公开(公告)号：US20060186317A1

公开(公告)日：2006-08-24

申请号：US11404831

申请日：2006-04-17

申请人： Warren Farnworth ,  Sidney Rigg ,  David Hembree ,  William Hiatt

发明人： Warren Farnworth ,  Sidney Rigg ,  David Hembree ,  William Hiatt

IPC分类号： H01L27/00

CPC分类号： H01L31/0203 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/14689 ,  H01L27/148 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Microelectronic imagers with prefabricated housings and methods of packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imager can include a microelectronic die, an image sensor, and an integrated circuit operatively coupled to the integrated circuit. The microelectronic imager also includes an optic unit having an optic member. The microelectronic imager further includes a prefabricated housing having a first mounting site and a second mounting site. The die is seated within the housing at the first mounting site and the optics unit is seated within the housing at the second mounting site in a fixed, preset position in which the optic member is situated at a desired location relative to the image sensor.

摘要翻译： 具有预制外壳的微电子成像器和封装微电子成像器的方法在此公开。 在一个实施例中，微电子成像器可以包括微电子管芯，图像传感器和可操作地耦合到集成电路的集成电路。 微电子成像器还包括具有光学构件的光学单元。 微电子成像器还包括具有第一安装位置和第二安装位置的预制外壳。 模具位于第一安装位置的壳体内，并且光学单元在第二安装位置处位于壳体内的固定的预设位置中，光学构件位于相对于图像传感器的期望位置处。

公开(公告)号：US20050287783A1

公开(公告)日：2005-12-29

申请号：US10879838

申请日：2004-06-29

申请人： Kyle Kirby ,  Salman Akram ,  David Hembree ,  Sidney Rigg ,  Warren Farnworth ,  William Hiatt

发明人： Kyle Kirby ,  Salman Akram ,  David Hembree ,  Sidney Rigg ,  Warren Farnworth ,  William Hiatt

IPC分类号： H01L21/44 ,  H01L21/4763 ,  H01L21/768 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/03 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/4038 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/0305 ,  H05K2201/09827 ,  H05K2203/072 ,  H05K2203/1147 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.

摘要翻译： 本文公开了微电子器件，用于封装微电子器件的方法，以及用于在微电子器件中形成互连的方法。 在一个实施例中，一种方法包括提供具有正面和背面的微电子衬底。 衬底具有包括集成电路的微电子管芯和可操作地耦合到集成电路的端子。 该方法还包括至少部分地形成通过基底并且在基底的前侧和/或后侧具有开口的通道。 该方法还包括用封闭通道一端的导电盖密封开口，同时通道的另一端保持打开。 该方法然后包括用导电材料填充通道。

公开(公告)号：US5559444A

公开(公告)日：1996-09-24

申请号：US452990

申请日：1995-05-30

申请人： Warren Farnworth ,  Salman Akram ,  David Hembree

发明人： Warren Farnworth ,  Salman Akram ,  David Hembree

IPC分类号： G01R1/04 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H01L23/13 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  G01R1/02

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/80 ,  H05K3/4007 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2863 ,  H01L2224/16145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/423 ,  Y10T29/49155

摘要： A method and apparatus for testing unpackaged semiconductor dice is provided. The method includes forming an interconnect-alignment fixture for use in a test apparatus adapted to hold and apply test signals to the die during burn-in and full functionality testing. The interconnect-alignment fixture includes an interconnect plate formed out of a material such as silicon. The interconnect plate includes raised contact members covered with a conductive layer and adapted to penetrate contact locations on the die to a limited penetration depth. The interconnect-alignment fixture also includes an alignment plate formed with etched alignment openings for aligning contact locations on the die with the contact members on the interconnect plate during the test procedure. In addition, the alignment plate includes access openings for establishing an electrical connection to the contact members on the interconnect plate using wire bonding or mechanical electrical connectors. The interconnect plate and alignment plate are fabricated at the wafer level and then singulated using semiconductor circuit fabrication techniques.

