公开(公告)号：US5191928A

公开(公告)日：1993-03-09

申请号：US798506

申请日：1991-11-26

申请人： Toshio Sato ,  Shunichi Sugiyama ,  Toshio Ishii ,  Masayuki Nakada ,  Takashi Oosako ,  Kentaro Mori

发明人： Toshio Sato ,  Shunichi Sugiyama ,  Toshio Ishii ,  Masayuki Nakada ,  Takashi Oosako ,  Kentaro Mori

IPC分类号： B22D11/06 ,  B22D11/115

CPC分类号： B22D11/0622 ,  B22D11/0662 ,  B22D11/115

摘要： A method for continuous casting of steel comprises the steps of feeding molten steel to cooling device for cooling molten steel by use of feeding device for feeding molten steel; cooling fed molten steel by the cooling device; generating a high-frequency magnetic field near a zone where the feeding device, the cooling device and molten steel contact each other; and converging the high-frequency magnetic field on the zone where the feeding device, the cooling device and molten steel contact each other. Further, an apparatus for continuous casting of steel comprises feeding device for feeding molten steel; cooling device for cooling molten steel fed by the feeding device; generating device for generating a high-frequency magnetic field near a zone where the feeding device, the cooling device and molten steel contact each other; and converging device for converging the magnetic field on the zone where the feeding device, the cooling device and molten steel contact each other.

公开(公告)号：US08833923B2

公开(公告)日：2014-09-16

申请号：US13325635

申请日：2011-12-14

申请人： Kentaro Mori ,  Daisuke Uematsu ,  Nobuhiro Hayakawa

发明人： Kentaro Mori ,  Daisuke Uematsu ,  Nobuhiro Hayakawa

IPC分类号： B41J2/01 ,  B41J2/17 ,  B41J3/407 ,  H05K3/12

CPC分类号： H05K3/1258 ,  H05K3/125

摘要： There is provided a method for forming a conductor, including a first printing step of printing a contour part of the conductor with a first printing ink, a drying step of drying the printed contour part, and a second printing step of printing a remaining part of the conductor with a second printing ink, wherein the second printing ink contains a conductive material and has a surface tension lower than or equal to a surface tension of the first printing ink.

摘要翻译： 提供一种用于形成导体的方法，包括用第一印刷油墨印刷导体的轮廓部分的第一印刷步骤，干燥印刷轮廓部分的干燥步骤，以及打印剩余部分的第二印刷步骤 所述导体具有第二印刷油墨，其中所述第二印刷油墨包含导电材料并具有低于或等于所述第一印刷油墨的表面张力的表面张力。

公开(公告)号：US08710639B2

公开(公告)日：2014-04-29

申请号：US13639735

申请日：2011-02-22

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Kentaro Mori ,  Yoshiki Nakashima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Kentaro Mori ,  Yoshiki Nakashima

IPC分类号： H01L23/02

CPC分类号： H05K1/185 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/50 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/19041 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/1469 ,  H01L2224/81 ,  H01L2924/00015 ,  H01L2224/85 ,  H01L2224/82 ,  H01L2224/45 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/48

摘要： A wiring substrate in which a semiconductor element is built includes a semiconductor element; a peripheral insulating layer covering at least an outer circumferential side surface of this semiconductor element; and an upper surface-side wiring line provided on the upper surface side of the wiring substrate. The semiconductor element includes an internal terminal electrically connected to the upper surface-side wiring line on the upper surface side of the semiconductor element. This internal terminal includes a first conductive part exposed out of an insulating surface layer of the semiconductor element; an adhesion layer on this first conductive part; and a second conductive part on this adhesion layer. The adhesion layer covers an exposed surface of the first conductive part, and is formed on a portion of the insulating surface layer around the exposed surface of the first conductive part, and the adhesion layer extends around the outer side of an outer edge of this second conductive part so as to surround the second conductive part.

