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    Vibration transducer and its manufacturing method
    41.
    发明授权
    Vibration transducer and its manufacturing method 有权
    振动传感器及其制造方法

    公开(公告)号：US09063023B2

    公开(公告)日：2015-06-23

    申请号：US13228855

    申请日：2011-09-09

    Applicant: Takashi Yoshida

    Inventor： Takashi Yoshida

    IPC: G01L9/08 ,  G01H13/00 ,  G01L9/00 ,  G01L1/10 ,  B81B3/00

    CPC classification number: G01L9/0019 ,  B81B3/001 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2201/0285 ,  B81B2203/0118 ,  G01L1/106 ,  G01L9/0013 ,  H03H9/2457 ,  H03H2009/02496

    Abstract: A vibration transducer includes a silicon single crystal vibration beam provided over a silicon single crystal substrate, the vibration beam having a sectional shape that is longer in a direction perpendicular to a surface of the silicon single crystal substrate than in a direction parallel with it, a shell made of silicon, surrounding the vibration beam with a gap, and forming a vacuum room together with the silicon single crystal substrate, a plate-like first electrode plate disposed parallel with the surface of the silicon single crystal substrate, the first electrode plate having one end connected to the vibration beam, plate-like second and third electrode plates disposed parallel with the surface of the silicon single crystal substrate so as to be opposed to each other with the vibration beam interposed in between, and asperities formed on confronting side surfaces of the vibration beam and the second and third electrode plates.

    Abstract translation: 振动传感器包括设置在硅单晶衬底上的硅单晶振动束，所述振动束具有在垂直于所述硅单晶衬底的表面的方向上比在与其平行的方向上更长的截面形状， 由硅制成的壳体，围绕振动梁间隙，并与硅单晶基板一起形成真空室，与硅单晶基板的表面平行布置的板状第一电极板，第一电极板具有 一端与振动束相连接，板状的第二和第三电极板与硅单晶衬底的表面平行设置，以便彼此相对地插入振动束，并且形成在相对侧面上的凹凸 的振动束和第二和第三电极板。

    RESONANT TRANSDUCER, MANUFACTURING METHOD THEREFOR, AND MULTI-LAYER STRUCTURE FOR RESONANT TRANSDUCER
    42.
    发明申请
    RESONANT TRANSDUCER, MANUFACTURING METHOD THEREFOR, AND MULTI-LAYER STRUCTURE FOR RESONANT TRANSDUCER 有权
    共振传感器及其制造方法，以及谐振传感器的多层结构

    公开(公告)号：US20150028434A1

    公开(公告)日：2015-01-29

    申请号：US14336613

    申请日：2014-07-21

    Applicant: YOKOGAWA ELECTRIC CORPORATION

    Inventor： Takashi YOSHIDA ,  Shuuji OKUDA ,  Shigeto IWAI

    IPC: B81B3/00 ,  B81C1/00 ,  B81B7/02

    CPC classification number: B81B3/0021 ,  B81B3/0002 ,  B81B7/02 ,  B81B2201/0271 ,  B81B2201/0285 ,  B81C1/00198 ,  B81C1/00293 ,  B81C2203/0145 ,  G01L1/14 ,  G01N29/12 ,  G01N2291/014 ,  G01N2291/02827 ,  H01L41/094 ,  H03H3/0072 ,  H03H9/2463

    Abstract: A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the resonator, a vibration detecting module configured to detect vibration of the resonator, a first layer disposed over the chamber, the first layer having a through-hole, a second layer disposed over the first layer, a third layer covering the first layer and the second layer, and a projection extending from the second layer toward the resonator, the projection being spatially separated from the resonator, the projection being separated from the first layer by a first gap, the second layer being separated from the first layer by a second gap, the first gap is communicated with the second gap.

    Abstract translation: 谐振换能器包括硅单晶衬底，设置在硅单晶衬底上的硅单晶谐振器，由硅构成的外壳，围绕谐振器间隙，并与硅单晶衬底一起形成腔室，令人兴奋的 模块，其被配置为激励所述谐振器;振动检测模块，被配置为检测所述谐振器的振动，设置在所述腔室上的第一层，所述第一层具有通孔，设置在所述第一层上的第二层， 第一层和第二层，以及从第二层朝向谐振器延伸的突起，突起与谐振器在空间上分离，突起与第一层隔开第一间隙，第二层与第一层分离 通过第二间隙，第一间隙与第二间隙连通。

