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104 条记录 (耗时 0.052 秒)

    POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES
    52.
    发明申请
    POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES 有权
    用于粘合基材的聚合物边缘密封

    公开(公告)号：US20110091685A1

    公开(公告)日：2011-04-21

    申请号：US12603002

    申请日：2009-10-21

    申请人： Mukta G. Farooq ,  Thomas F. Houghton ,  Nitin Parbhoo ,  Richard P. Volant

    发明人： Mukta G. Farooq ,  Thomas F. Houghton ,  Nitin Parbhoo ,  Richard P. Volant

    IPC分类号： B32B7/00 ,  B32B37/00

    CPC分类号： B32B37/1292 ,  B32B3/02 ,  B32B27/08 ,  B32B37/1284 ,  B32B2457/14 ,  H01L21/187 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T428/215 ,  Y10T428/219 ,  Y10T428/24355 ,  Y10T428/24752 ,  Y10T428/24777 ,  Y10T428/24802 ,  Y10T428/24851

    摘要： A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.

    摘要翻译： 在接合之前，将待结合的两个基板中的至少一个的外围区域上施加一层聚合物材料。 由此形成的接合结构包括第一基板，与第一基板直接接触的第二基板，以及在第一界面处与第一基板直接接触并与第二基板直接接触的聚合物材料的环。 聚合物材料环横向包围并密封第一基底与第二基底接触的界面。 可以在聚合物环内形成环形空腔。 或者，第一界面和第二界面可以相邻，而在第一和第二基板之间没有环形腔。

    MICRO-ELECTROMECHANICAL SUB-ASSEMBLY HAVING AN ON-CHIP TRANSFER MECHANISM
    55.
    发明申请
    MICRO-ELECTROMECHANICAL SUB-ASSEMBLY HAVING AN ON-CHIP TRANSFER MECHANISM 失效
    具有片上传输机制的微电子组件

    公开(公告)号：US20090019691A1

    公开(公告)日：2009-01-22

    申请号：US10597012

    申请日：2004-01-15

    申请人： Christopher M. Schnabel ,  Peter A. Smith ,  John E. Florkey ,  Richard P. Volant

    发明人： Christopher M. Schnabel ,  Peter A. Smith ,  John E. Florkey ,  Richard P. Volant

    IPC分类号： H05K3/30

    CPC分类号： B81C3/002 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187

    摘要： Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.

    摘要翻译： 用于组装复杂MEMS器件的载体（10）保持部件（50）被运输到中心组装位置。 这些部件以预先分配的顺序堆叠，然后从其运营商释放。 或者，它们被定位在适当的位置上并被释放以便根据需要落入位置。 组装区域（100）包括在载体平面下方的空腔，使得保持在载体内的部分落入空腔内。 加热元件集成到腔体中以帮助部件的释放。 空腔由一个或多个载体提供，该载体通过任何数量的MEMS驱动系统（200,250）移动。 组装在其中的腔和一些MEMS提供精确量的材料，适合于生物医学应用，或者可以像在片上实验室一样原位加工。