摘要翻译： 构成半导体元件的布线基板包括半导体元件; 覆盖该半导体元件的至少外周侧表面的外围绝缘层; 以及设置在布线基板的上表面侧的上表面侧布线。 半导体元件包括电连接到半导体元件的上表面侧的上表面侧布线的内部端子。 该内部端子包括从半导体元件的绝缘表面层露出的第一导电部件; 在该第一导电部分上的粘附层; 和该粘合层上的第二导电部分。 粘合层覆盖第一导电部分的暴露表面，并且形成在第一导电部分的暴露表面周围的绝缘表面层的一部分上，并且粘合层围绕该第二导电部分的外边缘的外侧延伸 导电部件以包围第二导电部件。

公开(公告)号：US08692364B2

公开(公告)日：2014-04-08

申请号：US13389234

申请日：2010-08-06

申请人： Katsumi Kikuchi ,  Yoshiki Nakashima ,  Kentaro Mori ,  Shintaro Yamamichi

发明人： Katsumi Kikuchi ,  Yoshiki Nakashima ,  Kentaro Mori ,  Shintaro Yamamichi

IPC分类号： H01L23/06 ,  H01L23/48 ,  H01L23/02 ,  H01L23/522 ,  H01L21/4763 ,  H01L21/48

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24226 ,  H01L2224/73267 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/0366 ,  H05K3/4682 ,  H05K2201/029 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device includes an embedding layer in which one or more semiconductor element(s) is embedded and one or more interconnect layers as well as one or more insulation layers on one or both sides of the embedding layer. The embedding layer includes a woven cloth formed by reinforcement fibers. The woven cloth has an opening on its site embedding the semiconductor element. The opening is arranged so that direction of the reinforcement fibers will have a preset angle with respect to a direction of a side of or a tangent to at least a portion of the opening, the preset angle being other than a square angle or a zero angle (parallelism).

摘要翻译： 一种半导体器件包括其中嵌入一个或多个半导体元件的嵌入层和一个或多个互连层以及在嵌入层的一侧或两侧上的一个或多个绝缘层。 嵌入层包括由增强纤维形成的织布。 编织布在其内部具有嵌入半导体元件的开口。 开口被布置成使得加强纤维的方向相对于开口的至少一部分的一侧的方向或切线的方向具有预设角度，预设角度不同于方角或零角度 （并行）。

公开(公告)号：US08623939B2

公开(公告)日：2014-01-07

申请号：US13363845

申请日：2012-02-01

申请人： Daisuke Uematsu ,  Kentaro Mori ,  Nobuhiro Hayakawa

发明人： Daisuke Uematsu ,  Kentaro Mori ,  Nobuhiro Hayakawa

IPC分类号： C09D11/02

CPC分类号： C09D11/322 ,  C09D11/52

摘要： An ink contains at least a first solid particle, and a second solid particle formed of a base material of a different main component from that of the first solid particle. The first solid particle and the second solid particle have zeta potentials of the same polarity, or zeta potentials of 0±5 mV. The first and second solid particles in the ink have the same surface property, specifically the same interface property in the ink. This makes it possible to use a common dispersant suited for adsorption on the first and second solid particles. In this way, more than one kind of solid particle can be stably dispersed using a sole kind of dispersant.

摘要翻译： 油墨含有至少第一固体颗粒和由与第一固体颗粒不同的主要成分的基材形成的第二固体颗粒。 第一固体颗粒和第二固体颗粒具有相同极性的ζ电位或0±5mV的ζ电位。 油墨中的第一和第二固体颗粒具有相同的表面性质，特别是在油墨中具有相同的界面性质。 这使得可以在第一和第二固体颗粒上使用适于吸附的普通分散剂。 以这种方式，可以使用单一种类的分散剂稳定地分散多种固体颗粒。

公开(公告)号：US08569892B2

公开(公告)日：2013-10-29

申请号：US13062262

申请日：2009-10-05

申请人： Kentaro Mori ,  Daisuke Ohshima ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Katsumi Kikuchi ,  Yoshiki Nakashima

发明人： Kentaro Mori ,  Daisuke Ohshima ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Katsumi Kikuchi ,  Yoshiki Nakashima

IPC分类号： H01L23/48 ,  H01L23/10

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/142 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes: at least one semiconductor element having electrode terminals; a metal plate supporting the semiconductor element; and a wiring board covering the semiconductor element and including a plurality of insulating layers and wiring layers alternately stacked and external connection terminals on a surface, the wiring layers being electrically connected to each other by vias. The electrode terminals and the external connection terminals are electrically connected via at least one of the wiring layers and the vias. At least one of the electrode terminals, the is wiring layers, and the vias is electrically connected to the metal plate.

