公开(公告)号：US06682786B1

公开(公告)日：2004-01-27

申请号：US09455671

申请日：1999-12-07

申请人： Shui-Chih Alan Lien ,  Alessandro C. Callegari ,  Paul S. Andry ,  Praveen Chaudhari ,  James A. Lacey ,  Sampath Purushothaman ,  James P. Doyle ,  Eileen A. Galligan ,  Richard A. John ,  John J. Ritsko ,  Yuhichi Momoi ,  Christopher Jahnes

发明人： Shui-Chih Alan Lien ,  Alessandro C. Callegari ,  Paul S. Andry ,  Praveen Chaudhari ,  James A. Lacey ,  Sampath Purushothaman ,  James P. Doyle ,  Eileen A. Galligan ,  Richard A. John ,  John J. Ritsko ,  Yuhichi Momoi ,  Christopher Jahnes

IPC分类号： G02F11337

CPC分类号： G02F1/133711 ,  G02F1/13378 ,  G02F1/1393 ,  Y10T428/1009 ,  Y10T428/1064

摘要： A liquid crystal display cell having liquid crystal molecules positioned in a vertical or a substantially vertical alignment is provided. The liquid crystal display cell includes at least two substantially homogeneous fluorinated alignment layers disposed on transparent electrodes; a liquid crystal layer of liquid crystal molecules disposed between the alignment layers; and, a means of applying voltage across the transparent electrodes. Methods for forming these liquid crystal display cells are also provided.

摘要翻译： 提供具有位于垂直或基本垂直取向的液晶分子的液晶显示单元。 液晶显示单元包括设置在透明电极上的至少两个基本均匀的氟化取向层; 设置在取向层之间的液晶分子的液晶层; 以及在透明电极上施加电压的手段。 还提供了形成这些液晶显示单元的方法。

公开(公告)号：US06603204B2

公开(公告)日：2003-08-05

申请号：US09795431

申请日：2001-02-28

申请人： Stephen McConnell Gates ,  Jeffrey Curtis Hedrick ,  Satyanarayana V. Nitta ,  Sampath Purushothaman ,  Cristy Sensenich Tyberg

发明人： Stephen McConnell Gates ,  Jeffrey Curtis Hedrick ,  Satyanarayana V. Nitta ,  Sampath Purushothaman ,  Cristy Sensenich Tyberg

IPC分类号： H01L2348

CPC分类号： H01L21/76835 ,  H01L21/76811 ,  H01L23/5222 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： A low-k dielectric metal conductor interconnect structure having no micro-trenches present therein and a method of forming such a structure are provided. Specifically, the above structure is achieved by providing an interconnect structure which includes at least a multilayer of dielectric materials which are applied sequentially in a single spin apply tool and then cured in a single step and a plurality of patterned metal conductors within the multilayer of spun-on dielectrics. The control over the conductor resistance is obtained using a buried etch stop layer having a second atomic composition located between the line and via dielectric layers of porous low-k dielectrics having a first atomic composition. The inventive interconnect structure also includes a hard mask which assists in forming the interconnect structure of the dual damascene-type. The first and second composition are selected to obtain etch selectivity of at least 10 to 1 or higher, and are selected from specific groups of porous low-k organic or inorganic materials with specific atomic compositions and other discoverable quantities.

公开(公告)号：US06337522B1

公开(公告)日：2002-01-08

申请号：US09106780

申请日：1998-06-30

申请人： Sung Kwon Kang ,  Sampath Purushothaman

发明人： Sung Kwon Kang ,  Sampath Purushothaman

IPC分类号： H01L23532

CPC分类号： H01L24/83 ,  B23K35/025 ,  H01L24/29 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13109 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/0218 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/48 ,  H01L2224/05644 ,  H01L2224/05124 ,  H01L2224/05147

摘要： A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and/or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

摘要翻译： 公开了一种用于磁带自动键合（TAB）封装，倒装芯片封装和有源矩阵液晶显示器（AMLCD）面板的新的互连方案，其中使用导电粘合剂来形成有源电子器件和 其组件。 导电粘合剂可以是包含聚合物树脂，免清洗助焊剂，多个具有导电熔融涂层的导电颗粒的混合物，其在导电颗粒之间以及衬底之间提供冶金结合。 使用导电粘合剂的优点包括键合压力和/或粘合温度的降低，界面反应的控制，稳定的冶金键的促进，接头的可靠性提高等。

公开(公告)号：US6015509A

公开(公告)日：2000-01-18

申请号：US928495

申请日：1997-09-12

申请人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

发明人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

IPC分类号： C08G61/12 ,  C08L33/00 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/12 ,  H01B1/22 ,  H01B1/24 ,  H05K3/32 ,  H05K9/00 ,  H01B1/06

CPC分类号： H05K9/0083 ,  C08G61/12 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01B1/22 ,  H01B1/24 ,  H05K3/321 ,  H05K9/0079 ,  H05K9/0088 ,  C08L33/00 ,  H05K2201/0329 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31529 ,  Y10T428/31533 ,  Y10T428/31605 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31855

摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.

