公开(公告)号：US06889428B2

公开(公告)日：2005-05-10

申请号：US10617339

申请日：2003-07-10

申请人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Takeshi Nakamura ,  Yoshiyuki Kobayashi

发明人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Takeshi Nakamura ,  Yoshiyuki Kobayashi

IPC分类号： C25D5/02 ,  C25D7/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/04 ,  H01L25/18 ,  H05K3/30

CPC分类号： H01L21/4832 ,  C25D5/026 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/97 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/3754 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/84 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the surface of the conductive foil. The resin film of parts which become bonding pads and die pads is eliminated by a laser etching. A clamper presses of the periphery of the block so as to form hermetically sealed spaces on the block. The interior of the clamper is filled with a plating liquid by means of an injection means and an evacuation means, and subsequently, and Ag plated film is formed by an electroplating method.

摘要翻译： 本发明是在导电箔上形成大面积精密电镀膜，简化了镀膜的形成工序。 在导电箔的表面上形成由热固性树脂构成的树脂膜。 通过激光蚀刻消除了成为接合焊盘和管芯焊盘的部件的树脂膜。 块体的周边的夹持器压制以在块上形成密封的空间。 夹持器的内部通过注射装置和排气装置填充电镀液，随后通过电镀法形成Ag镀膜。

公开(公告)号：US06730933B1

公开(公告)日：2004-05-04

申请号：US09536898

申请日：2000-03-28

申请人： Hisashi Shimizu ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi

发明人： Hisashi Shimizu ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi

IPC分类号： H01L2715

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency, reduction of the size and weight, and prevention of temporal changes are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. A transparent substrate 50 is bonded via a seal 51, and temporal changes of a light emitting element 10 and electrodes which are sealed therein are suppressed.

摘要翻译： 在其中将发光元件附着在印刷电路板上的光照射装置中，提高了散热性能，并且实现了发光效率的提高，尺寸和重量的减小以及防止时间变化。 在金属基板11上形成被Ni覆盖的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。透明基板50通过密封件51接合，发光元件10的时间变化和密封在其中的电极被抑制 。

公开(公告)号：US06548832B1

公开(公告)日：2003-04-15

申请号：US09536921

申请日：2000-03-28

申请人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Hisashi Shimizu ,  Susumu Ota ,  Yoshiyuki Kobayashi

IPC分类号： H01L3300

CPC分类号： H01L25/0753 ,  F21V29/00 ,  F21Y2115/10 ,  H01L33/52 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48472 ,  H01L2924/12041 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved. When a circuit is configured in one region of a hybrid integrated circuit substrate, a position recognition mark 53 and a flow stop 57 are disposed in the open region. Also the region is covered with Ni so as to function as reflecting means.

摘要翻译： 在其中发光元件附着在印刷电路板上的光照射装置中，散热性能得到提高，并且实现了发光效率的提高和尺寸和重量的降低。 在金属基板11上形成覆盖有Ni的Cu图案。发光元件11以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光元件形成透镜37，从而可以进一步提高发光效率。当在混合集成电路基板的一个区域中配置电路时，将位置识别标记53和流动停止器57设置在 开放区域。 此外，该区域被Ni覆盖，以起到反射装置的作用。

公开(公告)号：US07141509B2

公开(公告)日：2006-11-28

申请号：US10824966

申请日：2004-04-14

申请人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

发明人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

IPC分类号： H01L21/302

CPC分类号： H01L21/4857 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A method for fabricating a circuit device includes preparing a laminating sheet comprising a conductive film, insulation resin formed on the surface of the conductive film, and a first conductive path layer formed on the surface of the insulation resin. Semiconductor elements are adhered and fixed on the first conductive path layer. A sealing resin is provided as an overcoat to the first conductive path layer and the semiconductor elements. The method includes forming a second conductive path layer by etching the conductive film into a predetermined pattern and forming an external electrode at predetermined points of the second conductive path layer.

