公开(公告)号：US08089133B2

公开(公告)日：2012-01-03

申请号：US10993305

申请日：2004-11-19

申请人： Dinesh Gupta ,  Brenda L. Peterson ,  Mark V. Pierson ,  Eugen Schenfeld ,  Subhash L. Shinde

发明人： Dinesh Gupta ,  Brenda L. Peterson ,  Mark V. Pierson ,  Eugen Schenfeld ,  Subhash L. Shinde

IPC分类号： H01L31/0232

CPC分类号： G02B6/3522 ,  G02B6/2817 ,  G02B6/3544 ,  G02B6/3574 ,  G02B6/3598 ,  G02B6/4214 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/43 ,  H01L2924/0002 ,  H01L2924/00

摘要： Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

摘要翻译： 提供用于引导光束的光学立方体和光学立方体组件。 光学立方体是可以适于反射，透射和/或部分地反射和透射光束的光学透明模块。 光学立方体可以包括用于引导光束的双向或多方向光束引导元件。 光学立方体组件可以包括附接到光学立方体的柔性芯片组件。 芯片组件可以包括用于发射光束的垂直腔表面发射激光器或用于接收安装在柔性和电互连安装组件上的光束的接收器。

公开(公告)号：US06836015B2

公开(公告)日：2004-12-28

申请号：US10428960

申请日：2003-05-02

申请人： Monty M. Denneau ,  Dinesh Gupta ,  Lisa J. Jimarez ,  Steven Ostrander ,  Brenda L. Peterson ,  Mark V. Pierson ,  Eugen Schenfeld ,  Subhash L. Shinde

发明人： Monty M. Denneau ,  Dinesh Gupta ,  Lisa J. Jimarez ,  Steven Ostrander ,  Brenda L. Peterson ,  Mark V. Pierson ,  Eugen Schenfeld ,  Subhash L. Shinde

IPC分类号： H01L2334

CPC分类号： G02B6/3522 ,  G02B6/2817 ,  G02B6/3544 ,  G02B6/3574 ,  G02B6/3598 ,  G02B6/4214 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/43 ,  H01L2924/0002 ,  H01L2924/00

摘要： Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

摘要翻译： 提供用于引导光束的光学立方体和光学立方体组件。 光学立方体是可以适于反射，透射和/或部分地反射和透射光束的光学透明模块。 光学立方体可以包括用于引导光束的双向或多方向光束引导元件。 光学立方体组件可以包括附接到光学立方体的柔性芯片组件。 芯片组件可以包括用于发射光束的垂直腔表面发射激光器或用于接收安装在柔性和电互连安装组件上的光束的接收器。

公开(公告)号：US06922294B2

公开(公告)日：2005-07-26

申请号：US10428956

申请日：2003-05-02

申请人： Mark V. Pierson ,  Eugen Schenfeld

发明人： Mark V. Pierson ,  Eugen Schenfeld

IPC分类号： H04B10/12 ,  G02B6/26 ,  G02B6/43 ,  H04B10/13 ,  H04B10/135 ,  H04B10/14 ,  G02B7/02 ,  G02B6/34

CPC分类号： G02B6/43

摘要： An optical assembly comprising an optical cube. A first optical transmitter chip and a first optical receiver chip are mounted on one surface of the optical cube. A first continuous printed circuit board is soldered to electrical surfaces of the first optical transmitter chip and the first optical receiver chip opposite the optical cube. A second optical transmitter chip and a second optical receiver chip are mounted on an opposite surface of the optical cube. A second continuous printed circuit board is soldered to electrical surfaces of the second optical transmitter chip and the second optical receiver chip opposite the optical cube. The first optical transmitter chip is optically aligned with the second optical receiver chip through the optical cube. The second optical transmitter chip is optically aligned with the first optical receiver chip through the optical cube. The first and second printed circuit boards may be bent ninety degrees and soldered to another printed circuit board, or connected to an edge connector on another printed circuit board.

