公开(公告)号：US20070195197A1

公开(公告)日：2007-08-23

申请号：US11655246

申请日：2007-01-19

Applicant: Ki-ae Seong ,  Sung-woo Kim ,  Yong-hwan Kwon ,  Keum-Koo Lee

Inventor： Ki-ae Seong ,  Sung-woo Kim ,  Yong-hwan Kwon ,  Keum-Koo Lee

IPC: H04N5/44 ,  H04N5/50

CPC classification number: H04N5/44591 ,  H04N5/4401 ,  H04N5/45 ,  H04N5/50 ,  H04N21/4312 ,  H04N21/44222 ,  H04N21/482

Abstract: A method and an apparatus for providing a user interface which implements screen conversion by channel change in a three-dimensional view, are provided. The method includes receiving a signal for converting a screen into a screen of a first channel, calculating the relationship according to a channel order between the first channel and a second channel that is currently being broadcasted, outputting a portion of broadcasting images of the first channel to a region where broadcasting images of the second channel are output, according to the calculated result, and outputting all the broadcasting images of the first channel.

Abstract translation: 提供了一种用于提供通过三维视图中的频道改变来实现屏幕转换的用户界面的方法和装置。 该方法包括接收用于将屏幕转换为第一频道的屏幕的信号，根据当前正在广播的第一频道和第二频道之间的频道顺序来计算关系，输出第一频道的广播图像的一部分 根据计算结果输出到第二频道的广播图像的区域，并输出第一频道的所有广播图像。

公开(公告)号：US20070152331A1

公开(公告)日：2007-07-05

申请号：US11513173

申请日：2006-08-31

Applicant: Uu-Byung Kang ,  Yong-Hwan Kwon ,  Jong-Ho Lee ,  Chung-Sun Lee

Inventor： Uu-Byung Kang ,  Yong-Hwan Kwon ,  Jong-Ho Lee ,  Chung-Sun Lee

IPC: H01L23/48

CPC classification number: C22C30/06 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K3/3463 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Example embodiments of the present invention relate to an alloy solder and a semiconductor device using the alloy solder. Other example embodiments relate to an alloy solder capable of increasing reliability of a junction between a semiconductor chip and a substrate. According to still other example embodiments of the present invention, there may be a tin-bismuth (Sn—Bi) family alloy solder between a semiconductor chip and a substrate, and a semiconductor device using the alloy solder. The semiconductor device may include a semiconductor chip formed with a plurality of gold (Au) bumps, a substrate having metal wirings connected to the gold (Au) bumps, and a junction including a tin-bismuth (Sn—Bi) family alloy solder interposed between and connecting the gold (Au) bump and the metal wiring.The formation of a relatively large amount of AuSn4 intermetallic compound may be inhibited in the junction because gold (Au) may not easily diffuse into a tin-bismuth (Sn—Bi) family alloy solder of a liquid state during a reflow process for connecting the semiconductor chip and substrate. Therefore, most of the junction may be retained as the tin-bismuth (Sn—Bi) family alloy solder.

Abstract translation: 本发明的示例性实施例涉及合金焊料和使用该合金焊料的半导体器件。 其他示例实施例涉及能够增加半导体芯片和基板之间的结的可靠性的合金焊料。 根据本发明的另一个示例性实施例，可以在半导体芯片和衬底之间存在锡 - 铋（Sn-Bi）族合金焊料，以及使用该合金焊料的半导体器件。 半导体器件可以包括形成有多个金（Au）凸块的半导体芯片，具有连接到金（Au）凸块的金属布线的衬底以及插入了锡 - 铋（Sn-Bi）族合金焊料的接合部 之间并连接金（Au）凸块和金属布线。 由于金（Au）可能不容易扩散到液体的锡 - 铋（Sn-Bi）族合金焊料中，所以在结中可以抑制相对大量的AuSn 4+金属间化合物的形成 在用于连接半导体芯片和衬底的回流工艺期间状态。 因此，大部分接点可以作为锡 - 铋（Sn-Bi）族合金焊料保留。

