公开(公告)号：US07683266B2

公开(公告)日：2010-03-23

申请号：US11494744

申请日：2006-07-28

申请人： Kiyoshi Shibata ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Kiyoshi Shibata ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/445 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09609 ,  H05K2201/0969 ,  H05K2203/0323 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165

摘要： A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls.

摘要翻译： 一种电路板和使用该电路板的电路装置，其可以防止由于热膨胀而引起的位移和膜剥落，并且抑制在升高的温度下的可靠性降低。 电路装置的电路板包括具有穿孔作为芯构件的金属基板。 在穿孔的顶端形成突起，在穿孔的底端形成凹部。 接线图案层通过各自的绝缘层形成在该金属基板的两侧上。 为了建立布线图案层之间的电连接，通过穿孔穿过金属基板形成连接布线图案层的导体层。 导体层由此在布线图案层之间建立导电。 此外，半导体芯片通过焊球直接连接到电路板的表面侧。

公开(公告)号：US20070176303A1

公开(公告)日：2007-08-02

申请号：US11645803

申请日：2006-12-27

申请人： Makoto Murai ,  Ryosuke Usui ,  Tetsuro Sawai ,  Toshikazu Imaoka ,  Yasunori Inoue

发明人： Makoto Murai ,  Ryosuke Usui ,  Tetsuro Sawai ,  Toshikazu Imaoka ,  Yasunori Inoue

IPC分类号： H01L23/28

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/16 ,  H01L2221/68377 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A highly reliable circuit device is provided at low cost. The circuit device includes a semiconductor element electrically connected to a wiring layer (copper plate and plating film) and passive parts sealed by a molded resin layer. The wiring layer has a predetermined pattern formed by a conductive member. The molded resin layer has projections protruding from gaps in the adjacent wiring layer toward an underside of the wiring layer. Thereby, the drop of yield is prevented and the highly reliable circuit device is provided at low cost.

摘要翻译： 以低成本提供了高度可靠的电路装置。 电路装置包括与布线层（铜板和电镀膜）电连接的半导体元件和由模制树脂层密封的被动部分。 布线层具有由导电构件形成的预定图案。 模制树脂层具有从相邻布线层中的间隙朝向布线层的下侧突出的突起。 从而，可以防止产量的下降，并且以低成本提供高可靠性的电路装置。

公开(公告)号：US20060158804A1

公开(公告)日：2006-07-20

申请号：US11371044

申请日：2006-03-09

申请人： Ryosuke Usui ,  Yasunori Inoue

发明人： Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H02H9/00

CPC分类号： H01L24/85 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24195 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73267 ,  H01L2224/82001 ,  H01L2224/85001 ,  H01L2224/85203 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： Multiple semiconductor device components and passive device components fixed to a substrate are embedded within an electroconductive-film/insulating-resin-film structure, and are thermally bonded to an insulating resin film.

公开(公告)号：US20060049995A1

公开(公告)日：2006-03-09

申请号：US11215131

申请日：2005-08-31

申请人： Toshikazu Imaoka ,  Sawai Tetsuro ,  Atsushi Sakai ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Toshikazu Imaoka ,  Sawai Tetsuro ,  Atsushi Sakai ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01Q1/24

CPC分类号： H01Q1/2283 ,  H01L24/24 ,  H01L24/45 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24195 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73267 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/22 ,  H05K1/0298 ,  H05K1/16 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes an insulating base, a semiconductor circuit device, chip parts, a molding resin, an antenna conductor, a ground conductor, and external lead electrodes. The plurality of chip parts are mounted on the insulating base, and are soldered to electrodes of wiring conductors on the top of the insulating base for electric and physical connection. The insulating base has a multilayer structure, being formed by laminating a plurality of insulator layers. The antenna conductor is formed on the bottom of the insulating base. A wiring conductor adjacent to the antenna conductor is provided with the ground conductor so that it overlaps with the antenna conductor.

公开(公告)号：US20100139088A1

公开(公告)日：2010-06-10

申请号：US12702865

申请日：2010-02-09

申请人： Kiyoshi SHIBATA ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Kiyoshi SHIBATA ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H05K3/10 ,  H05K3/30

CPC分类号： H05K3/445 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09609 ,  H05K2201/0969 ,  H05K2203/0323 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165

摘要： A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are formed on the top ends of the pierced holes, and depressions are formed in the bottom ends of the pierced holes. Wiring pattern layers are formed on both sides of this metal substrate via respective insulating layers. In order to establish electrical connection between the wiring pattern layers, a conductor layer which connects the wiring pattern layers is formed through the metal substrate via the pierced holes. The conductor layer thereby establishes electrical conduction between the wiring pattern layers. Furthermore, a semiconductor chip is directly connected to the surface side of the circuit board via solder balls.

摘要翻译： 一种电路板和使用该电路板的电路装置，其可以防止由于热膨胀而引起的位移和膜剥落，并且抑制在升高的温度下的可靠性降低。 电路装置的电路板包括具有穿孔作为芯构件的金属基板。 在穿孔的顶端形成突起，在穿孔的底端形成凹部。 接线图案层通过各自的绝缘层形成在该金属基板的两侧上。 为了建立布线图案层之间的电连接，通过穿孔穿过金属基板形成连接布线图案层的导体层。 导体层由此在布线图案层之间建立导电。 此外，半导体芯片通过焊球直接连接到电路板的表面侧。

公开(公告)号：US20100112760A1

公开(公告)日：2010-05-06

申请号：US12603122

申请日：2009-10-21

申请人： Ryosuke USUI ,  Yasunori Inoue

发明人： Ryosuke USUI ,  Yasunori Inoue

IPC分类号： H01L21/56

CPC分类号： H01L24/85 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24195 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73267 ,  H01L2224/82001 ,  H01L2224/85001 ,  H01L2224/85203 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： Multiple semiconductor device components and passive device components fixed to a substrate are embedded within an electroconductive-film/insulating-resin-film structure, and are thermally bonded to an insulating resin film.

