公开(公告)号：US20020164895A1

公开(公告)日：2002-11-07

申请号：US10005024

申请日：2001-12-04

Applicant: INCEP Technologies, Inc.

Inventor： David H. Hartke ,  Joseph T. DiBene II

IPC: H05K001/00

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board. A power signal from the power conditioning circuit is provided to the second circuit board at least in part by one of the first set of raised conductive contacts on the flexible circuit and the second set of raised conductive contacts on the second flexible circuit and a ground return is provided to the second circuit board by the other of the first set of raised conductive contacts on the first flexible circuit and the second set of raised conductive contacts on the second flexible circuit.

Abstract translation: 公开了一种用于将具有功率调节电路的第一电路板和具有沿z（垂直）轴设置在其下方的功率耗散部件的第二电路板电互连的方法和装置。 在说明性实施例中，该装置包括具有第一组凸起的导电触点的第一柔性电路，第一柔性电路设置在第二电路板的第一侧上; 以及第二柔性电路，其具有第二组凸起的导电触头，所述第二柔性电路设置在所述第二电路板的与所述第二电路板的第一侧相对的第二侧上。 来自功率调节电路的功率信号至少部分地由柔性电路上的第一组升高的导电触点之一和第二柔性电路上的第二组升高的导电触点和接地回路提供给第二电路板 通过第一柔性电路上的第一组升高的导电触点中的另一个和第二柔性电路上的第二组升高的导电触点而提供给第二电路板。

公开(公告)号：US06452804B1

公开(公告)日：2002-09-17

申请号：US09802329

申请日：2001-03-08

Applicant: Joseph T. Dibene, II ,  David H. Hartke

Inventor： Joseph T. Dibene, II ,  David H. Hartke

IPC: H05K720

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2224/0401

Abstract: A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.

Abstract translation: 公开了一种用于在控制电磁辐射的同时从微处理器供电和去除热量的堆叠组件。 堆叠组件包括具有第一侧和第二侧的VRM电路板或功率调节模块; 诸如具有第一侧和第二侧的蒸气板的导热板，其中所述导热板第一侧热耦合到所述VRM电路板的第二侧; 以及具有第一侧和第二侧的微处理器，所述微处理器第一侧热耦合到所述蒸汽板第二侧。

公开(公告)号：US06430057B1

公开(公告)日：2002-08-06

申请号：US09641172

申请日：2000-08-17

Applicant: Martin Nordhoff Hoffmann ,  Mamatha D. R. Naidu

Inventor： Martin Nordhoff Hoffmann ,  Mamatha D. R. Naidu

IPC: H05K712

CPC classification number: H05K1/141 ,  H05K1/023 ,  H05K1/144 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704

Abstract: A device is provided for structurally and electrically interfacing an integrated circuit (IC) chip with a printed circuit board (PCB) designed for another IC chip, where the two IC chips have different structural and/or electrical operating characteristics. The device provides structural and/or electrical interfaces for interfacing the IC chip with the PCB.

Abstract translation: 提供了一种用于将集成电路（IC）芯片与为另一IC芯片设计的印刷电路板（PCB）结构和电接口的装置，其中两个IC芯片具有不同的结构和/或电气操作特性。 该器件提供用于将IC芯片与PCB接口的结构和/或电接口。

公开(公告)号：US06397459B2

公开(公告)日：2002-06-04

申请号：US09274957

申请日：1999-03-23

Applicant: Osamu Ohshima ,  Yoshiaki Udagawa ,  Masahiro Suzuki ,  Takeshi Nishiyama

Inventor： Osamu Ohshima ,  Yoshiaki Udagawa ,  Masahiro Suzuki ,  Takeshi Nishiyama

IPC: A05K330

CPC classification number: H05K1/141 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15322 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10704 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  H01L2924/00014

Abstract: A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density. conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.

Abstract translation: 提供了一种用于将电路元件安装在印刷线路板上的方法和装置，其中具有第一交间距的端子的集成电路安装在终端密度的第一表面上。 转换板，其在所述终端密度转换板的第二表面上将所述集成电路的所述第一interterminal间距转换为具有大于所述第一interterminal间距的第二interterminal间距的端子; 并且具有第二交间距的端子密度转换板的第二表面上的端子安装在印刷线路板上。

公开(公告)号：US06356448B1

公开(公告)日：2002-03-12

申请号：US09432878

申请日：1999-11-02

Applicant: Joseph Ted DiBene, II ,  David Hartke

Inventor： Joseph Ted DiBene, II ,  David Hartke

IPC: H05K720

CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2924/15192 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/2036

