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    Method of printed circuit panel manufacture
    51.
    发明授权
    Method of printed circuit panel manufacture 失效
    印刷电路板制造方法

    公开(公告)号：US5364225A

    公开(公告)日：1994-11-15

    申请号：US901042

    申请日：1992-06-19

    Applicant: Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  by Ellen Sulgar, executrix ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

    Inventor： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  by Ellen Sulgar, executrix ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

    IPC: B23P21/00 ,  B25H3/02 ,  B65D51/14 ,  B65D85/86 ,  B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H05K3/00 ,  B65G65/02 ,  C23C13/08

    CPC classification number: H01L21/67236 ,  H01L21/67126 ,  H01L21/67363 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67772 ,  Y10S414/139

    Abstract: Disclosed is a method of manufacturing a printed circuit panel. The method is carried out without a cleanroom, but in a clean room environment. The first step is to place a thin, non-rigid panel in a suitable fixture, for example, for transfer and also for processing. The fixtured panel is then placed in an air tight transfer container, which has a substantially contaminant free atmosphere. The transfer container has a sealed door at one end. The transfer container is then brought into a seaiable, substantially airtight interlock with a process enclosure. This process enclosure also has a substantially contaminant free atmosphere, and a sealed door at one end. An airtight seal is formed between the transfer container and the process enclosure, and also between the surfaces of the two doors. This is to avoid introducing surface contaminants into the process enclosure and transfer container atmospheres. Next, the two doors are opened simultaneously. This is to allow the transfer of at least one panel and its fixture from the transfer container into the process enclosure. Inside the process enclosure the panel is transferred to a process station for a manufacturing process. Finally, the panel and its fixture are transferred from the process enclosure into the transfer container. This may be the same container or a different container. The doors of the process enclosure and the transfer container are then closed and sealed.

    Abstract translation: 公开了印刷电路板的制造方法。 该方法在没有洁净室的情况下进行，但在洁净室环境中进行。 第一步是将薄的非刚性面板放置在合适的夹具中，例如用于转移和加工。 然后将固定面板放置在气密转移容器中，其具有基本上无污染的气氛。 转移容器在一端具有密封门。 然后将转移容器与过程外壳进入可检测的，基本上气密的互锁。 该过程外壳还具有基本上无污染的气氛，并且在一端具有密封门。 在转移容器和处理外壳之间以及两个门的表面之间形成气密密封。 这是为了避免将表面污染物引入工艺外壳并转移容器环境。 接下来，两扇门同时打开。 这是为了允许将至少一个面板及其固定装置从转移容器传送到过程外壳中。 在工艺外壳内部，面板被传送到制造过程的处理站。 最后，面板及其固定装置从过程外壳转移到转移容器中。 这可能是相同的容器或不同的容器。 然后将过程外壳和转移容器的门关闭​​并密封。

    Method for bonding heat sinks to overmolds and device formed thereby
    54.
    发明授权
    Method for bonding heat sinks to overmolds and device formed thereby 有权
    用于将散热器连接到包覆成型体的方法和由此形成的装置

    公开(公告)号：US06770968B2

    公开(公告)日：2004-08-03

    申请号：US10369778

    申请日：2003-02-19

    Applicant: Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

    Inventor： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

    IPC: H01L2334

    CPC classification number: B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

    Abstract translation: 一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加贴附物将物品粘合到表面上。 通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。 形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。 等离子体可以是氧等离子体，并且粘合剂可以选自具有金属氧化物填料的热固化的硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。 特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。 替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

    Panel structure with plurality of chip compartments for providing high volume of chip modules
    56.
    发明授权
    Panel structure with plurality of chip compartments for providing high volume of chip modules 失效
    具有多个芯片隔间的面板结构，用于提供大量的芯片模块

    公开(公告)号：US06569710B1

    公开(公告)日：2003-05-27

    申请号：US09205407

    申请日：1998-12-03

    Applicant: Mark V. Pierson

    Inventor： Mark V. Pierson

    IPC: H01L2144

    CPC classification number: H01L24/97 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00

    Abstract: A method of forming a plurality of individual semiconductor chip modules wherein a plurality of chips are placed in a plurality of chip compartments formed by adhering a support panel to the first surface and a cover panel to the second surface of a stiffener panel having openings defining sidewalls of the chip compartments. The resulting laminated panel structure is then cut into a plurality of modules each having at least one compartment containing at least one chip. Each chip is electrically connected to interior conductive pads on the inner surface of the support panel, and these interior pads in turn are connected by conductive paths to exterior conductive terminals deposited on the outer surface of the support panel. The electrical connections between the chip and the interior conductive pads of the support panel may be encapsulated in a polymeric material before the cover panel is adhered to the stiffener panel.