摘要翻译： 一种包括光学立方体的光学组件。 第一光发射机芯片和第一光接收芯片安装在光学立方体的一个表面上。 将第一连续印刷电路板焊接到与光学立方体相对的第一光发射器芯片和第一光接收器芯片的电表面。 第二光发射器芯片和第二光接收器芯片安装在光学立方体的相对表面上。 将第二连续印刷电路板焊接到与光学立方体相对的第二光发射器芯片和第二光接收器芯片的电表面。 第一光发射器芯片通过光学立方体与第二光接收器芯片光学对准。 第二光发射器芯片通过光学立方体与第一光接收器芯片光学对准。 第一和第二印刷电路板可以弯曲九十度并且焊接到另一个印刷电路板，或者连接到另一个印刷电路板上的边缘连接器。

公开(公告)号：US06756680B2

公开(公告)日：2004-06-29

申请号：US09782471

申请日：2001-02-12

申请人： Miguel A. Jimarez ,  Cynthia S. Milkovich ,  Mark V. Pierson

发明人： Miguel A. Jimarez ,  Cynthia S. Milkovich ,  Mark V. Pierson

IPC分类号： H01L2348

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/10126 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81013 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/0032 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00014

摘要： An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

公开(公告)号：US06699736B2

公开(公告)日：2004-03-02

申请号：US10305643

申请日：2002-11-26

申请人： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

发明人： Terry J. Dornbos ,  Raymond A. Phillips, Jr. ,  Mark V. Pierson ,  William J. Rudik ,  David L. Thomas

IPC分类号： H01L2144

CPC分类号： H05K3/0061 ,  H01L21/4846 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10977

摘要： A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.

摘要翻译： 用于将金属加强件导电耦合到芯片载体的方法和结构。 衬底在其表面上具有导电焊盘，并且在衬底表面上形成粘合剂层。 金属加强件被放置在粘合剂层上，其中粘合剂层将加强件机械地连接到基底表面，并将加强件电耦合到垫。 然后将粘合剂层固化，例如通过在升高的温度下加压。 本发明的实施例通过在焊盘上形成导电触点并在基板上设置干燥的粘合剂来形成粘合剂层，使得导电触点位于干粘合剂中的孔内。 导电触头将加强件电耦合到焊盘。 固化步骤包括固化干燥粘合剂和导电接触，导致干燥粘合剂将加强剂粘合到基底上。 导电接触可包括导电粘合剂或金属焊料。 本发明的另外的实施方案通过在基底上施加导电粘合剂形成粘合剂层，其中在将加强件放置在粘合剂层上之后，导电粘合剂将加强件机械地和电耦合到基底的表面。

公开(公告)号：US06487461B1

公开(公告)日：2002-11-26

申请号：US09590280

申请日：2000-06-09

申请人： Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

发明人： Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

IPC分类号： G05B1918

CPC分类号： G02F1/13336 ,  Y10S345/903

摘要： A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.

摘要翻译： 一种用于对准多个用于构建平板显示器的薄膜晶体管瓦片的方法。 盖板安装在盖板支架上。 接合材料的第一层被施加到每个瓷砖的第一侧中的至少一个以及待固定瓷砖的盖板的表面。 瓦片布置在盖板上，使得第一层粘合材料布置在瓦片和盖板之间。 瓦片连接到对准装置。 瓷砖相对于彼此和盖板对准。 瓦片至少部分地固定到盖板上。

公开(公告)号：US06173887B1

公开(公告)日：2001-01-16

申请号：US09339924

申请日：1999-06-24

申请人： Donald I. Mead ,  Mark V. Pierson

发明人： Donald I. Mead ,  Mark V. Pierson

IPC分类号： B23K2622

CPC分类号： H05K3/3484 ,  B23K1/0053 ,  B23K1/0056 ,  B23K2101/40 ,  H05K3/3494 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/107

摘要： A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. In another embodiment, a reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. In yet another embodiment, a reflective mask with apertures filled with solder paste is applied onto a substrate and then heated to cause localized solder melting. The mask and excess solder paste are removed.

