利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

498 条记录 (耗时 0.019 秒)

    POWER SUPPLY MODULE
    41.
    发明申请
    POWER SUPPLY MODULE 有权
    电源模块

    公开(公告)号：US20130039019A1

    公开(公告)日：2013-02-14

    申请号：US13570261

    申请日：2012-08-09

    申请人： Shao-Feng Lu

    发明人： Shao-Feng Lu

    IPC分类号： H05K7/02 ,  H05K7/06

    CPC分类号： H05K7/02 ,  G06F1/189 ,  H05K7/06 ,  H05K7/1492

    摘要： A power supply module adapted to supply power to a peripheral device includes a power supply and an output-structure detachably assembled to the power supply and electrically connected between the power supply and the peripheral device. The height of the output-structure relatively to the bottom portion of the power supply is adjustable and the power supply, output-structure and the peripheral device together form a concave combination-structure. As a result, by using a separated output-structure in the invention, the power supply is able to maneuverably adjust the interconnection position of the peripheral device and the power supply through the second circuit board. Meanwhile, the power supply has a larger usable space therein.

    摘要翻译： 适于向外围设备供电的电源模块包括可拆卸地组装到电源并电连接在电源和外围设备之间的电源和输出结构。 输出结构相对于电源底部的高度是可调的，并且电源，输出结构和外围设备一起形成凹组合结构。 结果，通过在本发明中使用分离的输出结构，电源能够通过第二电路板机动地调节外围设备和电源的互连位置。 同时，电源的可用空间更大。

    SEMICONDUCTOR DEVICE AND CIRCUIT BOARD
    42.
    发明申请
    SEMICONDUCTOR DEVICE AND CIRCUIT BOARD 有权
    半导体器件和电路板

    公开(公告)号：US20110157852A1

    公开(公告)日：2011-06-30

    申请号：US12974107

    申请日：2010-12-21

    申请人： Yoshihiko Ikemoto

    发明人： Yoshihiko Ikemoto

    IPC分类号： H05K7/10 ,  H05K7/00

    CPC分类号： H05K7/06 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A semiconductor device for mounting on a wiring board includes: a container for containing a semiconductor chip; and a plurality of leads, each of the plurality of leads includes a mount connection portion at one end for the semiconductor device to be connected to the wiring board, wherein the plurality of leads includes first leads and second leads, a signal transmission rate of the first leads is higher than that of the second leads, and the mount connection portion of each of the first leads is smaller than that of each of the second leads.

    摘要翻译： 用于安装在布线板上的半导体器件包括：容纳半导体芯片的容器; 以及多个引线，所述多个引线中的每一个在所述半导体器件的一端包括与所述布线板连接的一端的安装连接部，所述多个引线包括第一引线和第二引线，所述多个引线的信号传输速率 第一引线高于第二引线，并且每个第一引线的安装连接部分小于每个第二引线的安装连接部分。

    METHODS FOR FORMING THROUGH WAFER INTERCONNECTS AND STRUCTURES RESULTING THEREFROM
    43.
    发明申请
    METHODS FOR FORMING THROUGH WAFER INTERCONNECTS AND STRUCTURES RESULTING THEREFROM 有权
    形成通过波形互连的结构和结构的方法

    公开(公告)号：US20090160030A1

    公开(公告)日：2009-06-25

    申请号：US12395989

    申请日：2009-03-02

    申请人： Mark E. Tuttle

    发明人： Mark E. Tuttle

    IPC分类号： H01L23/48 ,  H01L21/768

    CPC分类号： H01L23/5384 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K7/06 ,  H01L2924/014 ,  H01L2224/05552

    摘要： The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed.

    摘要翻译： 本发明涉及在半导体衬底中形成贯穿晶片互连的方法以及所得到的结构。 在一个实施例中，用于形成贯通晶片互连的方法包括提供在其表面上具有焊盘的衬底，在焊盘和衬底的表面上沉积钝化层，以及通过钝化层和焊盘形成孔 使用基本上连续的过程。 绝缘层沉积在孔中，随后是导电层和导电填料。 在本发明的另一实施例中，形成半导体器件，其包括延伸穿过导电焊盘并与导电焊盘电耦合的第一互连结构，而第二互连结构通过另一个导电焊盘形成，同时与之电绝缘。 还公开了使用该方法制造的半导体器件和组件。

    Non-rotating wire routing device and method
    49.
    发明授权
    Non-rotating wire routing device and method 失效
    非旋转导线装置及方法

    公开(公告)号：US5482092A

    公开(公告)日：1996-01-09

    申请号：US937027

    申请日：1992-08-31

    申请人： Alan C. Van Zeeland ,  Louis J. Liguore

    发明人： Alan C. Van Zeeland ,  Louis J. Liguore

    IPC分类号： H05K7/06 ,  H05K13/06 ,  B21F27/00

    CPC分类号： H05K7/06 ,  H05K13/06

    摘要： Wire is routed onto a bus plate by a wire routing device that comprises a wire feed mechanism and a non-rotatable wire routing head. The wire routing head has a horn that includes an inverted funnel shaped orifice. The wire feed mechanism pushes wire into the inverted funnel shaped orifice which routes the wire in wire receiving channels and passages of the bus plate in linear and non-linear patterns without any need for rotating the horn with respect to the bus plate.

    摘要翻译： 电线通过包括送丝机构和不可旋转导线头的导线装置布线到总线板上。 导线头具有包括倒置漏斗形孔的喇叭。 送丝机构将电线推入倒置漏斗状的孔中，该倒排的漏斗形孔口以线性和非线性的方式将电线接入导线接收通道和总线板的通道，而不需要相对于总线板旋转喇叭。