摘要翻译： 半导体器件包括：至少一个具有电极端子的半导体元件; 支撑半导体元件的金属板; 以及覆盖半导体元件并且在表面上交替堆叠的多个绝缘层和布线层以及外部连接端子的布线板，布线层通过通孔彼此电连接。 电极端子和外部连接端子经由布线层和通孔中的至少一个电连接。 至少一个电极端子，即布线层和通孔，电连接到金属板。

公开(公告)号：US20120300425A1

公开(公告)日：2012-11-29

申请号：US13574455

申请日：2011-01-07

申请人： Yoshiki Nakashima ,  Shintaro Yamamichi ,  Katsumi Kikuchi ,  Kentaro Mori ,  Hideya Murai

发明人： Yoshiki Nakashima ,  Shintaro Yamamichi ,  Katsumi Kikuchi ,  Kentaro Mori ,  Hideya Murai

IPC分类号： H05K1/18 ,  H05K1/11

CPC分类号： H05K1/182 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/18162 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/185 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2924/00

摘要： An object of the present invention is to propose a functional element built-in substrate which enables an electrode terminal of a functional element to be well connected to the back surface on the side opposite to the electrode terminal of the functional element, and which can be miniaturized. According to the present invention, there is provided a functional element built-in substrate including a functional element provided with an electrode terminal on one surface side of the functional element, and a wiring substrate including a laminated structure in which the functional element is embedded so that the electrode terminal of the functional element faces the front surface side of the structure, and which is formed at least in a side surface region of the functional element by laminating a plurality of wiring insulating layers each including a wiring, the functional element built-in substrate being featured in that the electrode terminal and the back surface side of the wiring substrate are electrically connected to each other through the wiring of the laminated structure, and in that, in a pair of the wiring insulating layers included in the laminated structure and that are in contact with each other, the cross-sectional shape of the wiring in each of the wiring insulating layers, which cross-sectional shape is taken along the plane perpendicular to the extension direction of the wiring in the wiring insulating layer, has a relationship that the cross-sectional area of the wiring in the back surface side wiring insulating layer is larger than the cross-sectional area of the wiring in the front surface side wiring insulating layer.

摘要翻译： 本发明的目的是提出一种功能元件内置基板，其使功能元件的电极端子能够良好地连接到与功能元件的电极端子相反的一侧的背面，并且其可以是 小型化。 根据本发明，提供了一种功能元件内置基板，其包括在功能元件的一个表面侧上设置有电极端子的功能元件，以及包括功能元件嵌入其中的层叠结构的布线基板 所述功能元件的电极端子面向所述结构的前表面侧，并且通过层叠多个布线绝缘层而形成在所述功能元件的至少侧面区域中，所述多个布线绝缘层包括布线， 其特征在于，布线基板的电极端子和背面侧通过层叠结构的布线电连接，并且其中，在层叠结构中包括的一对布线绝缘层和 彼此接触，每个布线绝缘中的布线的横截面形状 与布线绝缘层中的配线的延伸方向垂直的平面截取的截面形状的层具有这样的关系：背面侧配线绝缘层中的布线的截面积大于 表面侧配线绝缘层中的配线的截面积。

公开(公告)号：US08286629B2

公开(公告)日：2012-10-16

申请号：US12866082

申请日：2009-02-25

申请人： Masayuki Esaki ,  Kentaro Mori ,  Makoto Tabata ,  Kei Asai ,  Yosuke Fujii

发明人： Masayuki Esaki ,  Kentaro Mori ,  Makoto Tabata ,  Kei Asai ,  Yosuke Fujii

IPC分类号： A61M11/00

CPC分类号： A61M11/06 ,  A61M11/005 ,  A61M15/0015 ,  A61M15/0016 ,  A61M15/0018 ,  A61M16/1065 ,  A61M16/107 ,  A61M16/208

摘要： A nebulizer includes a nebulizer body a relay pipe. The nebulizer body includes a connection portion that has an aerosol lead-out port to lead out aerosol, and the relay pipe includes a connection portion that has an aerosol introduction port to introduce the aerosol. The nebulizer body the relay pipe can take a first connection state in which the relay pipe detachably connected to the nebulizer body and a second connection state in which the relay pipe is connected to the nebulizer body so as to be not able to be detached from the nebulizer body. In the first connection state, the aerosol introduction port and the aerosol lead-out port are communicated with each other. In the second connection state, the aerosol lead-out port is blocked by a blocking portion provided in the relay pipe. Therefore, the nebulizer in which reuse of the nebulizer body or relay pipe is simply prohibited after the usage can be provided by the configuration.