Abstract: An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

Abstract translation: 公开了一种封装电路组件和用于制造用于电力输送的封装电路组件的方法。 组件包括第一印刷电路板，第二印刷电路板和机械耦合器。 机械耦合器耦合在第一印刷电路板和第二印刷电路板之间并且设置在第一印刷电路板和第二印刷电路板之间。 机械耦合器在第一印刷电路板上的迹线和第二印刷电路板上的迹线之间提供实质的电连续性。

公开(公告)号：US06344684B1

公开(公告)日：2002-02-05

申请号：US09610865

申请日：2000-07-06

Applicant: Rafiqul Hussain ,  Phuc Dinh Do ,  Benjamin G. Tubera

Inventor： Rafiqul Hussain ,  Phuc Dinh Do ,  Benjamin G. Tubera

IPC: H01L2348

CPC classification number: H05K1/141 ,  G01R1/0483 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10325 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: A multi-layered pin grid array interposer used in a test socket for testing and converting a package having a non-pin grid array footprint to a pin grid array footprint. The multi-layered pin grid array interposer test socket includes a multi-layered pin grid array interposer, a semiconductor device mounted on a package having a non-grid array footprint and a fastener. The multi-layered pin grid array interposer includes a top signal layer having bonding pads on an upper surface, a bottom signal layer having a pin grid array footprint on a bottom surface, at least one power layer between ground layers, the ground layers being between the top signal layer and bottom signal layer, and a links for connecting the plurality of bonding pads to the pins of the pin grid array footprint. The fastener presses the package against the multi-layered pin grid array interposer connecting the leads of the package with the bonding pads.

Abstract translation: 用于测试插座中的多层引脚格栅阵列插入器，用于测试和转换具有非引脚栅格阵列封装的封装到引脚栅格阵列占位面积。 多层引脚格栅阵列插入器测试插座包括多层引脚格栅阵列插入器，安装在具有非栅格阵列封装的封装上的半导体器件和紧固件。 所述多层引脚格栅阵列插入件包括顶层信号层，其上表面具有接合焊盘，底部信号层在底表面上具有引脚格栅阵列占地面积，接地层之间的至少一个电源层， 顶部信号层和底部信号层，以及用于将多个接合焊盘连接到引脚栅极阵列覆盖区的引脚的链接。 紧固件将包装压靠在连接包装的引线与接合垫的多层销栅格阵列插入器上。

公开(公告)号：US06272741B1

公开(公告)日：2001-08-14

申请号：US09122225

申请日：1998-07-24

Applicant: Craig M. Kennedy ,  Julian Curtis Hart ,  Fernando J. Ramirez

Inventor： Craig M. Kennedy ,  Julian Curtis Hart ,  Fernando J. Ramirez

IPC: H05K336

CPC classification number: H01R12/523 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01R4/02 ,  H05K3/3426 ,  H05K3/3436 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49149 ,  H01L2224/0401

Abstract: A circuit board interconnect system includes a carrier board with a hybrid solder ball and pin grid array. A plurality of electrically conductive pins extend through the carrier board and are arranged in rows and columns to form a grid array. A first circuit board such as a multi-chip module (MCM) board has a plurality of conductive pads or traces formed on a lower surface thereof that are arranged to form a complementary grid array, i.e. the spacing and location of the conductive pads or traces corresponds to the spacing and location of the pins. A plurality of solder balls are provided with each ball being positioned on top of a corresponding pin so that each solder ball forms a solder connection between a pin and a corresponding conductive pad or trace. A second circuit board such as a computer mother board has a pin connector mounted on an upper surface thereof for individually receiving and providing electrical connection with each of the pins. After reflow, the solder balls wrap around the side walls of the heads of the pins and the side walls of the pads. The resulting generally spherical solder connections are therefore much stronger than conventional elongated fillet connections.

Abstract translation: 电路板互连系统包括具有混合焊球和引脚格栅阵列的载板。 多个导电针延伸穿过载板并且以行和列布置以形成网格阵列。 诸如多芯片模块（MCM）板的第一电路板具有形成在其下表面上的多个导电焊盘或迹线，其布置成形成互补的栅格阵列，即导电焊盘或迹线的间隔和位置 对应于销的间距和位置。 设置多个焊球，每个球位于相应销的顶部，使得每个焊球在销和相应的导电焊盘或迹线之间形成焊接连接​​。 诸如计算机母板的第二电路板具有安装在其上表面上的引脚连接器，用于单独地接收并提供与每个引脚的电连接。 在回流之后，焊球围绕销的头部的侧壁和垫的侧壁。 因此，所得到的大体上球形的焊接连接比传统的细长圆角连接强得多。

公开(公告)号：US06176709B1

公开(公告)日：2001-01-23

申请号：US09472518

申请日：1999-12-27

Applicant: Yoshiiku Sonobe ,  Makoto Oya ,  Satoru Watanabe ,  Osamu Nishida

Inventor： Yoshiiku Sonobe ,  Makoto Oya ,  Satoru Watanabe ,  Osamu Nishida

IPC: H01R909

CPC classification number: H01R12/57 ,  H01L2924/0002 ,  H01R12/58 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10704 ,  H01L2924/00

