摘要:
A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.
摘要:
A nonvolatile semiconductor storage device includes a semiconductor substrate; a plurality of isolation regions formed in the semiconductor substrate; an element-forming region formed between adjacent isolation regions; a first gate insulating film provided on the element-forming region; a floating gate electrode which is provided on the first gate insulating film and in which a width of a lower hem facing the element-forming region is narrower than a width of the element-forming region in a section taken in a direction perpendicular to a direction in which the isolation regions extend; a second gate insulating film provided on the floating gate electrode; and a control gate electrode provided on the second gate insulating film.
摘要:
A nonvolatile semiconductor storage device includes a semiconductor substrate; a plurality of isolation regions formed in the semiconductor substrate; an element-forming region formed between adjacent isolation regions; a first gate insulating film provided on the element-forming region; a floating gate electrode which is provided on the first gate insulating film and in which a width of a lower hem facing the element-forming region is narrower than a width of the element-forming region in a section taken in a direction perpendicular to a direction in which the isolation regions extend; a second gate insulating film provided on the floating gate electrode; and a control gate electrode provided on the second gate insulating film.
摘要:
A coil component having a low profile and being conducive to high-density mounting. The coil component includes a core 2 having a coil winding portion, and first and second flanges disposed on either end of the coil winding portion. The second flange is adapted to be mounted on a circuit board, and is configured of a substantially octagonal bottom surface having first and second peripheral surfaces and first through fourth omitted peripheral surfaces. The first terminal electrode is disposed across the first omitted peripheral surface and a part of the bottom surface, and the second terminal electrode is disposed across the second omitted peripheral surface and part of the bottom surface separated from the first terminal electrode. A winding is wound over the coil winding portion and has a first end electrically connected to the first terminal electrode at the first omitted peripheral surface, and a second end electrically connected to the second terminal electrode at the second omitted peripheral surface.
摘要:
Novel genes expressed selectively by long-term dendritic cell (DC) lines (XS series) from murine epidermis which retain important features of resident epidermal Langerhans cells (LC) are provided. These genes encode distinct type II membrane-integrated polypeptides, each consisting of a cytoplasmic domain, a transmembrane domain, an extracellular connecting domain, and a C-terminal extracellular domain that exhibits significant homology to the carbohydrate recognition domains (CRD)) of C-type lectins. Expression of both genes is highly restricted to cells of DC lineage (including epidermal LC). Thus, these genes encode new, DC-specific members of the C-type lectin family, now termed “DC-associated C-type lectin-1 and -2” (dectin-1 and dectin-2). Two isoforms of the dectin-1 molecule and five isoforms of the dectin-2 molecule have also been identified. The invention further provides His-tagged fusion proteins comprising 6x histidine and the extracellular domain of dectin-1 or dectin-2. Also provided are antibodies raised to synthetic peptides designed from the dectin-1 sequence or to the His-tagged fusion proteins described.
摘要:
A stacked semiconductor device is disclosed that has a three-dimensional structure using general-purpose semiconductor device units (semiconductor devices) that are stacked with an interposer substrate being provided between an upper device unit and a lower device unit. The upper device unit includes a semiconductor device, a first wiring substrate, and an external connection terminal. The lower device unit includes a semiconductor device, a second wiring substrate, and a connection electrode that is prepared on the upper surface of the second wiring substrate. The interposer substrate includes a circuit board, a first conductive material connecting to the connection electrode, a second conductive material formed in a form position of the external connection terminal that is electrically connected to the second conductive material, and a third conductive material for electrically connecting the first conductive material and the second conductive material.
摘要:
An air flow rate measuring device serves to measure a flow rate of air flowing through a main passage inside an intake pipe of an engine. A base has its one end directed axially of the main passage toward an upstream side of air flowing therein, and its other end directed toward a downstream side thereof, with a bent groove being formed in the base. A circuit module includes a support substrate and a detection element installed one surface of the support substrate for detecting the flow rate of air, the module being joined to the base in a face-to-face relation with respect to each other to form an auxiliary passage in cooperation with the groove. The detection element on the one surface of the support substrate is exposed to air in the auxiliary passage, and the other surface of the support substrate is exposed to air in the main passage.
摘要:
A backhoe vehicle comprising an upper carriage including a driver's section and swivellable 360 degrees on a chassis, and an excavating assembly including a boom, a bucket arm and a bucket. The boom defines a first and a second bent portions so that a distal end of the boom is inclined in a direction in which the boom is lowered. An excavating assembly holder is attached to a front region of the upper carriage and adjacent a transversely mid-position of the vehicle to be pivotable on a vertical axis. The boom is connected to the holder to be pivotable on a horizontal rotary shaft. A boom cylinder for causing pivotal movements of the excavating assembly is connected at one end to the boom and at the other end selectively to a first and a second pivot members defined on the holder. The second pivot member is disposed at a lower rearward position with respect to the first pivot member. The first bent portion is defined substantially at a longitudinally mid-position of the boom, and the second bent portion is defined between the first bent portion and the rotary shaft. A distance between the rotary shaft and the second bent portion is substantially equal to a distance between the rotary shaft and the first pivot member.
摘要:
According to one embodiment, a memory device includes a first electrode, a second electrode, and a variable resistance film. The variable resistance film is connected between the first electrode and the second electrode. The first electrode includes a metal contained in a matrix made of a conductive material. A cohesive energy of the metal is lower than a cohesive energy of the conductive material. A concentration of the metal at a central portion of the first electrode in a width direction thereof is higher than concentrations of the metal in two end portions of the first electrode in the width direction.