公开(公告)号：US09019636B2

公开(公告)日：2015-04-28

申请号：US12980261

申请日：2010-12-28

Applicant: Jing-En Luan ,  Junyong Chen

Inventor： Jing-En Luan ,  Junyong Chen

IPC: G02B7/02

CPC classification number: G02B7/023 ,  G02B7/025

Abstract: Lens alignment apparatuses, methods and optical devices are disclosed. In accordance with various embodiments, a lens alignment apparatus may include at least one lens element positioned in a lens body. A lens alignment interface coupled to the lens element may be configured to permit the lens element to be angularly deflected relative to an axis of symmetry of the lens body. In other embodiments, a method of improving the resolution of an optical device may include translating a lens along an optical axis to maximize resolution at a first location, and determining a resolution in a second location in the imaging plane. The resolution in the second location may be improved by angularly deflecting the lens, and the position of the lens may then be fixed.

Abstract translation: 公开了透镜对准装置，方法和光学装置。 根据各种实施例，透镜对准装置可以包括定位在透镜体中的至少一个透镜元件。 耦合到透镜元件的透镜对准接口可以被配置为允许透镜元件相对于透镜主体的对称轴线成角度地偏转。 在其他实施例中，改进光学装置的分辨率的方法可以包括沿着光轴平移透镜以使第一位置处的分辨率最大化，以及确定成像平面中的第二位置中的分辨率。 可以通过使透镜成角度地偏转来改善第二位置中的分辨率，然后可以固定透镜的位置。

公开(公告)号：US09013012B2

公开(公告)日：2015-04-21

申请号：US13785938

申请日：2013-03-05

Applicant: STMicroelectronics Pte Ltd.

Inventor： Ravi Shankar ,  Olivier Le Neel ,  Shian Yeu Kam ,  Tien Choy Loh

IPC: H01L29/84 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00293 ,  B81B7/0041 ,  B81C2203/0136

Abstract: Embodiments of the present disclosure are related to MEMS devices having a suspended membrane that are secured to and spaced apart from a substrate with a sealed cavity therebetween. The membrane includes openings with sidewalls that are closed by a dielectric material. In various embodiments, the cavity between the membrane and the substrate is formed by removing a sacrificial layer through the openings. In one or more embodiments, the openings in the membrane are closed by depositing the dielectric material on the sidewalls of the openings and the upper surface of the membrane.

Abstract translation: 本公开的实施例涉及具有悬置膜的MEMS器件，其被固定到衬底上并与衬底间隔开密封腔。 膜包括具有由介电材料封闭的侧壁的开口。 在各种实施例中，通过从开口去除牺牲层来形成膜与衬底之间的空腔。 在一个或多个实施例中，通过将介电材料沉积在开口的侧壁和膜的上表面上来封闭膜中的开口。

公开(公告)号：US08999850B2

公开(公告)日：2015-04-07

申请号：US13339797

申请日：2011-12-29

Applicant: Ying Yu ,  Tien Choy Loh ,  Shian Yeu Kam

Inventor： Ying Yu ,  Tien Choy Loh ,  Shian Yeu Kam

IPC: H01L21/302 ,  H01L21/461 ,  C09K13/00 ,  H01L21/306

CPC classification number: C09K13/00 ,  H01L21/30608

Abstract: Methods and apparatus for etching materials using tetramethylammonium hydroxide (TMAH) are described. The methods may involve including an additive when applying the TMAH to the material to be etched. The additive may be a gas, and in some situations may be clean dry air. The clean dry air may be provided with the TMAH to minimize or prevent the formation of hillocks in the etched structure. Apparatus for performing the methods are also described.

Abstract translation: 描述了使用四甲基氢氧化铵（TMAH）蚀刻材料的方法和设备。 当将TMAH应用于待蚀刻的材料时，该方法可以包括添加剂。 添加剂可以是气体，在某些情况下可以是干净的干燥空气。 清洁的干燥空气可以设置有TMAH以最小化或防止在蚀刻结构中形成小丘。 还描述了用于执行方法的装置。

公开(公告)号：US20150028187A1

公开(公告)日：2015-01-29

申请号：US13948507

申请日：2013-07-23

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Bin-Hong HUANG

IPC: H01L31/18 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2224/16225

Abstract: An image sensor device may include a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity, an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening, and an adhesive bead on the image sensor IC surrounding the image sensing area. Furthermore, an infrared (IR) filter may be within the filter-receiving opening and have peripheral portions contacting the adhesive bead.