摘要翻译： 雾化器包括一个喷雾器体，一个中继管。 喷雾器主体包括具有气溶胶引出口以引出气溶胶的连接部分，并且中继管包括具有气溶胶引入口以引入气溶胶的连接部分。 中继管可以采用第一连接状态，其中可拆卸地连接到喷雾器主体的继电器管和第二连接状态，其中继电器管连接到喷雾器主体，从而不能从 雾化器体。 在第一连接状态下，气溶胶引入口和气溶胶引出口彼此连通。 在第二连接状态下，气溶胶引出口被设置在中继管中的阻塞部分阻挡。 因此，可以通过配置来提供在使用之后简单地禁止喷雾器主体或中继管的重用的雾化器。

公开(公告)号：US20120153501A1

公开(公告)日：2012-06-21

申请号：US13392714

申请日：2010-08-27

申请人： Hideya Murai ,  Kentaro Mori ,  Shintaro Yamamichi ,  Masahiro Komuro ,  Masaya Kawano

发明人： Hideya Murai ,  Kentaro Mori ,  Shintaro Yamamichi ,  Masahiro Komuro ,  Masaya Kawano

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/5389 ,  H01L23/14 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/02 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18162 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/10674 ,  H01L2224/24227

摘要： In a semiconductor device in which the semiconductor chip including the external terminal(s) is embedded in an insulating layer and interconnect conductor(s) is (are) formed on the insulating layer, base hole(s) is (are) formed at position(s) of the insulating layer corresponding to the external terminal(s) in a state where the semiconductor chip has shrunk after having been embedded in the insulating layer. The interconnect conductor(s) is (are) electrically connected to the external terminal(s) through the base hole(s).

摘要翻译： 在绝缘层上形成包括外部端子的半导体芯片嵌入绝缘层和互连导体的半导体装置中，在位置上形成有基底孔， 在半导体芯片已经被嵌入绝缘层之后已经收缩的状态下与外部端子对应的绝缘层的一个或多个。 互连导体通过基座孔电连接到外部端子。

公开(公告)号：US20120133052A1

公开(公告)日：2012-05-31

申请号：US13389234

申请日：2010-08-06

申请人： Katsumi Kikuchi ,  Yoshiki Nakashima ,  Kentaro Mori ,  Shintaro Yamamichi

发明人： Katsumi Kikuchi ,  Yoshiki Nakashima ,  Kentaro Mori ,  Shintaro Yamamichi

IPC分类号： H01L23/522 ,  H01L21/768

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24226 ,  H01L2224/73267 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/0366 ,  H05K3/4682 ,  H05K2201/029 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device includes an embedding layer in which one or more semiconductor element(s) is embedded and one or more interconnect layers as well as one or more insulation layers on one or both sides of the embedding layer. The embedding layer includes a woven cloth formed by reinforcement fibers. The woven cloth has an opening on its site embedding the semiconductor element. The opening is arranged so that direction of the reinforcement fibers will have a preset angle with respect to a direction of a side of or a tangent to at least a portion of the opening, the preset angle being other than a square angle or a zero angle (parallelism).

摘要翻译： 一种半导体器件包括其中嵌入一个或多个半导体元件的嵌入层和一个或多个互连层以及在嵌入层的一侧或两侧上的一个或多个绝缘层。 嵌入层包括由增强纤维形成的织布。 编织布在其内部具有嵌入半导体元件的开口。 开口被布置成使得加强纤维的方向相对于开口的至少一部分的一侧的方向或切线的方向具有预设角度，预设角度不同于方角或零角度 （并行）。