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    LIGHT SOURCE DEVICE
    41.
    发明申请
    LIGHT SOURCE DEVICE 审中-公开

    公开(公告)号：US20180287334A1

    公开(公告)日：2018-10-04

    申请号：US15939219

    申请日：2018-03-28

    Applicant: NICHIA CORPORATION

    Inventor： Tadaaki MIYATA ,  Yoshihiro KIMURA

    IPC: H01S5/022 ,  H01S5/40 ,  H01S5/22 ,  H01S5/02

    CPC classification number: H01S5/02208 ,  H01S5/0071 ,  H01S5/0215 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/221 ,  H01S5/4087

    Abstract: Provided is a light source device, including: a base member; a semiconductor laser disposed on the base member; a lateral wall portion formed so as to surround the semiconductor laser; a light-transmissive lid covering a gap surrounded by the base member and the lateral wall portion; and a connection member that airtightly connects an upper surface of the lateral wall portion and a lower surface of the lid over an entire perimeter of the lateral wall portion. The lateral wall portion has a reflecting surface which is an inside surface connected to an upper surface, the reflecting surface being inclined so that light emitted from the semiconductor laser is reflected toward the lid. A dielectric film is continuously formed on the reflecting surface and the upper surface. A height of the connection member is greater than a height of the dielectric film formed on the upper surface.

    LIGHT SOURCE DEVICE
    42.
    发明申请
    LIGHT SOURCE DEVICE 审中-公开

    公开(公告)号：US20180003362A1

    公开(公告)日：2018-01-04

    申请号：US15635609

    申请日：2017-06-28

    Applicant: NICHIA CORPORATION

    Inventor： Tadaaki MIYATA

    IPC: F21V7/22 ,  F21V23/00

    CPC classification number: F21V7/22 ,  F21V23/001 ,  F21Y2115/30 ,  G02B6/00 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02228 ,  H01S5/02276 ,  H01S5/0228 ,  H01S2301/176

    Abstract: A light source device includes a substrate having a principal surface, a light-transmitting member arranged over the principal surface of the substrate, and a laser light source arranged on the principal surface of the substrate at a portion in the bottom recess. The light-transmitting member has a lower surface that faces the principal surface of the substrate, an upper surface opposite to the lower surface, and a bottom recess opening downward. The laser light source is arranged on the principal surface of the substrate so that an optical axis of a laser beam emitted from the laser light source is substantially parallel to the principal surface of the substrate. At least a portion of the upper surface of the light-transmitting member is covered with an upper light reflection coat. At least a portion of the lower surface of the light-transmitting member is covered with a lower light reflection coat.

    LIGHT SOURCE DEVICE
    43.
    发明申请
    LIGHT SOURCE DEVICE 审中-公开

    公开(公告)号：US20170227175A1

    公开(公告)日：2017-08-10

    申请号：US15427571

    申请日：2017-02-08

    Applicant: NICHIA CORPORATION

    Inventor： Tadaaki MIYATA

    IPC: F21K9/62 ,  F21V3/04

    CPC classification number: F21V7/0008 ,  F21Y2113/10 ,  F21Y2115/30 ,  H01S5/0071 ,  H01S5/02208 ,  H01S5/02252 ,  H01S5/02292 ,  H01S5/4031 ,  H01S5/4093

    Abstract: A light source device includes a package, one or more semiconductor lasers each having an emission surface, a light-transmissive cover, and an optical member. The package includes an inner bottom surface and inner lateral surfaces, and a recess defined by the inner bottom surface and the inner lateral surfaces and having an open end. The one or more semiconductor lasers are arranged on the inner bottom surface. The light-transmissive cover covers the open end of the recess. The optical member is arranged on an upper surface of the cover and is configured to mix light. The one or more semiconductor lasers are arranged so that their emission surfaces are respectively oblique to their adjacent inner lateral surface when viewed from above, and the inner lateral surface has a reflecting region arranged inclined with respect to the bottom surface.

    LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    45.
    发明申请
    LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    发光装置及其制造方法

    公开(公告)号：US20160049388A1

    公开(公告)日：2016-02-18

    申请号：US14928009

    申请日：2015-10-30

    Applicant: NICHIA CORPORATION

    Inventor： Yukitoshi MARUTANI ,  Hiroto TAMAKI ,  Tadaaki MIYATA

    IPC: H01L25/075 ,  H01L33/60 ,  H01L33/50 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16

    Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

    Abstract translation: 发光装置可以包括基板，固定到基板的电线和安装到电线的多个发光二极管。 根据一个实施例，多个发光二极管中的每一个是LED芯片，并且基板上的发光二极管被一个或多个密封构件单独地或共同地密封。 根据另一实施例，基板具有多个通孔，其中设置在基板的背面侧的电线的多个部分与基板的表面侧在基板的多个通孔处连通 并且其中多个发光二极管分别安装到与基板的前表面侧连通的电线的各个部分。 其他实施例涉及制造发光器件的方法。

    LIGHT EMITTING DEVICE
    47.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20150084073A1

    公开(公告)日：2015-03-26

    申请号：US14565045

    申请日：2014-12-09

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Tadaaki MIYATA ,  Naoki MORI

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L27/15

    CPC classification number: H01L33/56 ,  F21S4/22 ,  F21Y2101/00 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/32 ,  H01L33/483 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09363 ,  H05K2201/10106

    Abstract: A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion.

