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公开(公告)号：US20110277322A1
公开(公告)日：2011-11-17
申请号：US13187995
申请日：2011-07-21
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
IPC: H01K3/10
CPC classification number: H05K3/4691 , H05K1/0366 , H05K3/0052 , H05K3/4602 , H05K3/4652 , H05K2201/0191 , H05K2201/0209 , H05K2201/091 , H05K2201/09563 , H05K2201/096 , H05K2201/09845 , H05K2203/1536
Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.
Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。
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公开(公告)号：US20110176284A1
公开(公告)日：2011-07-21
申请号：US13079243
申请日：2011-04-04
Applicant: Sotaro ITO , Michimasa Takahashi , Yukinobu Mikado
Inventor： Sotaro ITO , Michimasa Takahashi , Yukinobu Mikado
IPC: H05K1/18
CPC classification number: H05K1/0218 , H01L23/49822 , H01L23/5389 , H01L23/552 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/2402 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15331 , H01L2924/15788 , H01L2924/3025 , H01L2924/3511 , H05K1/183 , H05K1/185 , H05K3/4652 , H05K2201/09981 , H05K2203/0733 , Y10T29/49155 , H01L2924/00
Abstract: A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.
Abstract translation: 一种多层印刷电路板，其中，在容纳半导体元件的树脂绝缘层上，另一树脂绝缘层和导体电路形成有通过通孔电连接的导体电路，其中电磁屏蔽层形成在 环绕用于容纳半导体元件的凹部或凹部的内壁面的树脂绝缘层，并且半导体元件嵌入在凹部中。
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公开(公告)号：US20090283301A1
公开(公告)日：2009-11-19
申请号：US12453627
申请日：2009-05-18
Applicant: Michimasa Takahashi
Inventor： Michimasa Takahashi
CPC classification number: H05K3/4691 , H05K1/0218 , H05K1/142 , H05K3/36 , H05K3/4602 , H05K2201/0187 , H05K2201/0715 , H05K2201/0909 , H05K2201/09127 , H05K2201/096
Abstract: A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.
Abstract translation: 一种布线基板，包括具有基材的主基板和形成在基材上的导电图案，以及柔性刚性印刷布线板，其设置在主基板上，并具有彼此连接的刚性基板和柔性基板。 柔性刚性印刷线路板具有形成在刚性基板和/或柔性基板上的导电图案。 主基板的导电图形电连接到柔性刚性印刷线路板的导电图案。
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公开(公告)号：US20090229876A1
公开(公告)日：2009-09-17
申请号：US12401141
申请日：2009-03-10
Applicant: Michimasa Takahashi
Inventor： Michimasa Takahashi
CPC classification number: H05K3/4691 , H05K1/0218 , H05K3/4602 , H05K3/4652 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , H05K2201/09563 , Y10T29/49124 , Y10T29/49155
Abstract: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.
Abstract translation: 柔性布线板包括：形成有导体图案的第一柔性基底材料，邻近第一柔性基底材料设置的第二柔性基底材料和覆盖第一柔性基底材料和第二柔性基底材料的绝缘层。 绝缘层暴露第一柔性基材的至少一部分。 在绝缘层上形成导体图案，并且在绝缘层上连接第一柔性基底材料的导体图形和导体图案的镀层。
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公开(公告)号：US20080185172A1
公开(公告)日：2008-08-07
申请号：US11844788
申请日：2007-08-24
Applicant: Michimasa Takahashi , Yukinobu Mikado , Hiroyuki Yanagisawa
Inventor： Michimasa Takahashi , Yukinobu Mikado , Hiroyuki Yanagisawa
CPC classification number: H05K1/167 , H05K3/205 , H05K3/4644 , H05K2201/0376 , H05K2201/09736 , H05K2203/1453
Abstract: A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to one or more electrodes. The insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the external connection conductive pattern is separated by a space from the resistor.
Abstract translation: 印刷电路板包括具有表面的绝缘层，嵌入在绝缘层中的电极，形成在绝缘层的表面上并电连接到电极的电阻器，以及形成在绝缘层表面上的外部连接导电图案 并电连接到一个或多个电极。 绝缘层和电极在绝缘层的表面上形成部件安装表面，部件安装表面与绝缘层的表面基本平齐，并且包括形成电阻器的电阻器形成区域，并且 外部连接导体图案与电阻器隔开一个空间。
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Patent Agency Ranking
公开(公告)号：US20070096328A1
公开(公告)日：2007-05-03
申请号：US11480824
申请日：2006-07-06
Applicant: Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
Inventor： Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
CPC classification number: H01L23/48 , H01L2924/0002 , H05K1/115 , H05K3/00 , H05K3/4602 , H05K3/4652 , H05K2201/0352 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09827 , Y10T29/49124 , H01L2924/00
Abstract: A multilayer printed wiring board comprises a plurality of insulating layers which is about 100 μm or less in thickness and a plurality of conductor circuits formed on the insulating layers. Each of a plurality of viaholes electrically connecting conductor circuits on the insulating layers to each other is formed tapered inwardly from the surface of the insulating layer and the viaholes are disposed opposite to each other to form a multistage stacked vias.