摘要翻译： 一种制造电路器件的方法包括制备包括导电膜，形成在导电膜表面上的绝缘树脂和形成在绝缘树脂表面上的第一导电通路层的层压片。 半导体元件被粘附并固定在第一导电路径层上。 作为外涂层设置密封树脂到第一导电路径层和半导体元件。 该方法包括通过将导电膜蚀刻成预定图案形成第二导电通路层，并在第二导电通路层的预定点形成外部电极。

公开(公告)号：US20060220189A1

公开(公告)日：2006-10-05

申请号：US11393531

申请日：2006-03-29

申请人： Noriaki Sakamoto ,  Chikara Kaneta ,  Yoshihiko Yanase ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Chikara Kaneta ,  Yoshihiko Yanase ,  Yoshiyuki Kobayashi

IPC分类号： H01L23/495

CPC分类号： H01L25/162 ,  G01D11/245 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/284 ,  H05K3/328 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit board on which semiconductor elements is exposed upward; a sensor which is mounted on the back surface of the circuit board; and a thin metallic wire which electrically connects the circuit board with the leads. The island, the resin sealing body, the sensor, and parts of the leads are sealed by a second sealing resin.

摘要翻译： 根据本发明的半导体模块包括：由导电材料形成的岛; 设置在岛附近的多个引线; 树脂密封体，其安装在岛上并且设置成使得半导体元件向上露出的电路板的背面; 安装在电路板背面的传感器; 以及将电路板与引线电连接的细金属线。 岛，树脂密封体，传感器和引线的一部分被第二密封树脂密封。

公开(公告)号：US06664138B2

公开(公告)日：2003-12-16

申请号：US10172419

申请日：2002-06-14

申请人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

发明人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

IPC分类号： H01L2150

CPC分类号： H01L23/3128 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method for fabricating a circuit device is provided. An insulation resin sheet having the first conductive layer 3 and the second conductive layer 4 adhered to each other by insulation resin 2 is used, the first conductive path layer 5 is formed by the first conductive layer 3, and semiconductor elements 7 are adhered to and fixed on overcoating resin 8 that covers the first conductive path layer 5, thereby freely routing the first conductive path layer 5 having fine patterns below the semiconductor elements 7. Furthermore, the second conductive layer 4 that has been formed to be thick is removed after a package is sealed with a sealing resin layer 13, and external electrodes 14 are formed in through holes of the insulation resin 2.

摘要翻译： 提供一种制造电路装置的方法。 使用具有通过绝缘树脂2彼此粘合的第一导电层3和第二导电层4的绝缘树脂片，第一导电路径层5由第一导电层3形成，并且半导体元件7粘附到 固定在覆盖第一导电通路层5的外涂层树脂8上，由此在半导体元件7下方自由地布置具有精细图案的第一导电通路层5.此外，已经形成为厚的第二导电层4在 封装用密封树脂层13密封，外部电极14形成在绝缘树脂2的通孔中。

公开(公告)号：US07332808B2

公开(公告)日：2008-02-19

申请号：US11393531

申请日：2006-03-29

申请人： Noriaki Sakamoto ,  Chikara Kaneta ,  Yoshihiko Yanase ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Chikara Kaneta ,  Yoshihiko Yanase ,  Yoshiyuki Kobayashi

IPC分类号： H01L23/34

CPC分类号： H01L25/162 ,  G01D11/245 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L25/165 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/284 ,  H05K3/328 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit board on which semiconductor elements is exposed upward; a sensor which is mounted on the back surface of the circuit board; and a thin metallic wire which electrically connects the circuit board with the leads. The island, the resin sealing body, the sensor, and parts of the leads are sealed by a second sealing resin.