公开(公告)号：US07190073B2

公开(公告)日：2007-03-13

申请号：US11158164

申请日：2005-06-20

Applicant: Yong-Hwan Kwon ,  Sa-Yoon Kang ,  Chung-Sun Lee ,  Kyoung-Sei Choi

Inventor： Yong-Hwan Kwon ,  Sa-Yoon Kang ,  Chung-Sun Lee ,  Kyoung-Sei Choi

IPC: H01L23/48

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L23/49811 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/0032 ,  H05K3/323 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a laser to create an etched area that defines raised portion relatively raised from the etched area. Then a circuit pattern is selectively formed on the base film, partly running over the raised portions. The raised portion and the overlying circuit pattern constitute the film bumps having a height not greater than the height of the circuit film.

Abstract translation: 为薄膜封装提供具有膜凸块的电路薄膜。 IC芯片通过膜凸块机械连接并电耦合到电路膜，而不是传统的芯片凸块。 在制造方法中，通过激光部分地蚀刻基底膜以产生限定从蚀刻区域相对升高的凸起部分的蚀刻区域。 然后，在基膜上选择性地形成电路图案，部分地在凸起部分上运行。 凸起部分和上覆电路图案构成具有不大于电路膜高度的高度的膜凸块。

公开(公告)号：US07074704B2

公开(公告)日：2006-07-11

申请号：US10860536

申请日：2004-06-02

Applicant: Yong-hwan Kwon ,  Sa-yoon Kang

Inventor： Yong-hwan Kwon ,  Sa-yoon Kang

IPC: H01L21/44 ,  H01L23/52

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/10126 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A bump of a semiconductor chip comprises a plurality of bond pads formed on a semiconductor chip, a conductive bump formed on the bond pads; and a sidewall insulating layer formed on sidewalls of the conductive bump. It is possible for the semiconductor chip to prevent electrical shorts and improve productivity even though a pitch of bond pad is decreased.

公开(公告)号：US20060091504A1

公开(公告)日：2006-05-04

申请号：US11256650

申请日：2005-10-21

Applicant: Un-Byoung Kang ,  Chung-Sun Lee ,  Sa-Yoon Kang ,  Yong-Hwan Kwon

Inventor： Un-Byoung Kang ,  Chung-Sun Lee ,  Sa-Yoon Kang ,  Yong-Hwan Kwon

IPC: H01L23/58

CPC classification number: H05K3/3463 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05572 ,  H01L2224/13144 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/8181 ,  H01L2224/81825 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/189 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: In one embodiment, a film circuit substrate comprises an insulating film made of polyimide resin; a conductive circuit pattern formed on the insulating film, the circuit pattern including an inner lead to be connected with a conductive bump of a semiconductor chip through a bump bonding process; and a tin-indium alloy layer formed on the inner lead to produce an inter-metallic compound layer of AuxSn composition during the bump bonding process.

Abstract translation: 在一个实施例中，薄膜电路基板包括由聚酰亚胺树脂制成的绝缘膜; 形成在所述绝缘膜上的导电电路图案，所述电路图案包括通过凸块接合工艺与半导体芯片的导电凸块连接的内部引线; 以及形成在内部引线上的锡铟合金层，以在凸点焊接工艺期间产生Au / Sn组分的金属间化合物层。