Abstract: A socket for an integrated circuit which is used for attaching the integrated circuit to a socket mounted on a primary wiring board with an intermediate wiring board interposed therebetween, an adapter for an integrated circuit utilizing the integrated circuit socket, and an integrated circuit assembly utilizing the integrated circuit adapter. The integrated circuit socket includes: a housing to be directly fitted with the integrated circuit; a long insertion pin which is to be inserted through the intermediate wiring board and to be fitted in the socket of the primary wiring board; a short insertion pin which is to be inserted through the intermediate wiring board but not to reach the socket of the primary wiring board; and a surface-mount pin which is to be connected to a surface of the intermediate wiring board opposed to the housing; the long insertion pin, the short insertion pin and the surface-mount pin being implanted in the housing.

Abstract translation: 一种用于集成电路的插座，其用于将集成电路连接到安装在主布线板上的插座之间的中间布线板，用于使用集成电路插座的集成电路的适配器以及利用该集成电路的集成电路组件 集成电路适配器。 集成电路插座包括：直接安装集成电路的外壳; 插入穿过中间布线板并被安装在主布线板的插座中的长插销; 插入中间布线板但不到达初级布线板的插座的短插销; 以及要连接到与壳体相对的中间布线板的表面的表面安装销; 长插入销，短插入销和表面安装销植入壳体中。

公开(公告)号：US06168454A

公开(公告)日：2001-01-02

申请号：US09439463

申请日：1999-11-10

Applicant: Luke Dzwonczyk

Inventor： Luke Dzwonczyk

IPC: H01R1364

CPC classification number: H05K3/306 ,  H01R13/64 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2203/0195 ,  H05K2203/0769

Abstract: A removable pin stabilizer for stabilizing carrier pins of an integrated circuit chip carrier before and during placement of the pins into sockets of a circuit board. The removable pin stabilizer includes a non-dissolvable plate, the non-dissolvable plate having parallel dissolvable sections traversing the plate, the parallel dissolvable sections being through the plate and having holes through the plate for receiving the carrier pins, the holes encompassing the parallel dissolvable sections, wherein the parallel dissolvable sections can be dissolved by a solvent after the chip carrier is mounted and positioned correctly to the circuit board. The resultant additional space created by such removal will allow an increased flow of air between the integrated circuit chip carrier and the circuit board.

Abstract translation: 一种可拆卸的销稳定器，用于在将销插入电路板的插座之前和期间稳定集成电路芯片载体的载体引脚。 可拆卸的销稳定器包括不可溶的板，不可溶的板具有横过板的平行可溶部分，平行的可溶部分穿过板，并且具有穿过板的孔，用于接纳承载销，所述孔包括平行可溶的 其中平行可溶部分可以在芯片载体安装并正确定位到电路板之后通过溶剂溶解。 由这种去除产生的所产生的附加空间将允许在集成电路芯片载体和电路板之间增加空气流。

公开(公告)号：US5946544A

公开(公告)日：1999-08-31

申请号：US754965

申请日：1996-11-22

Applicant: Scott Estes ,  Deepak Swamy

Inventor： Scott Estes ,  Deepak Swamy

IPC: H01L23/367 ,  H01L23/42 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46 ,  H05K7/20 ,  H01L21/52 ,  H01L21/54 ,  H01L21/58

CPC classification number: H05K1/0207 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/10416 ,  H05K2201/10477 ,  H05K2201/10704 ,  H05K3/0061 ,  H05K3/429 ,  H05K3/4641

Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes. In another embodiment of the assembly, the circuit board through holes are replaced with a circuit board opening through which a heat sink structure passes, the heat sink structure being thermally coupled on one side thereof to the die cavity lid. The other side of the heat sink structure engages a metal chassis section which interiorly engages the outer plastic housing wall of a computer.

Abstract translation: 在电路板/ IC封装组件中，IC封装主体部分中的模腔填充有导热液体，从而基本上有助于将操作模具热量传递到面向电路板的IC封装的内侧盖侧。 为了消散由模腔盖接收的模具热量，在电路板中形成间隔开的一系列金属镀通孔。 通孔的金属电镀部分与电路板内的内部接地平面结构接合，并且热耦合到IC封装模腔盖。 因此，在IC封装的工作过程中，模具热量依次通过模腔液体，空腔盖和金属镀通孔传导到接地平面结构。 在组件的另一实施例中，电路板通孔被替换为散热器结构通过的电路板开口，散热器结构在其一侧热耦合到模腔盖。 散热器结构的另一侧接合金属底盘部分，内部与计算机的外部塑料外壳壁接合。