Abstract translation: 图像传感器装置可以包括其中具有IC接收腔的安装基板和与IC接收腔对准的滤光器接收开口，IC接收腔内的图像传感器集成电路（IC），并且具有图像感测区域 与过滤器接收开口对准，以及围绕图像感测区域的图像传感器IC上的粘合剂珠粒。 此外，红外（IR）滤光器可以在过滤器接收开口内，并且具有与粘合剂珠接触的周边部分。

公开(公告)号：US08937008B2

公开(公告)日：2015-01-20

申请号：US13340275

申请日：2011-12-29

Applicant: Yonggang Jin

Inventor： Yonggang Jin

IPC: H01L21/44 ,  H01L23/00

CPC classification number: H01L24/11 ,  B23K3/0623 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A system and process for forming a ball grid array on a substrate includes defining a plurality of openings in a resist layer on the substrate, and forming a plurality of openings in the resist layer, each positioned over a contact pad of the substrate. Flux is then deposited in the openings, and solder balls are positioned in each opening with the flux. Solder bumps are formed by reflowing the solder balls in the respective openings. The resist layer is then removed, leaving an array of solder bumps on the substrate. The flux can be deposited by depositing a layer of flux, then removing the flux, except a portion that remains in each opening. Solder balls can be positioned by moving a ball feeder across the resist layer and dropping a solder ball each time an aperture in the ball feeder aligns with an opening in the resist layer.

Abstract translation: 用于在衬底上形成球栅阵列的系统和方法包括在衬底上的抗蚀剂层中限定多个开口，并且在抗蚀剂层中形成多个开口，每个位于衬底的接触焊盘上方。 然后将焊剂沉积在开口中，并且焊剂球通过焊剂位于每个开口中。 通过在相应的开口中回流焊球来形成焊料凸点。 然后去除抗蚀剂层，留下衬底上的焊料凸块阵列。 可以通过沉积一层焊剂，然后除去焊剂，除了保留在每个开口中的部分之外，可以沉积焊剂。 焊球可以通过使球进料器横过抗蚀剂层移动而定位，并且每当球进料器中的孔与抗蚀剂层中的开口对准时，下降焊球。

公开(公告)号：US08922013B2

公开(公告)日：2014-12-30

申请号：US13291788

申请日：2011-11-08

Applicant: How Yuan Hwang ,  Kah Wee Gan

Inventor： How Yuan Hwang ,  Kah Wee Gan

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L23/538

CPC classification number: H01L24/14 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/023 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.

Abstract translation: 集成电路封装包括在复原衬底中的集成电路管芯。 然后将活性侧加工成模塑料，同时处理非活性侧。 然后部分地去除活性侧上的模塑料，并且在活性侧上放置焊球。

公开(公告)号：US08916481B2

公开(公告)日：2014-12-23

申请号：US13312562

申请日：2011-12-06

Applicant: Kah Wee Gan ,  Yaohuang Huang ,  Yonggang Jin

Inventor： Kah Wee Gan ,  Yaohuang Huang ,  Yonggang Jin

IPC: H01L21/31 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L21/48 ,  H01L25/10 ,  H05K1/18

CPC classification number: H01L24/97 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H05K1/186 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A process for manufacturing a 3D or PoP semiconductor package includes forming a redistribution layer on a reconstituted wafer, then laser drilling a plurality of apertures in the reconstituted wafer, extending from an outer surface of the reconstituted wafer to intersect electrical traces in the first redistribution layer. A solder ball is then positioned adjacent to an opening of each of the apertures. The solder balls are melted and allowed to fill the apertures, making contact with the respective electrical traces and forming a plurality of solder columns. The outer surface of the reconstituted wafer is then planarized, and a second redistribution layer is formed on the planarized surface. The solder columns serve as through-vias, electrically coupling the first and second redistribution layers on opposite sides of the reconstituted wafer.