Abstract translation: 多层印刷线路板包括多个厚度为100μm以下的绝缘层和在绝缘层上形成的多个导体电路。 将绝缘层上的导体电路彼此电连接的多个通孔中的每一个从绝缘层的表面向内形成为锥形，并且通孔彼此相对设置以形成多级堆叠通孔。
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公开(公告)号：US09271405B2
公开(公告)日：2016-02-23
申请号：US13562895
申请日：2012-07-31
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
CPC classification number: H05K3/4691 , H05K1/0218 , H05K3/0035 , H05K3/4069 , H05K3/4602 , H05K3/4652 , H05K3/4664 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , H05K2201/096 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: A method of manufacturing a flex-rigid wiring board includes positioning a flexible board and a non-flexible substrate adjacent to each other, forming a metal layer over the flexible board such that the metal layer is formed to stop laser irradiation from reaching into the flexible board, forming an insulating layer such that the insulating layer covers the metal layer, the flexible board and the non-flexible substrate, irradiating laser upon the insulating layer such that a portion of the insulating layer covering the metal layer is cut; and removing the portion of the insulating layer covering the metal layer from the flexible board such that at least a portion of the flexible board is exposed.
Abstract translation: 制造柔性刚性布线板的方法包括将柔性基板和非柔性基板彼此相邻地定位，在柔性基板上形成金属层，使得形成金属层以停止激光照射到达柔性 形成绝缘层，使得绝缘层覆盖金属层，柔性板和非柔性基板，将激光照射在绝缘层上，使得覆盖金属层的绝缘层的一部分被切割; 以及从柔性板移除覆盖金属层的绝缘层的部分，使得柔性板的至少一部分露出。
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公开(公告)号：US09215811B2
公开(公告)日：2015-12-15
申请号：US13629832
申请日：2012-09-28
Applicant: Michimasa Takahashi , Nobuyuki Naganuma , Toshinobu Asai , Teruyuki Ishihara
Inventor： Michimasa Takahashi , Nobuyuki Naganuma , Toshinobu Asai , Teruyuki Ishihara
CPC classification number: H05K3/0097 , H05K3/0052 , H05K2201/2072 , H05K2203/0169 , H05K2203/107 , H05K2203/162 , H05K2203/175 , Y10T29/49126
Abstract: A method for manufacturing a multi-piece substrate includes preparing a first frame having a connecting portion to which a first piece substrate is to be connected, forming on a portion of the first piece substrate connected to a second frame a conductive pattern having a contour corresponding to the periphery of the connecting portion of the first frame, irradiating laser along the boundary between the second frame and the conductive pattern on the first piece substrate such that the first piece substrate having a joint portion which engages with the connecting portion of the first frame is detached from the second frame, and fitting the joint portion of the first piece substrate into the connecting portion of the first frame such that the first piece substrate is connected to the first frame.
Abstract translation: 一种制造多片衬底的方法包括：制备具有连接第一片衬底的连接部分的第一框架，在与第二框架连接的第一片衬底的一部分上形成具有相应轮廓的导电图案 到第一框架的连接部分的周边，沿着第一框架和第二基板上的导电图案之间的边界照射激光，使得第一基板具有与第一框架的连接部分接合的接合部分 与第二框架分离，并且将第一部件基板的接合部分装配到第一框架的连接部分中，使得第一部件基板连接到第一框架。
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公开(公告)号：US09084381B2
公开(公告)日：2015-07-14
申请号：US13297311
申请日：2011-11-16
Applicant: Michimasa Takahashi
Inventor： Michimasa Takahashi
CPC classification number: H05K3/4697 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/3025 , H05K1/0218 , H05K1/183 , H05K3/4602 , H05K3/4652 , H05K3/4664 , H05K3/4691 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , H05K2201/09536 , H05K2203/308 , Y10T29/49124 , Y10T29/49158 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate.
Abstract translation: 一种柔性刚性布线板的制造方法，其特征在于，具备形成刚性基材的刚性基材，设置在所述刚性基材上的隔膜，以及在隔膜之后层叠在所述刚性基材上的绝缘层， 在层压绝缘层之后的绝缘层的一部分，并且形成凹部，该凹部被构造成在刚性基板的表面上根据隔板的形状容纳电子部件。
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公开(公告)号：US09066439B2
公开(公告)日：2015-06-23
申请号：US13483587
申请日：2012-05-30
Applicant: Hiroshi Segawa , Nobuyuki Naganuma , Michimasa Takahashi , Teruyuki Ishihara
Inventor： Hiroshi Segawa , Nobuyuki Naganuma , Michimasa Takahashi , Teruyuki Ishihara
CPC classification number: H05K1/141 , H05K1/142 , H05K3/305 , H05K3/3452 , H05K3/368 , H05K2201/09972 , H05K2203/1189 , Y10T29/49126
Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.
Abstract translation: 布线基板具有第一布线基板，其具有第一阻焊层，第二布线基板与第一布线基板连接，位于形成于第一布线基板的第一阻焊层的第一开口部， 连接到第一布线板并且位于形成在第一布线板的第一阻焊层中的第二开口部分中，使得第二布线板和第三布线板位于第一布线板的同一侧。 第一布线板的第一开口部分和第一布线板的第二开口部分形成在第一阻焊层中容纳第二和第三布线板的公共开口部分或分离容纳第二布线板的单独开口部分， 第一阻焊层中的第三布线板。
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