai Pitner , Prafful Golani , Ravi Kumar
CPC classification number: G11C16/3459 , G11C16/0483 , G11C16/26 , H10B41/27 , H10B43/27
Abstract: A method for performing a program verify operation with respect to a target memory cell in a memory structure of a non-volatile memory system is provided. The method may include the step of determining a location of the target memory cell within the structure and, based upon the determined location of the target cell and with respect to each programmable memory state: (1) applying a first sense signal at a first point in time, and (2) applying a second sense signal at a second point in time. A time interval between the first and the second points in time is equal to a predetermined optimal time period plus or minus an offset parameter time value.
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公开(公告)号:US20240215244A1
公开(公告)日:2024-06-27
申请号:US18595730
申请日:2024-03-05
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Hiroyuki TANAKA , Masanori TSUTSUMI , Kento SAKANE , Teruo OKINA
CPC classification number: H10B43/27 , H01L24/08 , H01L25/0657 , H01L25/18 , H10B41/27 , H10B80/00 , H01L2224/08145 , H01L2924/1431 , H01L2924/14511
Abstract: A memory die includes an alternating stack of insulating layers and electrically conductive layers, a dielectric spacer layer underlying the alternating stack, memory opening vertically extending through the alternating stack, and through the dielectric spacer layer, a memory opening fill structure located in the memory opening and including a dielectric core, a vertical semiconductor channel having a hollow portion which surrounds the dielectric core and a pillar portion which does not surround the dielectric core, and a memory film, and a source layer located under the dielectric spacer layer and contacting the pillar portion of the vertical semiconductor channel.
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公开(公告)号:US20240212764A1
公开(公告)日:2024-06-27
申请号:US18355348
申请日:2023-07-19
Applicant: SanDisk Technologies LLC
Inventor: Parth Amin , Anubhav Khandelwal , Deepanshu Dutta
CPC classification number: G11C16/3445 , G11C16/14
Abstract: An apparatus is provided that includes a control circuit coupled to a plurality of non-volatile memory cells disposed in a plurality of planes. The control circuit is configured to concurrently erase a block of memory cells in each of the plurality of planes, determine that the concurrent erase failed, disconnect a first one of the planes from the plurality of planes to form first remaining planes, and concurrently erase a block of memory cells in each of the first remaining planes.
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公开(公告)号:US12020774B2
公开(公告)日:2024-06-25
申请号:US17832479
申请日:2022-06-03
Applicant: SanDisk Technologies LLC
Inventor: Sneha Bhatia , Sajal Mittal , Venkatesh Prasad Ramachandra , Anil Pai
CPC classification number: G11C7/222 , G11C7/1039 , G11C7/1063 , G11C7/109
Abstract: Systems and methods disclosed herein provide for selectively activating or deactivating one or more memory of a memory array, such that related data path logic of deactivated memory dies neither detects nor processes control signals or data signals for data operations. Examples of the systems and methods provided herein operate to detect a first enable signal at a memory die and detect a first data signal on input/output (I/O) receivers of the memory die. Responsive to detecting at least the first enable signal, a bit value encoded in the first data signal is latched to obtain a first bit pattern. A second bit pattern is obtained, and, based on a comparison of the first bit pattern to the second bit pattern, the I/O receivers of the memory die are activated.
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公开(公告)号:US20240206171A1
公开(公告)日:2024-06-20
申请号:US18352025
申请日:2023-07-13
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Masaaki HIGASHITANI , Peter RABKIN , Hiroyuki KINOSHITA , Satoshi SHIMIZU , Yanli ZHANG , Johann ALSMEIER
Abstract: A semiconductor structure includes a vertical stack of repetition units, where each instance of the repetition unit extends along a first horizontal direction and includes a first electrically conductive strip, a first memory film located over the first electrically conductive strip, discrete semiconductor channels that are laterally spaced apart from each other along the first horizontal direction and located above the first memory film, a second memory film located above the discrete semiconductor channels, a second electrically conductive strip located above the second memory film, and an insulating strip located above the first electrically conductive strip. Source/drain openings are arranged along the first horizontal direction, interlaced with the discrete semiconductor channels, and vertically extending through the vertical stack of repetition units, and source/drain pillar structures are located in respective source/drain openings, and vertically extending through the vertical stack of repetition units.
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