    COMPUTATION DEVICES AND ARTIFICIAL NEURONS BASED ON NANOELECTROMECHANICAL SYSTEMS
    43.
    发明申请
    COMPUTATION DEVICES AND ARTIFICIAL NEURONS BASED ON NANOELECTROMECHANICAL SYSTEMS 审中-公开
    基于纳米电子系统的计算装置和人工神经元

    公开(公告)号：US20140355381A1

    公开(公告)日：2014-12-04

    申请号：US14273540

    申请日：2014-05-08

    Applicant: Cornell University

    Inventor： Amit Lal ,  Serhan Ardanuc ,  Jason T. Hoople ,  Justin C. Kuo

    IPC: G06N3/04 ,  G01S15/02 ,  G06K9/00 ,  G01S7/521 ,  B81B3/00 ,  H01J49/02

    CPC classification number: G06N3/04 ,  B81B3/0021 ,  B81B2201/018 ,  B81B2201/0214 ,  B81B2201/0285 ,  B81B2203/04 ,  G01S7/52079 ,  G01S7/521 ,  G01S15/02 ,  G01S15/8925 ,  G06K9/0002 ,  G06N3/0635 ,  H01H1/0094 ,  H01J49/025

    Abstract: Techniques, systems, and devices are described for implementing for implementing computation devices and artificial neurons based on nanoelectromechanical (NEMS) systems. In one aspect, a nanoelectromechanical system (NEMS) based computing element includes: a substrate; two electrodes configured as a first beam structure and a second beam structure positioned in close proximity with each other without contact, wherein the first beam structure is fixed to the substrate and the second beam structure is attached to the substrate while being free to bend under electrostatic force. The first beam structure is kept at a constant voltage while the other voltage varies based on an input signal applied to the NEMS based computing element.

    Abstract translation: 描述技术，系统和设备用于实现用于实现基于纳米机电（NEMS）系统的计算设备和人造神经元。 一方面，一种基于纳米机电系统（NEMS）的计算元件包括：基板; 配置为第一光束结构的两个电极和彼此紧密接近而没有接触地定位的第二光束结构，其中第一光束结构固定到基底，而第二光束结构附着到基底上同时在静电下自由弯曲 力。 第一光束结构保持在恒定电压，而另一电压基于施加到基于NEMS的计算元件的输入信号而变化。

    VIBRATION ELEMENT AND ELECTRONIC DEVICE
    44.
    发明申请
    VIBRATION ELEMENT AND ELECTRONIC DEVICE 审中-公开
    振动元件和电子设备

    公开(公告)号：US20140145552A1

    公开(公告)日：2014-05-29

    申请号：US14083949

    申请日：2013-11-19

    Applicant: Seiko Epson Corporation

    Inventor： Ryuji Kihara ,  Aritsugu Yajima

    IPC: H02N1/00

    CPC classification number: H03H9/2436 ,  B81B3/0013 ,  B81B2201/0285 ,  H03H2009/02385 ,  H03H2009/02472 ,  H03H2009/02511

    Abstract: A MEMS vibration element 100 includes a substrate 1, a fixing part 23 provided on a principal surface of the substrate 1, a supporting part 22 extending from the fixing part 23, and an upper electrode 21 (a vibration body) supported by the supporting part 22, isolated from the substrate 1. The upper electrode 21 includes a cut section extending from the peripheral portion of the upper electrode 21 toward the central portion of the upper electrode 21, the cut section 30 exposing a side surface portion of the upper electrode 21. The upper electrode 21 includes a joining part provided at a side surface portion 31 oriented in a direction from the central portion toward the peripheral portion, among the side surface portion exposed by the cut section 30, and the joining part is connected to the supporting part 22.

    Abstract translation: MEMS振动元件100包括基板1，设置在基板1的主表面上的固定部23，从固定部23延伸的支撑部22和由支撑部支撑的上部电极21（振动体） 上部电极21包括从上部电极21的周边部向上部电极21的中央部延伸的切断部，切断部30露出上部电极21的侧面部 上部电极21包括设置在侧面部分31上的接合部分，该接合部分在从切割部分30暴露的侧表面部分之间沿着从中心部分朝向周边部分的方向定向，并且接合部分连接到支撑 第22部分。

    Micro-electromechanical systems (MEMS) microphone and method of manufacturing the same
    46.
    发明授权
    Micro-electromechanical systems (MEMS) microphone and method of manufacturing the same 有权
    微机电系统（MEMS）麦克风及其制造方法相同