公开(公告)号：US06376279B1

公开(公告)日：2002-04-23

申请号：US09482216

申请日：2000-01-12

Applicant: Yong Hwan Kwon ,  Sa Yoon Kang ,  Nam Seog Kim ,  Dong Hyeon Jang

Inventor： Yong Hwan Kwon ,  Sa Yoon Kang ,  Nam Seog Kim ,  Dong Hyeon Jang

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/02 ,  H01L24/12 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A semiconductor package manufacturing method includes: providing a rerouting film; attaching a semiconductor wafer having integrated circuits to the rerouting film, such that chip pads of the integrated circuits correspond to via holes of the rerouting film; forming a solder filling in each of the via holes to electrically connect the chip pads to the metal pattern layer; forming external terminals on terminal pads of the rerouting film; and separating the wafer and the rerouting film into individual semiconductor packages. A method further includes forming a protection layer on the solder filling. Instead of the semiconductor wafer, individual integrated circuit chips can be attached on the rerouting film. The semiconductor package includes: an integrated circuit having chip pads; a substrate attached to the integrated circuit so that via holes of the substrate are above the chip pads; solder fillings inside the via holes, the solder fillings electrically connecting the chips pads to the pattern metal layer; and another dielectric layer between the substrate and the semiconductor integrated circuit. The semiconductor package further includes external terminals, interconnection bumps on the chip pads, and polymer protection layers on the solder fillings.

Abstract translation: 半导体封装制造方法包括：提供重新布线膜; 将具有集成电路的半导体晶片连接到重新布线膜，使得集成电路的芯片焊盘对应于重新布线膜的通孔; 在每个所述通孔中形成焊料填充物，以将所述芯片焊盘电连接到所述金属图案层; 在重新布线膜的端子焊盘上形成外部端子; 以及将所述晶片和所述重新布线膜分离成单独的半导体封装。 一种方法还包括在焊料填充物上形成保护层。 代替半导体晶片，各个集成电路芯片可以附着在重新布线的薄膜上。 半导体封装包括：具有芯片焊盘的集成电路; 附着到集成电路的衬底，使得衬底的通孔位于芯片焊盘之上; 通孔内的焊料填充物，焊料填充物将芯片焊盘电连接到图案金属层; 以及衬底和半导体集成电路之间的另一介质层。 半导体封装还包括外部端子，芯片焊盘上的互连凸块和焊料填充物上的聚合物保护层。

公开(公告)号：US09723350B2

公开(公告)日：2017-08-01

申请号：US13290198

申请日：2011-11-07

Applicant: Joo-youn Kim ,  Yong-hwan Kwon ,  Jung-a Kim ,  Bum-jin Lee

Inventor： Joo-youn Kim ,  Yong-hwan Kwon ,  Jung-a Kim ,  Bum-jin Lee

IPC: H04N5/44 ,  H04N21/41 ,  G08C17/02 ,  H04N21/482

CPC classification number: H04N21/4126 ,  G08C17/02 ,  G08C2201/32 ,  H04N21/482

Abstract: A control device is provided. The control device includes a communication interface unit which requests and receives menu information from a broadcast receiver, a determination unit which determines a control mode of the control device, a user interface unit which displays the received menu information in a user interface window according to the determined control mode, and a control unit which, if a command to control the broadcast receiver is input through the user interface unit, controls the communication interface unit to transmit the input control command to the broadcast receiver.

公开(公告)号：US09483936B2

公开(公告)日：2016-11-01

申请号：US12905668

申请日：2010-10-15

Applicant: Yeo-ri Yoon ,  Yong-hwan Kwon ,  Joo-youn Kim

Inventor： Yeo-ri Yoon ,  Yong-hwan Kwon ,  Joo-youn Kim

IPC: G06F3/048 ,  G08C23/04 ,  G08C17/02 ,  H04N21/41

CPC classification number: G08C23/04 ,  G08C17/02 ,  G08C2201/30 ,  H04N21/4126

Abstract: A display system, a display device, and a remote controller for controlling the display device are provided. The remote controller includes: a touch screen which receives an input from a user and display a first manipulation UI group including a shortcut key corresponding to a plurality of buttons to control the display device; a signal output unit which outputs a control signal to the display device based on an input to the touch screen; and a controller which, in response to a user's selection of the shortcut key, displays on the touch screen a second manipulation UI group and parts of the first manipulation UI group, the second manipulation UI group displaying the plurality of buttons.