摘要翻译： 提供了一种用于测试未封装的半导体晶片的方法和装置。 该方法包括形成用于测试装置中的互连对准夹具，其适于在老化和全功能测试期间保持并施加测试信号至模具。 互连对准夹具包括由诸如硅的材料形成的互连板。 互连板包括覆盖有导电层的凸起的接触构件，并且适于将模具上的接触位置穿透到有限的穿透深度。 互连对准夹具还包括形成有蚀刻对准开口的对准板，用于在测试过程期间将模具上的接触位置与互连板上的接触构件对准。 此外，对准板包括进入开口，用于使用引线接合或机械电连接器建立与互连板上的接触构件的电连接。 互连板和对准板在晶片级制造，然后使用半导体电路制造技术进行分割。

公开(公告)号：US20070168074A1

公开(公告)日：2007-07-19

申请号：US11716211

申请日：2007-03-08

申请人： William Hiatt ,  Warren Farnworth ,  David Hembree ,  Peter Benson

发明人： William Hiatt ,  Warren Farnworth ,  David Hembree ,  Peter Benson

IPC分类号： G06F19/00

CPC分类号： B29C64/35 ,  B29C64/135 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02

摘要： Methods for supporting substrates during programmed material consolidation include securing a substrate in position over a support with a surface and, optionally, other features that receive the at least one substrate and prevent unconsolidated material from contacting undesired regions, such as the bottom surface, of the at least one substrate.

摘要翻译： 在编程材料固结期间用于支撑基底的方法包括将基底固定在具有表面的支撑件上的适当位置，以及可选地，接收至少一个基底的其它特征，并且防止未固结的材料接触不期望的区域，例如底部表面 至少一个基底。

公开(公告)号：US20070157952A1

公开(公告)日：2007-07-12

申请号：US11724344

申请日：2007-03-15

申请人： William Hiatt ,  Warren Farnworth ,  David Hembree ,  Peter Benson

发明人： William Hiatt ,  Warren Farnworth ,  David Hembree ,  Peter Benson

IPC分类号： B08B5/04 ,  B08B7/00 ,  B08B3/00

CPC分类号： B29C64/35 ,  B29C64/135 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02

摘要： Methods for cleaning consolidatable material from substrates or from features that have been fabricated with the material include application of pressure, force, or a cleaning agent to the substrate or feature. The pressure, force, or cleaning agent may be applied in a variety of ways. The unconsolidated material that has been removed from the substrate or feature may also be collected, optionally filtered, and reused in a subsequent programmed material consolidation process.

摘要翻译： 从基材或由材料制成的特征清洁可固结材料的方法包括向基材或特征施加压力，力或清洁剂。 压力，力或清洁剂可以以各种方式施加。 已经从基底或特征中去除的未固结的材料也可以被收集，任选地过滤，并在随后的程序化材料固结过程中重复使用。

公开(公告)号：US20070045632A1

公开(公告)日：2007-03-01

申请号：US11217877

申请日：2005-09-01

申请人： Steven Oliver ,  Lu Velicky ,  William Hiatt ,  David Hembree ,  Mark Tuttle ,  Sidney Rigg ,  James Wark ,  Warren Farnworth ,  Kyle Kirby

发明人： Steven Oliver ,  Lu Velicky ,  William Hiatt ,  David Hembree ,  Mark Tuttle ,  Sidney Rigg ,  James Wark ,  Warren Farnworth ,  Kyle Kirby

IPC分类号： H01L33/00

CPC分类号： H01L21/00 ,  H01L21/76898 ,  H01L23/552 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.

摘要翻译： 本文公开了用于在晶片级制造多个成像单元的微电子成像单元和方法。 在一个实施例中，制造多个成像单元的方法包括提供具有多个成像管芯的成像工件，所述成像管芯包括集成电路，电耦合到集成电路的外部触点以及可操作地耦合到集成电路的图像传感器。 各个图像传感器包括在图像传感器的周边部分处的至少一个暗电流像素。 该方法包括将覆盖层沉积在工件上并在图像传感器上方。 该方法还包括图案化和选择性地显影覆盖层以在对应的图像传感器上形成分离体积的覆盖层材料。 覆盖层材料的离散体积具有与各个暗电流像素的内侧边缘对准的侧壁，使得暗电流像素不被离散体积覆盖。

公开(公告)号：US20070037418A1

公开(公告)日：2007-02-15

申请号：US11585462

申请日：2006-10-24

申请人： Salman Akram ,  David Hembree ,  Warren Farnworth

发明人： Salman Akram ,  David Hembree ,  Warren Farnworth

IPC分类号： H01R12/00

CPC分类号： H01R13/2421 ,  G01R1/0466 ,  G01R1/0483 ,  H01L2924/0002 ,  H01R12/714 ,  H01R2201/20 ,  H05K7/1061 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/53174 ,  H01L2924/00

摘要： A socket contact formation process comprises forming a contact head from a conductive material, forming a contact body from a semiconductive material configured to be electrically conductive; and joining the contact head and the contact body.