摘要翻译： 一种通过将衬底层施加到衬底上的电路化特征并在该特征上选择性地加热和熔化焊膏以形成焊料凸块来在衬底上形成导电接触的方法。 去除多余的焊膏。 聚焦能量热源如激光束或聚焦红外线加热焊膏。 在另一个实施例中，具有孔的反射掩模可以用于允许聚焦的加热源选择性地熔化施加到电路化特征上的焊膏层的区域。 在另一个实施例中，将具有填充有焊膏的孔的反射掩模施加到基板上，然后加热以引起局部焊料熔化。 去除掩模和多余的焊膏。

公开(公告)号：US5969945A

公开(公告)日：1999-10-19

申请号：US808829

申请日：1997-02-27

申请人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

发明人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

CPC分类号： H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A screen printing fixture holds a flexible circuit board having components attached to one side, to allow screening a pattern of solder paste onto the second side for subsequent attachment of components to that side. In an electronic package assembly a flexible circuit board with components is wound about a heat spreader assembly having a cavity so that at least one component on the flexible circuit board is positioned within the cavity and in thermal connection to the heat spreader.

摘要翻译： 丝网印刷夹具具有安装在一侧的部件的柔性电路板，以允许将焊膏的图案屏蔽到第二侧上，以便随后将部件附接到该侧。 在电子封装组件中，具有部件的柔性电路板围绕具有空腔的散热器组件缠绕，使得柔性电路板上的至少一个部件位于腔内并与散热器热连接。

公开(公告)号：US5889321A

公开(公告)日：1999-03-30

申请号：US877538

申请日：1997-06-17

申请人： Thomas M. Culnane ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Mark V. Pierson

发明人： Thomas M. Culnane ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Mark V. Pierson

IPC分类号： H01L21/48 ,  H01L21/50 ,  H05K1/18 ,  H01L23/48

CPC分类号： H05K1/189 ,  H01L21/4803 ,  H01L21/50 ,  H01L2224/16225

摘要： A stiffener (34 or 52 or 72) includes a pathway which allows gases and fluids, such as air, to be vented from the interface between surface bonding regions (35 or 60 or 74) of the stiffener and an adhesive (38 or 56 or 80) on a flexible substrate (36 or 54 or 78). The pathway may take the form of a porous material used for the stiffener or one or more bore holes (58 or 59 or 70) formed in the stiffener. The stiffener may also include an internal cavity (76) for promoting venting of fluids and gases. By venting fluid and gases from the adhesive/stiffener interface, better adhesion between the stiffener and flexible substrate is achieved.

摘要翻译： 加强件（34或52或72）包括允许气体和流体（例如空气）从加强件的表面粘合区域（35或60或74）之间的界面和粘合剂（38或56或 80）在柔性基板（36或54或78）上。 该通道可以采用用于加强件的多孔材料的形式或形成在加强件中的一个或多个钻孔（58或59或70）。 加强件还可以包括用于促进流体和气体排放的内腔（76）。 通过从粘合剂/加强件界面排出流体和气体，实现加强件和柔性基材之间更好的粘附。

公开(公告)号：US5862588A

公开(公告)日：1999-01-26

申请号：US514703

申请日：1995-08-14

申请人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

发明人： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC分类号： B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  H05K13/04

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

摘要： A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

摘要翻译： 一种制造互连结构和电路板的方法，包括将布置在背板上的基板上的相应金属触点上具有连接凸块的区域阵列部件放置在一起，提供与凸块和触点相连通的热固化连接材料，直接接触气体喷嘴 到围绕组件的基板的一部分，以将衬底压在喷嘴和背板之间，以限制衬底的包裹，加热组件，接合材料和接近金属触点的衬底，同时将喷嘴保持在衬底上以固化 接合材料，并冷却组件，接合材料和基底。 选择的部件也可以利用气体喷嘴进行更换，以限制基材的包装。