公开(公告)号：US12049704B2

公开(公告)日：2024-07-30

申请号：US18173636

申请日：2023-02-23

Applicant: Fabric8Labs, Inc.

Inventor： David Forrest Pain ,  David Morgan Wirth ,  Jeffrey William Herman

IPC: C25D1/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y70/00 ,  C25D3/12 ,  C25D3/20 ,  C25D3/22 ,  C25D3/24 ,  C25D3/38 ,  C25D3/40 ,  C25D3/44 ,  C25D3/46 ,  C25D5/04 ,  C25D5/10 ,  C25D9/02 ,  C25D15/00 ,  C25D17/12 ,  C25D21/12

CPC classification number: C25D1/003 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y70/00 ,  C25D3/12 ,  C25D3/20 ,  C25D3/22 ,  C25D3/24 ,  C25D3/38 ,  C25D3/40 ,  C25D3/44 ,  C25D3/46 ,  C25D5/04 ,  C25D5/10 ,  C25D9/02 ,  C25D15/00 ,  C25D17/12 ,  C25D21/12

Abstract: An apparatus and method for electrochemically depositing a unitary layer structure using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit configured to receive a signal containing anode address data and configured to output a signal causing an anode array pattern; and, a first controller being a current controller configured to control a flow of current to the anode array; a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit; and a third controller configured to clear bubbles which have formed on the anode after a length of time of steady state deposition by controlling the flow of the electrolyte solution across the anode array surface.

公开(公告)号：US11657963B2

公开(公告)日：2023-05-23

申请号：US17466452

申请日：2021-09-03

Applicant: Enphase Energy, Inc.

Inventor： Michael J. Harrison

IPC: C25D1/00 ,  H01F41/098 ,  C25D7/06 ,  C25D3/40 ,  C25D17/00

CPC classification number: H01F41/098 ,  C25D1/003 ,  C25D3/40 ,  C25D7/0614 ,  C25D17/00

Abstract: Methods and apparatus for producing helix windings used for a transformer are provided. For example, apparatus comprise an electrically conductive mandrel comprising an elongated body, a head comprising an eyelet detail, and a winding structure disposed along the elongated body.

公开(公告)号：US20220084747A1

公开(公告)日：2022-03-17

申请号：US17466452

申请日：2021-09-03

Applicant: Enphase Energy, Inc.

Inventor： Michael J. HARRISON

IPC: H01F41/098 ,  C25D3/40 ,  C25D7/06

Abstract: Methods and apparatus for producing helix windings used for a transformer are provided. For example, apparatus comprise an electrically conductive mandrill comprising an elongated body, a head comprising an eyelet detail, and a winding structure disposed along the elongated body.

公开(公告)号：US10714756B2

公开(公告)日：2020-07-14

申请号：US15349341

申请日：2016-11-11

Applicant: GM Global Technology Operations LLC

Inventor： Fang Dai ,  Mahmoud H. Abd Elhamid ,  Anne M. Dailly ,  Mei Cai

IPC: H01M10/052 ,  H01M4/66 ,  C25D3/38 ,  C25D3/12 ,  C23C18/16 ,  C25D5/44 ,  C25D3/40 ,  C23C18/54

Abstract: In certain aspects, electrolytic deposition and electroless displacement deposition methods are provided to form bimetallic structures that may be used as a bipolar current collector in a battery or a substrate for forming graphene sheets. In other aspects, bipolar current collectors for lithium-ion based electrochemical cells are provided. The bimetallic current collector may have an aluminum-containing surface and a continuous copper coating. In other aspects, a flexible substrate may be coated with one or more conductive materials, like nickel, copper, graphene, aluminum, alloys, and combinations thereof. The flexible substrate is folded to form a bipolar current collector. New stack assemblies for lithium-ion based batteries incorporating such bipolar current collectors are also provided that can have cells with a tab-free and/or weld-free design.

公开(公告)号：US09617647B2

公开(公告)日：2017-04-11

申请号：US13384732

申请日：2010-07-19

Applicant: Cornelia Roeger-Goepfert ,  Roman Benedikt Raether ,  Dieter Mayer ,  Alexandra Haag ,  Charlotte Emnet

Inventor： Cornelia Roeger-Goepfert ,  Roman Benedikt Raether ,  Dieter Mayer ,  Alexandra Haag ,  Charlotte Emnet

IPC: C25D5/02 ,  H01L21/288 ,  C25D3/58 ,  C25D3/38 ,  C25D3/02 ,  H01L21/768 ,  C25D3/40

CPC classification number: C25D3/38 ,  C25D3/02 ,  C25D3/40 ,  H01L21/2885 ,  H01L21/76877

Abstract: A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a polyhydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.