公开(公告)号：US20070020814A1

公开(公告)日：2007-01-25

申请号：US11516099

申请日：2006-09-05

申请人： David Hembree ,  Warren Farnworth

发明人： David Hembree ,  Warren Farnworth

IPC分类号： H01L21/00

CPC分类号： H01L27/1462 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/563 ,  H01L23/295 ,  H01L23/552 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L27/14618 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/27554 ,  H01L2224/2908 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81855 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/0503 ,  H01L2224/05599

摘要： Methods of forming semiconductor packages include immersing a semiconductor device assembly in a liquid photopolymerizable resin including a plurality of discrete particles dispersed therethrough, and selectively at least partially curing portions of the resin adjacent at least one semiconductor die of the semiconductor device assembly. In some embodiments, the semiconductor device assembly may be immersed in a second liquid photopolymerizable resin having at least one physical property differing from the first liquid photopolymerizable resin, and the second liquid photopolymerizable resin may be selectively at least partially cured. Furthermore, the semiconductor die may have an active surface including an array of optically interactive semiconductor devices, and portions of the liquid photopolymerizable resin surrounding a periphery of the array may be selectively at least partially cured to form a substantially opaque support structure.

摘要翻译： 形成半导体封装的方法包括将半导体器件组件浸入包括分散在其中的多个离散颗粒的液体可光聚合树脂中，并且选择性地至少部分地固化邻近半导体器件组件的至少一个半导体管芯的部分树脂。 在一些实施例中，半导体器件组件可以浸没在具有与第一液体可光聚合树脂不同的至少一种物理性质的第二液体可光聚合树脂中，并且第二液态可光聚合树脂可以选择性地至少部分固化。 此外，半导体管芯可以具有包括光学交互的半导体器件的阵列的有源表面，并且围绕阵列周边的部分液态可光聚合树脂可以被选择性地至少部分地固化以形成基本不透明的支撑结构。

公开(公告)号：US20060199363A1

公开(公告)日：2006-09-07

申请号：US11416824

申请日：2006-05-03

申请人： Kyle Kirby ,  Salman Akram ,  David Hembree ,  Sidney Rigg ,  Warren Farnworth ,  William Hiatt

发明人： Kyle Kirby ,  Salman Akram ,  David Hembree ,  Sidney Rigg ,  Warren Farnworth ,  William Hiatt

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/4038 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/0305 ,  H05K2201/09827 ,  H05K2203/072 ,  H05K2203/1147 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.

公开(公告)号：US20050277231A1

公开(公告)日：2005-12-15

申请号：US10867257

申请日：2004-06-14

申请人： David Hembree ,  Warren Farnworth

发明人： David Hembree ,  Warren Farnworth

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/552 ,  H01L27/146

CPC分类号： H01L27/1462 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/563 ,  H01L23/295 ,  H01L23/552 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L27/14618 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13016 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/27554 ,  H01L2224/2908 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81855 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/0503 ,  H01L2224/05599

摘要： Polymerized materials for forming the underfill and encapsulation structures for semiconductor package are disclosed. A filler constituent, such as boron nitride, silicates, elemental metals, or alloys, may be added to a liquid photopolymer resin to tailor the physical properties thereof upon curing. The filler constituents may be employed to alter the coefficient of thermal expansion, thermal conductivity, or electrical conductivity of the polymerized material. A number of different embodiments are disclosed that employ the above materials in selected regions of the underfill and encapsulation structures of the semiconductor package. The polymerized materials may also be used to form support structures and covers for optically interactive semiconductor devices. Methods for forming the above structures using stereolithography are also disclosed.

摘要翻译： 公开了用于形成用于半导体封装的底部填充和封装结构的聚合材料。 可以将液体光聚合物树脂中的填充剂组分，例如氮化硼，硅酸盐，元素金属或合金添加到固化中以调节其物理性能。 可以使用填料成分来改变聚合材料的热膨胀系数，热导率或电导率。 公开了许多不同的实施例，其在半导体封装的底部填充和封装结构的选定区域中采用上述材料。 聚合材料也可用于形成用于光学交互式半导体器件的支撑结构和盖。 还公开了使用立体光刻法形成上述结构的方法。