    Abstract translation: 一种形成多个单独的半导体芯片模块的方法，其中将多个芯片放置在通过将支撑板粘附到第一表面而形成的多个芯片隔室中，并且将盖板覆盖到具有限定侧壁的开口的加强板的第二表面 的芯片隔间。 然后将所得的层压板结构切成多个模块，每个模块具有至少一个包含至少一个芯片的隔室。 每个芯片电连接到支撑板的内表面上的内部导电焊盘，并且这些内部衬垫又通过导电路径连接到沉积在支撑板的外表面上的外部导电端子。 在盖板粘附到加强板之前，芯片和支撑板的内部导电焊盘之间的电连接可被封装在聚合材料中。

    Electrical coupling of a stiffener to a chip carrier
    57.
    发明授权
    Electrical coupling of a stiffener to a chip carrier 有权

    公开(公告)号：US06534848B1

    公开(公告)日：2003-03-18

    申请号：US09657194

    申请日：2000-09-07

    Applicant: Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

    Inventor： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

    IPC: H01L2302

    CPC classification number: H05K3/0061 ,  H01L21/4846 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10977

    Abstract: A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.

    Surface metal balancing to reduce chip carrier flexing
    59.
    发明授权
    Surface metal balancing to reduce chip carrier flexing 失效
    表面金属平衡，减少芯片载体弯曲

    公开(公告)号：US06497943B1

    公开(公告)日：2002-12-24

    申请号：US09503395

    申请日：2000-02-14

    Applicant: Lisa J. Jimarez ,  Miguel A. Jimarez ,  Mark V. Pierson

    Inventor： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Mark V. Pierson

    IPC: B32B300

    CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B17/10229 ,  B32B2250/40 ,  B32B2425/00 ,  H01L23/142 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A surface metal balancing structure for a chip carrier, and an associated method of fabrication, to reduce or eliminate thermally induced chip carrier flexing. A substrate, such as a chip carrier made of organic dielectric material, is formed and includes: internal circuitization layers, a plated through hole, and outer layers comprised of an allylated polyphenylene ether. A stiffener ring for mechanically stabilizing the substrate is bonded to an outer portion, such as an outer perimeter portion, of the top surface of the substrate, in light of the soft and conformal organic material of the substrate. The top and bottom surfaces of the substrate have metal structures, such as copper pads and copper circuitization, wherein a surface area (A) multiplied by a coefficient of thermal expansion (C) is greater for the metal structure at the bottom surface than for the metal structure at the top surface. A metal pattern is adjacent to the top surface so as to make the product AC of metal structures at or near the top and bottom surfaces approximately equal. The metal pattern reduces or eliminates flexing of the substrate in an elevated temperature environment, such as during a reflow of solder that couples a semiconductor chip to the substrate.

    Abstract translation: 用于芯片载体的表面金属平衡结构以及相关的制造方法，以减少或消除热诱导的芯片载体弯曲。 形成诸如由有机电介质材料制成的芯片载体的衬底，其包括：内部电路层，电镀通孔和由烯丙基化聚苯醚构成的外层。 根据衬底的软和保形有机材料，用于机械稳定衬底的加强环被结合到衬底的顶表面的外部部分，例如外周部分。 衬底的顶表面和底表面具有诸如铜焊盘和铜电路的金属结构，其中在底表面处的金属结构的表面积（A）乘以热膨胀系数（C）大于对于 金属结构在顶面。 金属图案与顶表面相邻，以使金属结构的产品AC在顶表面和底表面处或附近大致相等。 金属图案减少或消除了在升高的温度环境中的衬底的弯曲，例如在将半导体芯片耦合到衬底的焊料的回流期间。

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