公开(公告)号：US20150137364A1

公开(公告)日：2015-05-21

申请号：US14470831

申请日：2014-08-27

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L23/31 ,  H01L25/11 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/00 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

公开(公告)号：US20150130081A1

公开(公告)日：2015-05-14

申请号：US14604545

申请日：2015-01-23

Applicant: Micron Technology, Inc.

Inventor： Choon Kuan Lee ,  Chin Hui Chong ,  David J. Corisis

IPC: H01L23/00 ,  H01L23/48

CPC classification number: H01L24/29 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/29005 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member, a first die attached to the support member, and a second die attached to the first die in a stacked configuration. The device can also include an attachment feature between the first and second dies. The attachment feature can be composed of a dielectric adhesive material. The attachment feature includes (a) a single, unitary structure covering at least approximately all of the back side of the second die, and (b) a plurality of interconnect structures electrically coupled to internal active features of both the first die and the second die.

公开(公告)号：US08963302B2

公开(公告)日：2015-02-24

申请号：US13898782

申请日：2013-05-21

Applicant: Micron Technology, Inc.

Inventor： David J. Corisis ,  Chin Hui Chong ,  Choon Kuan Lee

IPC: H01L23/495 ,  H01L23/13 ,  H01L23/24 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A device is disclosed which includes a first packaged integrated circuit device, a second packaged integrated circuit device positioned above the first packaged integrated circuit device and a plurality of planar conductive members conductively coupling the first and second packaged integrated circuit devices to one another. A method is also disclosed which includes conductively coupling a plurality of extensions on a leadframe to each of a pair of stacked packaged integrated circuit devices and cutting the leadframe to singulate the extensions from one another.

Abstract translation: 公开了一种装置，其包括第一封装集成电路器件，位于第一封装集成电路器件上方的第二封装集成电路器件以及将第一和第二封装集成电路器件彼此导电耦合的多个平面导电元件。 还公开了一种方法，其包括将引线框上的多个延伸部导电地耦合到一对堆叠封装的集成电路器件中的每一个并切割引线框架以将延伸部彼此分离。

公开(公告)号：US20140346683A1

公开(公告)日：2014-11-27

申请号：US14457000

申请日：2014-08-11

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Edmund Koon Tian Lua ,  See Hiong Leow ,  Choon Kuan Lee

IPC: H01L23/16 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/16 ,  H01L21/50 ,  H01L23/498 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48477 ,  H01L2224/49174 ,  H01L2224/4942 ,  H01L2224/49421 ,  H01L2224/73265 ,  H01L2224/83138 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Stacked microelectronic devices and methods of manufacturing stacked microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a plurality of electrically isolated, multi-tiered metal spacers on a front side of a first microelectronic die, and attaching a back-side surface of a second microelectronic die to individual metal spacers. In another embodiment, the method of manufacturing the microelectronic device may further include forming top-tier spacer elements on front-side wire bonds of the first die.

Abstract translation: 堆叠的微电子器件和制造堆叠的微电子器件的方法在本文中公开。 在一个实施例中，一种制造微电子器件的方法包括在第一微电子管芯的正面上形成多个电绝缘的多层金属间隔物，并将第二微电子管芯的背面附接到各个金属间隔件 。 在另一个实施例中，制造微电子器件的方法还可以包括在第一管芯的前侧引线接合处形成顶层隔离元件。

公开(公告)号：US08823159B2

公开(公告)日：2014-09-02

申请号：US13933607

申请日：2013-07-02

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L23/02

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/00 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

Abstract translation: 本文描述了微电子器件，堆叠的微电子器件以及用于制造微电子器件的方法。 在一个实施例中，一组堆叠的微电子器件包括（a）具有第一侧和与第一侧相对的第二侧的第一微电子管芯，（b）附接到第一微电子管芯的第一侧的第一衬底， （c）附接到第一微电子管芯的第二侧的第二衬底，（d）附接到第二衬底的多个电耦合器，（e）耦合到电耦合器的第三衬底，以及 （f）附接到第三基板的第二微电子管芯。 电耦合器被定位成使得至少一些电耦合器在第一微电子管芯内。

公开(公告)号：US08803307B2

公开(公告)日：2014-08-12

申请号：US13934536

申请日：2013-07-03

Applicant: Micron Technology, Inc.

Inventor： Edmund Koon Tian Lua ,  See Hiong Leow ,  Choon Kuan Lee

IPC: H01L23/02

CPC classification number: H01L23/16 ,  H01L21/50 ,  H01L23/498 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48477 ,  H01L2224/49174 ,  H01L2224/4942 ,  H01L2224/49421 ,  H01L2224/73265 ,  H01L2224/83138 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Stacked microelectronic devices and methods of manufacturing stacked microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a plurality of electrically isolated, multi-tiered metal spacers on a front side of a first microelectronic die, and attaching a back-side surface of a second microelectronic die to individual metal spacers. In another embodiment, the method of manufacturing the microelectronic device may further include forming top-tier spacer elements on front-side wire bonds of the first die.

Abstract translation: 堆叠的微电子器件和制造堆叠的微电子器件的方法在本文中公开。 在一个实施例中，一种制造微电子器件的方法包括在第一微电子管芯的正面上形成多个电绝缘的多层金属间隔物，并将第二微电子管芯的背面附接到各个金属间隔件 。 在另一个实施例中，制造微电子器件的方法还可以包括在第一管芯的前侧引线接合处形成顶层隔离元件。