公开(公告)号：US20140225684A1

公开(公告)日：2014-08-14

申请号：US14254984

申请日：2014-04-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hajime KANDO ,  Keiji OKADA

IPC: H03H9/64

CPC classification number: H03H9/64 ,  H03H9/0042 ,  H03H9/02535 ,  H03H9/02559 ,  H03H9/02574 ,  H03H9/02622 ,  H03H9/02834 ,  H03H9/02866 ,  H03H9/0585 ,  H03H9/14594 ,  H03H9/175 ,  H03H9/6433 ,  H03H9/6483 ,  H03H9/725

Abstract: In a surface acoustic wave device, a plurality of surface acoustic wave elements include piezoelectric bodies having the same cut-angle. A propagation azimuth of a surface acoustic wave in at least one of surface acoustic wave elements is different from a propagation azimuth of a surface acoustic wave in at least another one of the surface acoustic wave elements. In each of the surface acoustic wave elements, a confinement layer configured to confine the surface acoustic wave inside the piezoelectric body is disposed on the piezoelectric body at the side opposite to the side where an electrode is located.

Abstract translation: 在表面声波装置中，多个表面声波元件包括具有相同切角的压电体。 声表面波元件中的至少一种表面声波的传播方位与至少另一声表面波元件中的表面声波的传播方位不同。 在每个声表面波元件中，将配置为将表面声波限制在压电体内的约束层设置在压电体的与电极所在侧相反的一侧。

公开(公告)号：US08773214B2

公开(公告)日：2014-07-08

申请号：US13557748

申请日：2012-07-25

Applicant: Kunihito Yamanaka ,  Naohisa Obata

Inventor： Kunihito Yamanaka ,  Naohisa Obata

IPC: H03B5/30

CPC classification number: H03B5/326 ,  H01L41/053 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H03H9/02897 ,  H03H9/058 ,  H03H9/0585 ,  H03H9/25 ,  H01L2924/00014

Abstract: A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 1

Abstract translation: SAW器件包括由压电基片和形成在其上的IDT形成的SAW芯片，支撑SAW芯片的基底基板和将SAW芯片固定到基底基板的固定部件。 形成悬臂的SAW芯片在SAW芯片的平面图中，通过固定部件被支撑在IDT与固定部件不重叠的位置的基底基板上。 SAW芯片在y轴方向上的长度W和固定构件在y轴方向上的长度D满足1

公开(公告)号：US08585847B2

公开(公告)日：2013-11-19

申请号：US13546200

申请日：2012-07-11

Applicant: Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

Inventor： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

IPC: H01L41/22

CPC classification number: H03H9/0585 ,  H01L41/313 ,  H01L41/337

Abstract: A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface.

Abstract translation: 制备支撑基板和压电基板。 支撑基板的表面通过有机粘合剂层粘合到压电基板的背面而形成层压基板。 随后，将层叠基板的外周面进行研磨，使得压电基板的周面，有机粘合剂层的外周面和支撑基板的有机粘合层侧的周面与 彼此。 随后，对压电基片的表面进行抛光，以减小压电基片的厚度并进行表面的镜面抛光。

公开(公告)号：US20130026882A1

公开(公告)日：2013-01-31

申请号：US13557378

申请日：2012-07-25

Applicant: Hideaki YAMADA ,  Kazuhiko Kano

Inventor： Hideaki YAMADA ,  Kazuhiko Kano

IPC: H01L41/04

CPC classification number: H01L41/1132 ,  G01N29/2462 ,  G01N29/38 ,  G01N29/42 ,  G01N2291/0423 ,  H03H9/02622 ,  H03H9/058 ,  H03H9/0585

Abstract: In a SAW device, a first area placed at a surface of a measurement subject directly under a propagation portion is fixed to the measurement subject, and a second area placed at the surface of the measurement subject directly under both a drive electrode and a reflector is not fixed to the measurement subject. When a strain is generated in the measurement subject, a strain is generated only in the propagation portion, and a phase change is generated in a surface acoustic wave reflected by the reflector. Because the phase change is hardly affected by a temperature change, the strain of the measurement subject can be measured based on the phase change. Because a resonant frequency of the SAW device is changed by the temperature change, but is not affected by the strain of the measurement subject, a temperature can be measured based on a resonant frequency change.