摘要翻译： 提供含有聚合物基质和导电填料组分的组合物。 导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯 取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔及其混合物，及其共聚物。 本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。 此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。

公开(公告)号：US5985458A

公开(公告)日：1999-11-16

申请号：US928464

申请日：1997-09-12

申请人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

发明人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

IPC分类号： C08G61/12 ,  C08L33/00 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/12 ,  H01B1/22 ,  H01B1/24 ,  H05K3/32 ,  H05K9/00 ,  B32B15/08

CPC分类号： H05K9/0083 ,  C08G61/12 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01B1/22 ,  H01B1/24 ,  H05K3/321 ,  H05K9/0079 ,  H05K9/0088 ,  C08L33/00 ,  H05K2201/0329 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31529 ,  Y10T428/31533 ,  Y10T428/31605 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31855

摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.

摘要翻译： 提供含有聚合物基质和导电填料组分的组合物。 导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯 取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔，及其混合物，及其共聚物。 本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。 此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。

公开(公告)号：US5958590A

公开(公告)日：1999-09-28

申请号：US414070

申请日：1995-03-31

申请人： Sung Kwon Kang ,  Sampath Purushothaman ,  George Frederick Walker

发明人： Sung Kwon Kang ,  Sampath Purushothaman ,  George Frederick Walker

IPC分类号： H05K1/14 ,  H01B1/00 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B5/16

CPC分类号： H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H05K3/321 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83886 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H05K2201/0218 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K3/3457 ,  H05K3/4007 ,  Y10T428/12181 ,  Y10T428/12229 ,  Y10T428/2991

摘要： Pastes of dendrite particles coated with an electrically conductive coating are described. A surface is placed in contact with an electrolytic or electroless plating solution. Dendrites are formed on the surface. The dendrites are exposed to another plating solution to plate a coating on the surface of the dendrites. The coated dendrites are removed from the surface to form a powder of coated dendrites. The powder is added to a polymer material to form a paste. The paste is disposed between electrical contacts on adjacent surfaces. The paste is heated to fuse the dendrite surfaces to form a network of fused dendrites which are also fused to the electrical contacts. The paste is further heated to cure the polymer to form electrical interconnections between the electrical contacts on the adjacent surfaces.

摘要翻译： 描述了涂覆有导电涂层的枝晶颗粒的浆料。 将表面放置成与电解或化学镀溶液接触。 树皮在表面形成。 将树突暴露于另一种电镀溶液以在树枝状表面上铺上涂层。 将涂覆的枝晶从表面除去以形成涂覆的树枝状粉末。 将粉末加入到聚合物材料中以形成糊状物。 糊料设置在相邻表面上的电触点之间。 加热糊状物以使枝晶表面熔合以形成融合的枝晶网络，其也与电触点融合。 进一步加热糊料以固化聚合物以在相邻表面上的电接触之间形成电互连。

公开(公告)号：US5830332A

公开(公告)日：1998-11-03

申请号：US781080

申请日：1997-01-09

申请人： Edward D. Babich ,  Alessandro Cesare Callegari ,  Fuad Elias Doany ,  Sampath Purushothaman

发明人： Edward D. Babich ,  Alessandro Cesare Callegari ,  Fuad Elias Doany ,  Sampath Purushothaman

IPC分类号： C23C14/06 ,  C23C14/34 ,  G02B1/10 ,  G03F1/00 ,  G03F1/26 ,  G03F1/32 ,  G03F1/34 ,  H01L21/205

CPC分类号： G03F1/32 ,  C23C14/0605 ,  G03F1/26 ,  G03F1/34

摘要： The present invention relates to a method of reactive sputtering for depositing an amorphous hydrogenated carbon film (a-C:H) from an argon/hydrocarbon/hydrogen/oxygen plasma, preferably an Ar/acetylene-helium/hydrogen/oxygen plasma. Such films are optically transparent in the visible range and partially absorbing at ultraviolet (UV) and deep UV (DUV) wavelengths, in particular, 365, and 248, 193 nm. Moreover, the films produced by the present invention are amorphous, hard, scratch resistant, and etchable by excimer laser ablation or by oxygen reactive ion etch process. Because of these unique properties, these films can be used to form a patterned absorber for UV and DUV single layer attenuated phase shift masks. Film absorption can also be increased such that these films can be used to fabricate conventional photolithographic shadow masks.