公开(公告)号：US20150197870A1

公开(公告)日：2015-07-16

申请号：US14593313

申请日：2015-01-09

Applicant: The Board of Trustees of the Leland Stanford Junior University

Inventor： Ali A. Farvid

IPC: C25D5/34 ,  C25F3/16 ,  C25D3/40 ,  C25D5/18 ,  C25D3/12

CPC classification number: C25F3/16 ,  C25D3/12 ,  C25D3/40 ,  C25D5/12 ,  C25D5/18 ,  C25D5/36 ,  C25D5/48 ,  C25F3/24

Abstract: A method of depositing an oxygen-free electronic copper layer on a metal substrate is provided that includes cleaning a substrate surface, electropolishing the substrate surface activating the substrate surface, depositing nickel on the substrate; and depositing copper on the substrate using a cyanide copper strike bath and a cyanide copper plate bath, where a periodic pulse and a reverse periodic pulse current is applied using a pulse periodic reverse current power supply, where the deposited oxygen-free copper comprises a fine-grained, equiaxed structure having a uniform surface geometry and less than 10% thickness variation across all surfaces.

Abstract translation: 提供了一种在金属基底上沉积无氧电子铜层的方法，其包括清洗衬底表面，电抛光激活衬底表面的衬底表面，在衬底上沉积镍; 并使用氰化铜冲击浴和氰化物铜板槽在基板上沉积铜，其中使用脉冲周期反向电流电源施加周期性脉冲和反向周期脉冲电流，其中沉积的无氧铜包括细 均匀的等轴结构具有均匀的表面几何形状，并且在所有表面上的厚度变化小于10％。

公开(公告)号：US3790451A

公开(公告)日：1974-02-05

申请号：US3790451D

申请日：1969-08-29

Applicant: RICHARDSON CHEMICAL CO

Inventor： WEISENBERGER L ,  BIORA J

IPC: C25D3/40 ,  H05K3/42 ,  C23B5/48

CPC classification number: C25D3/40 ,  H05K3/423 ,  Y10S204/09

Abstract: A PROCESS FOR ELECTROPLATING COPPER ON A BASE MEMBER COMPRISING APPLYING TO THE MEMBER AN ESSENTIALLY SULFURFREE AQUEOUS ALKALINE CYANIDE PLATING BATH COMRPISING A SOURCE OF COPPER, AN ACETYLENIC ALCOHOL, A COMPLEXING AGENT AND A HYDROXY ACID. CURRENT IS CAUSED TO FLOW THROUGH THE MEMBER WHILE IN CONTACT WITH THE PLATING BATH FOR A PERIOD OF 20-60 SECONDS TO ELECTROPLATE COPPER ON SAID MEMBER. THEREAFTER A DEPLATING ELECTRIC CURRENT IS CAUSED TO FLOW THROUGH SAID MEMBER FOR A PERIOD OF 6-20 SECONDS TO DEPLATE A PART OF THE COPPER PLATED ON THE MEMBER. ALTERNATE PLATING AND DEPLATING CYCLES ARE CONTINUED UNTIL A DESIRED THICKNESS OF COPPER HAS BEEN DEPOSITED ON THE MEMBER.

公开(公告)号：US3296101A

公开(公告)日：1967-01-03

申请号：US26082363

申请日：1963-02-25

Applicant: COWLES CHEM CO

Inventor： CRAIN JAMES R

IPC: C25D3/02 ,  C25D3/38 ,  C25D3/40 ,  C25D3/58

CPC classification number: C25D3/40 ,  C25D3/02 ,  C25D3/38 ,  C25D3/58

公开(公告)号：US3269925A

公开(公告)日：1966-08-30

申请号：US33986764

申请日：1964-01-24

Applicant: HARSHAW CHEM CORP

Inventor： DU ROSE ARTHUR H

IPC: C07F9/09 ,  C25D3/40

CPC classification number: C25D3/40 ,  C07F9/091

公开(公告)号：US3084112A

公开(公告)日：1963-04-02

申请号：US4610260

申请日：1960-07-29

Applicant: ALLIED RES PRODUCTS INC

Inventor： PETER LEENDERS ,  CREUTZ HANS G

IPC: C25D3/40

CPC classification number: C25D3/40