Abstract translation: 一种用于制造3D或PoP半导体封装的工艺包括在再构成的晶片上形成再分配层，然后激光钻出重建的晶片中的多个孔，从再构成的晶片的外表面延伸，以与第一再分配层 。 然后将焊球定位成与每个孔的开口相邻。 焊球熔化并允许填充孔，与相应的电迹线接触并形成多个焊料柱。 然后将重构的晶片的外表面平坦化，并且在平坦化表面上形成第二再分布层。 焊料柱用作通孔，将重新构成的晶片的相对侧上的第一和第二再分配层电耦合。

公开(公告)号：US08890269B2

公开(公告)日：2014-11-18

申请号：US13485624

申请日：2012-05-31

Applicant: Jing-En Luan

Inventor： Jing-En Luan

IPC: H01L31/18 ,  H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A wafer-level camera sensor package includes a semiconductor substrate with an optical sensor on a front surface. Through-silicon-vias (TSV) extend through the substrate and provide I/O contact with the sensor from the back side of the substrate. A glass cover is positioned over the front surface, and the cover and substrate are embedded in a molding compound layer (MCL), the front surface of the MCL lying coplanar with the front of the cover, and the back surface lying coplanar with the back of the substrate. Surface-mount devices, electromagnetic shielding, and through-wafer-connectors can be embedded in the MCL. A redistribution layer on the back surface of the MCL includes bottom contact pads for mounting the package, and conductive traces interconnecting the contact pads, TSVs, surface-mount devices, shielding, and through-wafer-connectors. Anisotropic conductive adhesive is positioned on the front of the MCL for physically and electrically attaching a lens array.

Abstract translation: 晶片级摄像机传感器封装包括在前表面上具有光学传感器的半导体衬底。 穿透硅通孔（TSV）延伸穿过衬底，并从衬底的背面提供与传感器的I / O接触。 玻璃盖被定位在前表面上，并且盖和基板被嵌入在模塑复合层（MCL）中，MCL的前表面与盖的前部共面，并且后表面与背面共面 的基底。 表面贴装器件，电磁屏蔽和贯通晶圆连接器可嵌入MCL。 MCL背面的再分配层包括用于安装封装的底部接触焊盘，以及将接触焊盘，TSV，表面贴装器件，屏蔽和贯穿晶片连接器互连的导电迹线。 各向异性导电粘合剂位于MCL的前部，用于物理和电连接透镜阵列。

公开(公告)号：US08860152B2

公开(公告)日：2014-10-14

申请号：US13285911

申请日：2011-10-31

Applicant: Suman Cherian ,  Olivier Le Neel

Inventor： Suman Cherian ,  Olivier Le Neel

IPC: H01L31/058 ,  G01N33/487

CPC classification number: G01N33/48785 ,  Y02B10/70 ,  Y10T436/143333 ,  Y10T436/144444 ,  Y10T436/172307 ,  Y10T436/184 ,  Y10T436/19 ,  Y10T436/204998 ,  Y10T436/205831

Abstract: A integrated circuit die includes a chemical sensor, a thermal sensor, and a humidity sensor formed therein. The chemical sensor, thermal sensor, and humidity sensor include electrodes formed in a passivation layer of the integrated circuit die. The integrated circuit die further includes transistors formed in a monocrystaline semiconductor layer.

Abstract translation: 集成电路管芯包括形成在其中的化学传感器，热传感器和湿度传感器。 化学传感器，热传感器和湿度传感器包括形成在集成电路管芯的钝化层中的电极。 集成电路管芯还包括形成在单晶半导体层中的晶体管。

公开(公告)号：US20140292317A1

公开(公告)日：2014-10-02

申请号：US13853805

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: G01N27/74

CPC classification number: H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/065 ,  H01L43/10 ,  Y10T29/4913

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

Abstract translation: 微型氧传感器利用氧气的顺磁特性提供快速的响应时间，低功耗，提高的精度和灵敏度以及优异的耐久性。 所公开的微型氧传感器在半导体衬底中形成的微通道内保持环境空气样品。 O 2分子响应于施加的磁场而分离，从而建立可测量的霍尔电压。 环境空气样品中存在的氧气可以从施加磁场变化的霍尔电压变化推导出来。 磁场可以由外部磁体或集成到微通道内的气体感测腔中的薄膜磁体施加。 差分传感器还包括含有非磁化控制样品的参考元件。 微型氧传感器适用于智能手机等消费类产品中的实时空气质量监控。