摘要翻译： 根据本发明的半导体模块包括：由导电材料形成的岛; 设置在岛附近的多个引线; 树脂密封体，其安装在岛上并且设置成使得半导体元件向上露出的电路板的背面; 安装在电路板背面的传感器; 以及将电路板与引线电连接的细金属线。 岛，树脂密封体，传感器和引线的一部分被第二密封树脂密封。

公开(公告)号：US06936927B2

公开(公告)日：2005-08-30

申请号：US10171824

申请日：2002-06-14

申请人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

发明人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

IPC分类号： H05K3/42 ,  H01L23/12 ,  H01L23/14 ,  H01L23/48 ,  H01L23/498 ,  H05K3/06 ,  H01L23/52 ,  H01L23/053 ,  H01L29/40

CPC分类号： H01L24/97 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A circuit device and a method for fabrication the same is provided. An insulation resin sheet in which the first conductive layer 3 and the second conductive layer 4 are adhered to each other by insulation resin 2 is used. The first conductive path layer 5 is formed by the first conductive layer 3, the second conductive path layer 6 is formed by the second conductive layer 4, and both of the conductive path layers are connected by multi-layer connecting means 12. Since a semiconductor element 7 is adhered to and fixed on overcoating resin 8 that covers the first conductive path layer 5, a multi-layer connection structure can be achieved by the first conductive path layer 5 and the second conductive path layer 6. Further, the second conductive layer 4 that is made thick can prevent warping from occurring due to a difference in a thermal expansion coefficient.

摘要翻译： 提供了一种电路器件及其制造方法。 使用绝缘树脂片，其中第一导电层3和第二导电层4通过绝缘树脂2彼此粘合。 第一导电路径层5由第一导电层3形成，第二导电路径层6由第二导电层4形成，并且两个导电路径层通过多层连接装置12连接。 由于半导体元件7粘附并固定在覆盖第一导电路径层5的外涂层树脂8上，所以可以通过第一导电路径层5和第二导电路径层6实现多层连接结构。 此外，制成厚的第二导电层4可以防止由于热膨胀系数的差异而发生翘曲。

公开(公告)号：US06720209B2

公开(公告)日：2004-04-13

申请号：US10172445

申请日：2002-06-14

申请人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

发明人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

IPC分类号： H01L2148

CPC分类号： H01L23/3128 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A conductive plated layer 4 is formed after through holes 21 are formed in the insulation resin 2 by using an insulation resin sheet 1 overcoated on a single side of the conductive layer 3 with insulation resin 2. A multi-layer connection structure can be achieved by the second conductive path layer 6 which is connected, in multi layers, to the first conductive path layer 5 formed by etching the conductive plated layer 4. Further, since semiconductor elements 7 are adhered to and fixed at the overcoating resin 8 that covers the first conductive path layer 5, the first conductive path layer 5 is finely patterned, and routing thereof can be made free.

摘要翻译： 通过使用在绝缘树脂2的导电层3的单面上涂覆的绝缘树脂片1，在绝缘树脂2中形成通孔21之后形成导电镀层4.多层连接结构可以通过 多层连接到通过蚀刻导电镀层4形成的第一导电通路层5的第二导电通路层6.此外，由于半导体元件7粘附并固定在覆盖第一导电层4的外涂层树脂8上 导电路径层5，第一导电路径层5被精细地图案化，并且可以使其布线自由。

公开(公告)号：US06696310B2

公开(公告)日：2004-02-24

申请号：US10201610

申请日：2002-07-24

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi

IPC分类号： H01L2100

CPC分类号： H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A lighting device using a light-emitting device with improved heat dissipation is offered. A lighting device with a light-emitting device mounted on a metal substrate is offered. The light-emitting device consists of a plurality of conductive passages electrically separated from each other, an optical semiconductor element attached to a desired conductive passage and a transparent resin covering the optical semiconductor element and supporting the conductive passages in one piece.

摘要翻译： 提供使用具有改善的散热的发光装置的照明装置。 提供了一种安装在金属基板上的发光装置的照明装置。 发光装置由彼此电隔离的多个导电通路组成，附接到期望的导电通路的光学半导体元件和覆盖光学半导体元件的透明树脂并且将导电通道一体地支撑。