Abstract translation: 在SAW器件中，将直接位于传播部分的测量对象的表面的第一区域固定在测定对象上，在测量对象的表面直接位于驱动电极和反射体的下方的第二区域是 没有固定在测量对象上。 当在测量对象中产生应变时，仅在传播部分中产生应变，并且在由反射器反射的表面声波中产生相变。 由于相变几乎不受温度变化的影响，所以测量对象的应变可以基于相位变化来测量。 由于SAW器件的谐振频率由于温度变化而变化，而是不受测量对象的应变的影响，所以可以基于谐振频率变化来测量温度。

公开(公告)号：US20060202781A1

公开(公告)日：2006-09-14

申请号：US11407708

申请日：2006-04-19

Applicant: Wolfgang Pahl

Inventor： Wolfgang Pahl

IPC: H03H9/64 ,  D04H13/00 ,  B32B7/12

CPC classification number: H03H9/0585 ,  H03H9/02866 ,  Y10T428/249924 ,  Y10T428/249985 ,  Y10T428/28

Abstract: The invention is an adhesive, in particular, for components that operate with surface acoustic waves, including a polymer matrix filled with mineral filler particles. The filler is selected from non-conductive or semi-conductive materials and is contained in the adhesive in such a proportion that the total density of the adhesive when cured is greater than 2000 kg/m3.

Abstract translation: 本发明是一种粘合剂，特别是用于与表面声波一起操作的部件，包括填充有矿物填料颗粒的聚合物基体。 填料选自非导电或半导电材料，并以粘合剂​​固化时的总密度大于2000kg / m 3的比例包含在粘合剂中。

公开(公告)号：US20060113874A1

公开(公告)日：2006-06-01

申请号：US10982235

申请日：2004-11-05

Applicant: Chi-Yen Shen

Inventor： Chi-Yen Shen

IPC: H01L41/053

CPC classification number: H03H9/059 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/16235 ,  H01L2924/181 ,  H03H3/08 ,  H03H9/0542 ,  H03H9/0585 ,  H03H9/1085 ,  H03H9/1092 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A SAW device package includes a SAW die, a molding compound, and conductive leads. The SAW die includes a piezoelectric substrate having a transducer-mounting surface, transmitting and receiving transducers that are formed on the transducer-mounting surface and that have conductive connecting pads, and a cap that is formed on and that is reduced in size from the transducer-mounting surface and that cooperates with the substrate to define an embedded air cavity therebetween in such a manner that the transmitting and receiving transducers are confined in the embedded air cavity. The SAW die is encapsulated by the molding compound. The leads are connected electrically to the connecting pads and extend outwardly of the molding compound.

Abstract translation: SAW器件封装包括SAW模具，模塑料和导电引线。 SAW管芯包括具有换能器安装表面的压电基片，传输和接收形成在换能器安装表面上并且具有导电连接焊盘的换能器，以及形成在其上并且与传感器尺寸相比尺寸减小的盖 并且与衬底配合以在其间限定嵌入的空气腔，使得发射和接收换能器被限制在嵌入式空气腔中。 SAW模具被模塑料封装。 引线电连接到连接焊盘并且延伸到模制化合物的外部。

公开(公告)号：US20050275487A1

公开(公告)日：2005-12-15

申请号：US11142472

申请日：2005-06-02

Applicant: Masahiro Oshio

Inventor： Masahiro Oshio

IPC: H03H3/10 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/64

CPC classification number: H03H9/0547 ,  H01L2224/16225 ,  H01L2924/16195 ,  H03H3/10 ,  H03H9/02622 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1071

Abstract: A method for adjusting frequency of a surface acoustic wave device includes performing a frequency adjustment. The surface acoustic wave device includes a substrate including at least one of a lithium tantalate substrate, a lithium niobate substrate, and a lithium tetraborate substrate. The surface acoustic wave device further includes an IDT electrode formed on the substrate that excites a pseudo-longitudinal leaky surface acoustic wave. The performing includes frequency adjustment by adjusting a thickness of the substrate at a side opposite in a thickness direction to a side on which the IDT electrode is formed.