摘要翻译： 固定在基板上的多个半导体器件部件和无源器件部件被嵌入到导电膜/绝缘树脂膜结构内，并且被热粘合到绝缘树脂膜上。

公开(公告)号：US20080197482A1

公开(公告)日：2008-08-21

申请号：US11829560

申请日：2007-07-27

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01L23/36 ,  H01L21/58

CPC分类号： H01L23/36 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3677 ,  H01L23/525 ,  H01L24/11 ,  H01L24/12 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor module is provided, which is capable of suppressing the deterioration of reliability and improving heat radiation. The semiconductor module includes: a semiconductor substrate in which electrodes of a circuit element are formed on its surface; a re-wiring pattern connected to the electrodes to ensure large pitch of the electrodes; an electrode integrally formed with the re-wiring pattern; an insulating layer formed on a rear surface of the semiconductor substrate; a radiator formed on the insulating layer; and projections integrally formed with the radiator and penetrating the insulating layer to connect to the rear surface of the semiconductor substrate.

摘要翻译： 提供一种半导体模块，其能够抑制可靠性的劣化并改善散热。 半导体模块包括：其表面上形成有电路元件的电极的半导体衬底; 连接到电极的再布线图案以确保电极的大间距; 与所述再布线图形一体形成的电极; 绝缘层，形成在所述半导体衬底的背面上; 形成在绝缘层上的散热器; 以及与散热器一体形成并穿透绝缘层的突起，以连接到半导体衬底的后表面。

公开(公告)号：US20080128903A1

公开(公告)日：2008-06-05

申请号：US11928368

申请日：2007-10-30

申请人： Yoshio Okayama ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Yoshio Okayama ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/11 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05647 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： Connection reliability in electrode portions of a semiconductor module is improved. A semiconductor wafer is prepared where a plurality of semiconductor substrates each having an electrode and a protective film at the surface is formed in a matrix shape. Next, at the surface of the semiconductor wafer (semiconductor substrate) a insulation layer is held between the semiconductor substrate and a copper sheet (metal sheet) formed integrally with a bump containing a plastic region on a tip part. With the insulating held between them, the semiconductor substrate, the insulating layer and the copper sheet are press-formed by a press machine into a single block. The bump penetrates the insulating layer, and the plastic region on the tip part is plastic deformed at a contact surface with an electrode, so that the bump and the electrode are electrically connected together.

摘要翻译： 提高了半导体模块的电极部分的连接可靠性。 制备半导体晶片，其中在表面上形成具有电极和保护膜的多个半导体衬底形成为矩阵形状。 接下来，在半导体晶片（半导体基板）的表面，绝缘层保持在半导体基板与与包含尖端部分上的塑料区域的凸块整体形成的铜片（金属片）之间。 在它们之间保持绝缘体的情况下，通过冲压机将半导体衬底，绝缘层和铜片压制成单块。 凸块穿透绝缘层，并且尖端部分上的塑料区域在与电极的接触表面处塑性变形，使得凸块和电极电连接在一起。

公开(公告)号：US08269298B2

公开(公告)日：2012-09-18

申请号：US12727913

申请日：2010-03-19

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L2224/05554 ,  H01L2224/48 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills.

摘要翻译： 半导体模块包括具有安装的半导体器件的下布线基板和在与半导体器件相对应的位置处具有开口的上布线基板，并且在开口周围具有封装部件安装区域。 下布线基板和上布线基板通过设置在半导体器件周围的多个焊球彼此电连接。 焊球被遮光不足的填充物覆盖。

公开(公告)号：US08068343B2

公开(公告)日：2011-11-29

申请号：US11829560

申请日：2007-07-27

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H05K7/00

CPC分类号： H01L23/36 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3677 ,  H01L23/525 ,  H01L24/11 ,  H01L24/12 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor module is provided, which is capable of suppressing the deterioration of reliability and improving heat radiation. The semiconductor module includes: a semiconductor substrate in which electrodes of a circuit element are formed on its surface; a re-wiring pattern connected to the electrodes to ensure large pitch of the electrodes; an electrode integrally formed with the re-wiring pattern; an insulating layer formed on a rear surface of the semiconductor substrate; a radiator formed on the insulating layer; and projections integrally formed with the radiator and penetrating the insulating layer to connect to the rear surface of the semiconductor substrate.

摘要翻译： 提供一种半导体模块，其能够抑制可靠性的劣化并改善散热。 半导体模块包括：其表面上形成有电路元件的电极的半导体衬底; 连接到电极的再布线图案以确保电极的大间距; 与所述再布线图形一体形成的电极; 形成在所述半导体衬底的后表面上的绝缘层; 形成在绝缘层上的散热器; 以及与散热器一体形成并穿透绝缘层的突起，以连接到半导体衬底的后表面。