    Abstract translation: 发光器件包括发光元件和包括柔性基底，多个布线部分，凹槽部分和反射层的基底。 柔性基部沿对应于基板纵向的第一方向延伸。 布线部分布置在柔性基座上。 沟槽部分形成在彼此间隔开的布线部分之间。 槽部包括沿与第一方向交叉的第二方向延伸的第一槽部。 反射层设置在多个布线部分上。 发光元件设置在反射层附近并电连接到多个布线部分。 发光元件与第一槽部间隔开。

    WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME
    48.
    发明申请
    WIRING BOARD AND LIGHT EMITTING DEVICE USING SAME 有权
    使用相同的接线板和发光装置

    公开(公告)号：US20140334164A1

    公开(公告)日：2014-11-13

    申请号：US14271557

    申请日：2014-05-07

    Applicant: NICHIA CORPORATION

    Inventor： Tadaaki MIYATA

    IPC: H05K1/02 ,  F21V23/00

    CPC classification number: H05K1/0256 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09727 ,  H05K2201/10106

    Abstract: A wiring board includes an insulated substrate, a wiring pattern and a folded part. The insulated substrate has an elongated shape with shorter sides extending along a width direction. The wiring pattern is provided on the substrate. The wiring pattern extends between both ends in the width direction of the substrate, and has an exposed part exposed at at least one of the ends of the substrate. In the folded part, the exposed part of the wiring pattern and the substrate are integrally folded up inwardly toward an upper face side of the substrate at each of the ends of the substrate.

    Abstract translation: 布线板包括绝缘基板，布线图案和折叠部分。 绝缘基板具有细长形状，其较短边沿宽度方向延伸。 布线图案设置在基板上。 布线图案在基板的宽度方向上的两端之间延伸，并且在基板的至少一个端部具有暴露部分。 在折叠部分中，布线图案和基板的暴露部分在基板的每个端部向内朝向基板的上表面侧一体地折叠。

    LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    49.
    发明申请
    LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号：US20140061684A1

    公开(公告)日：2014-03-06

    申请号：US14015171

    申请日：2013-08-30

    Applicant: NICHIA CORPORATION

    Inventor： Yukitoshi MARUTANI ,  Hiroto TAMAKI ,  Tadaaki MIYATA

    IPC: H01L33/62

    CPC classification number: H01L25/0753 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16

    Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.

    Abstract translation: 发光装置可以包括基板，固定到基板的电线和安装到电线的多个发光二极管。 根据一个实施例，多个发光二极管中的每一个是LED芯片，并且基板上的发光二极管被一个或多个密封构件单独地或共同地密封。 根据另一实施例，基板具有多个通孔，其中设置在基板的背面侧的电线的多个部分与基板的表面侧在基板的多个通孔处连通 并且其中多个发光二极管分别安装到与基板的前表面侧连通的电线的各个部分。 其他实施例涉及制造发光器件的方法。

    LIGHT EMITTING DEVICE
    50.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20140008694A1

    公开(公告)日：2014-01-09

    申请号：US13936399

    申请日：2013-07-08

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Tadaaki MIYATA ,  Naoki MORI

    IPC: H01L33/48

    CPC classification number: H01L33/56 ,  F21S4/22 ,  F21Y2101/00 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/32 ,  H01L33/483 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09363 ,  H05K2201/10106

    Abstract: A light emitting device that includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion between the plurality of wiring portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the base. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The sealing resin member is spaced apart from a first groove portion of the groove portion, the first groove portion extending in a second direction intersecting the first direction.

    Abstract translation: 一种发光器件，包括衬底，发光元件和密封树脂构件。 基板包括柔性基座，多个布线部分和多个布线部分之间的槽部分。 柔性基部沿着与基板的纵向方向对应的第一方向延伸，并且多个布线部分布置在基部上。 发光元件设置在基板上并电连接到多个布线部分。 密封树脂构件密封发光元件和基板的一部分。 密封树脂部件与槽部的第一槽部分隔开，第一槽部沿与第一方向交叉的第二方向延伸。

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