Abstract translation: 用于调整声表面波装置的频率的方法包括进行频率调整。 表面声波装置包括包括钽酸锂衬底，铌酸锂衬底和四硼酸锂衬底中的至少一种的衬底。 表面声波装置还包括形成在基板上的IDT电极，其激励伪纵向泄漏声波。 执行包括通过调整在与形成IDT电极的一侧的厚度方向相反的一侧的衬底的厚度来进行频率调整。

公开(公告)号：US06972642B2

公开(公告)日：2005-12-06

申请号：US10731007

申请日：2003-12-10

Applicant: Masahiro Oshio

Inventor： Masahiro Oshio

IPC: H03B5/30 ,  H03H3/08 ,  H03H3/10 ,  H03H9/02 ,  H03H9/05 ,  H03H9/25 ,  H03H9/64

CPC classification number: H03H9/059 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10158 ,  H03H3/10 ,  H03H9/02622 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/1071 ,  H03H9/25 ,  Y10T29/42 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The invention provides a surface acoustic wave device capable of precisely controlling a frequency, of reducing changes in the center frequency with the lapse of time after controlling the frequency, and of performing a stable operation for a long time. The thickness of an IDT electrode formed on a quartz substrate is set to be slightly larger than the desired thickness so that the center frequency is slightly lower than the desired frequency. Next, a voltage is applied to the IDT electrode and the center frequency is measured. At this time, the measured center frequency is slightly lower than the desired frequency. The rear surface of the quartz substrate is etched while checking the measured center frequency. As a result, the measured center frequency gradually increases and approaches the desired frequency by etching the rear surface of the quartz substrate. Further, the rear surface of the quartz substrate is continuously etched until the center frequency is the desired frequency. The etching is stopped at the point of time where the measured center frequency is the desired frequency.

Abstract translation: 本发明提供一种表面声波装置，其能够精确地控制频率，在控制频率之后随着时间的推移减小中心频率的变化，并且长时间执行稳定的操作。 形成在石英基板上的IDT电极的厚度被设定为略大于期望厚度，使得中心频率略低于期望频率。 接下来，向IDT电极施加电压，并测量中心频率。 此时，测量的中心频率略低于所需的频率。 在检查测量的中心频率的同时蚀刻石英衬底的后表面。 结果，通过蚀刻石英衬底的后表面，测量的中心频率逐渐增加并接近期望的频率。 此外，石英衬底的后表面被连续蚀刻直到中心频率为期望的频率。 在测量的中心频率是期望频率的时间点停止蚀刻。

公开(公告)号：US20050082653A1

公开(公告)日：2005-04-21

申请号：US10948976

申请日：2004-09-24

Applicant: Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

Inventor： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

IPC: H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L23/02

CPC classification number: H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

Abstract translation: 提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面 面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。 提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。 密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

公开(公告)号：US20040164821A1

公开(公告)日：2004-08-26

申请号：US10731007

申请日：2003-12-10

Applicant: SEIKO EPSON CORPORATION

Inventor： Masahiro Oshio

IPC: H03H009/64

CPC classification number: H03H9/059 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10158 ,  H03H3/10 ,  H03H9/02622 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/1071 ,  H03H9/25 ,  Y10T29/42 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The invention provides a surface acoustic wave device capable of precisely controlling a frequency, of reducing changes in the center frequency with the lapse of time after controlling the frequency, and of performing a stable operation for a long time. The thickness of an IDT electrode formed on a quartz substrate is set to be slightly larger than the desired thickness so that the center frequency is slightly lower than the desired frequency. Next, a voltage is applied to the IDT electrode and the center frequency is measured. At this time, the measured center frequency is slightly lower than the desired frequency. The rear surface of the quartz substrate is etched while checking the measured center frequency. As a result, the measured center frequency gradually increases and approaches the desired frequency by etching the rear surface of the quartz substrate. Further, the rear surface of the quartz substrate is continuously etched until the center frequency is the desired frequency. The etching is stopped at the point of time where the measured center frequency is the desired frequency.

Abstract translation: 本发明提供一种表面声波装置，其能够精确地控制频率，在控制频率之后随着时间的推移减小中心频率的变化，并且长时间执行稳定的操作。 形成在石英基板上的IDT电极的厚度被设定为略大于期望厚度，使得中心频率略低于期望频率。 接下来，向IDT电极施加电压，并测量中心频率。 此时，测量的中心频率略低于所需的频率。 在检查测量的中心频率的同时蚀刻石英衬底的后表面。 结果，通过蚀刻石英衬底的后表面，测量的中心频率逐渐增加并接近期望的频率。 此外，石英衬底的后表面被连续蚀刻直到中心频率为期望的频率。 在测量的中心频率是期望频率的时间点停止蚀刻。