Abstract translation: 提供了一种用于控制显示装置的显示系统，显示装置和遥控器。 遥控器包括：触摸屏，其接收来自用户的输入并显示包括与多个按钮对应的快捷键的第一操作UI组以控制显示装置; 信号输出单元，其基于对所述触摸屏的输入向所述显示装置输出控制信号; 以及控制器，响应于用户对快捷键的选择，在触摸屏上显示第二操作UI组和第一操作UI组的一部分，显示多个按钮的第二操作UI组。

公开(公告)号：US09479817B2

公开(公告)日：2016-10-25

申请号：US13155068

申请日：2011-06-07

Applicant: Yong-hwan Kwon

Inventor： Yong-hwan Kwon

IPC: G06F3/041 ,  H04N21/4227 ,  G06F3/0488 ,  H04N5/44 ,  H04N21/422 ,  H04N21/482

CPC classification number: H04N21/4227 ,  G06F3/0482 ,  G06F3/0488 ,  G06F3/04883 ,  H04N5/4403 ,  H04N5/44543 ,  H04N5/44582 ,  H04N21/42208 ,  H04N21/42209 ,  H04N21/42224 ,  H04N21/4312 ,  H04N21/482 ,  H04N21/4821 ,  H04N21/84 ,  H04N2005/4408 ,  H04N2005/443

Abstract: A display apparatus includes: an image processor; a display unit; a remote controller which includes a touch input unit to detect motion of a user; a remote control signal receiver which receives a remote control signal from the remote controller corresponding to the motion of a user; and a controller which displays the content information window as if the content information window enters from an outside of a display area to an inside of the display area in accordance with the motion that a user moves from an outside of an area of the touch input unit to an inside of the area, or stops displaying the content information window as if the content information window exits from the inside of the display area to the outside of the display area in accordance with the motion that a user moves from the inside of the area of the touch input unit to the outside of the touch input unit.

Abstract translation: 一种显示装置，包括：图像处理器; 显示单元; 遥控器，其包括用于检测用户的运动的触摸输入单元; 远程控制信号接收器，其对应于用户的运动从遥控器接收遥控信号; 以及控制器，其根据用户从触摸输入单元的区域的外部移动的动作，显示内容信息窗口，就好像内容信息窗口从显示区域的外部进入显示区域的内部 或者停止显示内容信息窗口，就像内容信息窗口是否按照用户从该区域的内部移动的方式从显示区域的内部退出到显示区域的外部 的触摸输入单元的外部。

公开(公告)号：US09032330B2

公开(公告)日：2015-05-12

申请号：US12501134

申请日：2009-07-10

Applicant: Mi-ju Park ,  Sang-hee Lee ,  Yong-hwan Kwon ,  Jeong-yeon Lee ,  Won-il Kim ,  Woo-seok Hwang ,  Yeo-ri Yoon

Inventor： Mi-ju Park ,  Sang-hee Lee ,  Yong-hwan Kwon ,  Jeong-yeon Lee ,  Won-il Kim ,  Woo-seok Hwang ,  Yeo-ri Yoon

IPC: G06F3/048 ,  G06F3/0482

CPC classification number: G06F3/0482

Abstract: A display apparatus and a user interface display method of the display apparatus are provided. The display apparatus classifies menu items of a service menu or an OSD menu according to the frequency of use of the menu items, generates icons corresponding to the classified menu items, and displays the icons on a screen using a user interface. Accordingly, the user can display a user interface on the screen in a preferable manner, and easily find and utilize a desired menu item.

Abstract translation: 提供了显示装置的显示装置和用户界面显示方法。 显示装置根据菜单项的使用频率对服务菜单或OSD菜单的菜单项进行分类，生成与分类菜单项对应的图标，并使用用户界面将画面显示在画面上。 因此，用户可以以优选的方式在屏幕上显示用户界面，并且容易地找到并利用期望的菜单项。