Sputter deposition of hydrogenated amorphous carbon film and
applications thereof
    52.
    发明授权
    Sputter deposition of hydrogenated amorphous carbon film and applications thereof 失效
    氢化无定形碳膜的溅射沉积及其应用

    公开(公告)号:US5830332A

    公开(公告)日:1998-11-03

    申请号:US781080

    申请日:1997-01-09

    摘要: The present invention relates to a method of reactive sputtering for depositing an amorphous hydrogenated carbon film (a-C:H) from an argon/hydrocarbon/hydrogen/oxygen plasma, preferably an Ar/acetylene-helium/hydrogen/oxygen plasma. Such films are optically transparent in the visible range and partially absorbing at ultraviolet (UV) and deep UV (DUV) wavelengths, in particular, 365, and 248, 193 nm. Moreover, the films produced by the present invention are amorphous, hard, scratch resistant, and etchable by excimer laser ablation or by oxygen reactive ion etch process. Because of these unique properties, these films can be used to form a patterned absorber for UV and DUV single layer attenuated phase shift masks. Film absorption can also be increased such that these films can be used to fabricate conventional photolithographic shadow masks.

    摘要翻译: 本发明涉及一种用于从氩/烃/氢/氧等离子体,优选Ar /乙炔 - 氦/氢/氧等离子体沉积无定形氢化碳膜(a-C:H)的反应溅射方法。 这种膜在可见光范围内是光学透明的,并且在紫外(UV)和深紫外(DUV)波长,特别是365和248,193nm处部分吸收。 此外,本发明生产的薄膜是非晶的,硬的,耐划伤的,并且可以通过准分子激光烧蚀或通过氧反应离子蚀刻工艺进行蚀刻。 由于这些独特的性质,这些膜可用于形成用于UV和DUV单层衰减相移掩模的图案化吸收体。 也可以增加膜吸收,使得这些膜可用于制造常规光刻阴影掩模。

    Adhesive layer in multi-level packaging and organic material as a metal
diffusion barrier
    53.
    发明授权
    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
    多层包装中的粘合层和有机材料作为金属扩散屏障

    公开(公告)号:US5599582A

    公开(公告)日:1997-02-04

    申请号:US475412

    申请日:1995-06-07

    摘要: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

    摘要翻译: 本公开描述了一种多层制品,其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底,其中与基底相对的粘合剂的表面粘附到聚酰亚胺上,该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中,制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层,或用于在电路中形成电连接的装置,例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 还描述了一种新型粘合聚酰亚胺,其是粘合聚酰亚胺,例如用不饱和杂环单胺如氮杂腺嘌呤,氨基苯并三唑,氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐,氨基乙炔,乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团,作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材(铜,聚合物,玻璃陶瓷)界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

    Method for producing metal powder with a uniform distribution of
dispersants, method of uses thereof and structures fabricated therewith
    55.
    发明授权
    Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith 失效
    具有分散剂分布均匀的金属粉末的方法,其使用方法和用其制造的结构

    公开(公告)号:US5296189A

    公开(公告)日:1994-03-22

    申请号:US874901

    申请日:1992-04-28

    摘要: Methods of fabricating powders of metal particles containing grain growth control additives are described. A powder, metal particles, e.g., copper particles, are mixed with a powder of additive particles, e.g., alumina particles. The mixture is milled in a high energy ball mill to provide metal particles having substantially uniformly distributed therein of additive particles. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder can be used to form a conductor forming paste in the fabrication of a metallized ceramic substrate for semiconductor chip packaging application. The jet impact milled powder has particles of sufficiently small in size to fill vias between metallization layers in the green ceramic precursor to the ceramic substrate. During sintering of the combination of ceramic precursor and conductor forming paste, the grain growth control additive results in a substantially void free via filled with metal having a fine grain morphology.

    摘要翻译: 描述了制备含有晶粒生长控制添加剂的金属颗粒粉末的方法。 将粉末,金属颗粒(例如铜颗粒)与添加剂颗粒如氧化铝颗粒的粉末混合。 将混合物在高能球磨机中研磨,以提供基本均匀分布有添加剂颗粒的金属颗粒。 球磨粉末含有细长的高纵横比颗粒。 通过喷射冲击研磨,高纵横比颗粒的尺寸减小。 喷射冲击研磨粉末可用于在制造用于半导体芯片封装应用的金属化陶瓷衬底的过程中形成导体形成膏。 喷射冲击研磨的粉末具有足够小的颗粒,以在陶瓷衬底的生坯陶瓷前体中的金属化层之间填充通孔。 在烧结陶瓷前体和导体形成浆料的组合期间,晶粒生长控制添加剂导致填充有具有细晶粒形态的金属的基本上无空隙的通孔。