    公开(公告)号：US08175300B2

    公开(公告)日：2012-05-08

    申请号：US12509411

    申请日：2009-07-24

    Applicant: Jae Woo Lee ,  Kang Ho Park ,  Jong Dae Kim

    Inventor： Jae Woo Lee ,  Kang Ho Park ,  Jong Dae Kim

    IPC: H04R25/00

    CPC classification number: B81C1/00182 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0285 ,  H04R3/00 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

    Abstract: Provided are a micro-electromechanical systems (MEMS) microphone and a method of manufacturing the same. A manufacturing process is simplified compared to a conventional art using both upper and lower substrate processes. Since defects which may occur during manufacturing are reduced due to the simplified manufacturing process, the manufacturing throughput is improved, and since durability of the MEMS microphone is improved, system stability against the external environment is improved.

    Abstract translation: 提供了一种微机电系统（MEMS）麦克风及其制造方法。 与使用上基板工艺和下基板工艺的常规技术相比，制造工艺简化。 由于制造过程中可能发生的缺陷由于简化的制造过程而降低，所以提高了制造生产能力，并且由于提高了MEMS麦克风的耐久性，提高了对外部环境的系统稳定性。

    VIBRATION TRANSDUCER AND ITS MANUFACTURING METHOD
    47.
    发明申请
    VIBRATION TRANSDUCER AND ITS MANUFACTURING METHOD 有权
    振动传感器及其制造方法

    公开(公告)号：US20120060607A1

    公开(公告)日：2012-03-15

    申请号：US13228855

    申请日：2011-09-09

    Applicant: Takashi YOSHIDA

    Inventor： Takashi YOSHIDA

    IPC: G01H13/00 ,  H01L21/302

    CPC classification number: G01L9/0019 ,  B81B3/001 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2201/0285 ,  B81B2203/0118 ,  G01L1/106 ,  G01L9/0013 ,  H03H9/2457 ,  H03H2009/02496

    Abstract: A vibration transducer includes a silicon single crystal vibration beam provided over a silicon single crystal substrate, the vibration beam having a sectional shape that is longer in a direction perpendicular to a surface of the silicon single crystal substrate than in a direction parallel with it, a shell made of silicon, surrounding the vibration beam with a gap, and forming a vacuum room together with the silicon single crystal substrate, a plate-like first electrode plate disposed parallel with the surface of the silicon single crystal substrate, the first electrode plate having one end connected to the vibration beam, plate-like second and third electrode plates disposed parallel with the surface of the silicon single crystal substrate so as to be opposed to each other with the vibration beam interposed in between, and asperities formed on confronting side surfaces of the vibration beam and the second and third electrode plates.

    Abstract translation: 振动传感器包括设置在硅单晶衬底上的硅单晶振动束，所述振动束具有在垂直于所述硅单晶衬底的表面的方向上比在与其平行的方向上更长的截面形状， 由硅制成的壳体，围绕振动梁间隙，并与硅单晶基板一起形成真空室，与硅单晶基板的表面平行布置的板状第一电极板，第一电极板具有 一端与振动束相连接，板状的第二和第三电极板与硅单晶衬底的表面平行设置，以便彼此相对地插入振动束，并且形成在相对侧面上的凹凸 的振动束和第二和第三电极板。

    INTEGRATED DEVICE PACKAGE
    48.
    发明公开
    INTEGRATED DEVICE PACKAGE 审中-公开

    公开(公告)号：US20240118131A1

    公开(公告)日：2024-04-11

    申请号：US18546261

    申请日：2022-02-11

    Applicant: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

    Inventor： Johnny Solana Gealon ,  Gharry Maala Bathan ,  Jettro Alcantara Satsatin ,  Chai Wong Lee ,  Johann Philip Trinidad Ignacio

    IPC: G01H11/08 ,  B81B7/00

    CPC classification number: G01H11/08 ,  B81B7/0032 ,  B81B2201/0285

    Abstract: A sensor package is disclosed. The sensor package can include a support structure that is configured to couple with a vibration source by way of a stud. The sensor package can include a cap that is at least partially disposed over the support structure. The cap at least partially defines a cavity. The sensor package can include a vibration sensor module that is coupled to a portion of the support structure and disposed in the cavity. The sensor package can have a mechanical resonant frequency in a range of 0.1 Hz to 11 kHz. The sensor package can include a connector that is coupled to the support structure. The connector can connect to a connection line is electrically connect the vibration sensor module to an external substrate or system. The support structure can include a material that has a Young's modulus of at least 60 GPa and a density less than 3000 kg/m3. The sensor package can include a filler material disposed in the cavity.

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