摘要翻译： 本发明涉及一种用于从氩/烃/氢/氧等离子体，优选Ar /乙炔 - 氦/氢/氧等离子体沉积无定形氢化碳膜（a-C：H）的反应溅射方法。 这种膜在可见光范围内是光学透明的，并且在紫外（UV）和深紫外（DUV）波长，特别是365和248,193nm处部分吸收。 此外，本发明生产的薄膜是非晶的，硬的，耐划伤的，并且可以通过准分子激光烧蚀或通过氧反应离子蚀刻工艺进行蚀刻。 由于这些独特的性质，这些膜可用于形成用于UV和DUV单层衰减相移掩模的图案化吸收体。 也可以增加膜吸收，使得这些膜可用于制造常规光刻阴影掩模。

公开(公告)号：US5599582A

公开(公告)日：1997-02-04

申请号：US475412

申请日：1995-06-07

申请人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

发明人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  B05D5/10

CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

公开(公告)号：US5470661A

公开(公告)日：1995-11-28

申请号：US1374

申请日：1993-01-07

申请人： Fredric D. Bailey ,  Douglas A. Buchanan ,  Alessandro C. Callegari ,  Howard M. Clearfield ,  Fuad E. Doany ,  Donis G. Flagello ,  Harold J. Hovel ,  Douglas C. Latulipe, Jr. ,  Naftali E. Lustig ,  Andrew T. S. Pomerene ,  Sampath Purushothaman ,  Christopher M. Scherpereel ,  David E. Seeger ,  Jane M. Shaw

发明人： Fredric D. Bailey ,  Douglas A. Buchanan ,  Alessandro C. Callegari ,  Howard M. Clearfield ,  Fuad E. Doany ,  Donis G. Flagello ,  Harold J. Hovel ,  Douglas C. Latulipe, Jr. ,  Naftali E. Lustig ,  Andrew T. S. Pomerene ,  Sampath Purushothaman ,  Christopher M. Scherpereel ,  David E. Seeger ,  Jane M. Shaw

IPC分类号： G03F1/08 ,  C01B31/06 ,  C08J7/06 ,  C23C8/26 ,  C23C8/50 ,  C23C16/26 ,  C23C16/27 ,  C23C16/50 ,  C30B29/04 ,  G02B1/10 ,  G11B5/255 ,  H01L21/31 ,  H01L21/314 ,  B24B3/02

CPC分类号： C23C16/26 ,  G02B1/105 ,  G11B5/255 ,  Y10S427/104 ,  Y10S427/106 ,  Y10T428/30

摘要： The present invention relates to an improved method of depositing a diamond-like carbon film onto a substrate by low temperature plasma-enhanced chemical vapor deposition (PECVD) from a hydrocarbon/helium plasma. More specifically, the diamond like carbon films of the present invention are deposited onto the substrate by employing acetylene which is heavily diluted with helium as the plasma gas. The films formed using the process of the present invention are characterized as being amorphous and having dielectric strengths comparable to those normally observed for diamond films. More importantly, however is that the films produced herein are thermally stable, optically transparent, absorbent in the ultraviolet range and hard thus making them extremely desirable for a wide variety of applications.

摘要翻译： 本发明涉及通过来自烃/氦等离子体的低温等离子体增强化学气相沉积（PECVD）将金刚石状碳膜沉积到衬底上的改进方法。 更具体地说，本发明的类金刚石碳膜通过采用氦气作为等离子体气体大量稀释的乙炔沉积在基板上。 使用本发明的方法形成的膜的特征在于是无定形的并且具有与通常对于金刚石膜观察到的那些相当的介电强度。 然而，更重要的是，本文制造的膜是热稳定的，光学透明的，在紫外范围内是吸收性的并且是硬的，从而使得它们对于各种各样的应用是非常需要的。

公开(公告)号：US5296189A

公开(公告)日：1994-03-22

申请号：US874901

申请日：1992-04-28

申请人： Sung K. Kang ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Subhash L. Shinde

发明人： Sung K. Kang ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Subhash L. Shinde

IPC分类号： B01F3/18 ,  B22F1/00 ,  B22F9/04 ,  C22C1/10 ,  H05K1/09 ,  B22F7/00

CPC分类号： H05K1/092 ,  B22F9/04 ,  C22C1/1084 ,  B22F2009/043 ,  B22F2999/00

摘要： Methods of fabricating powders of metal particles containing grain growth control additives are described. A powder, metal particles, e.g., copper particles, are mixed with a powder of additive particles, e.g., alumina particles. The mixture is milled in a high energy ball mill to provide metal particles having substantially uniformly distributed therein of additive particles. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder can be used to form a conductor forming paste in the fabrication of a metallized ceramic substrate for semiconductor chip packaging application. The jet impact milled powder has particles of sufficiently small in size to fill vias between metallization layers in the green ceramic precursor to the ceramic substrate. During sintering of the combination of ceramic precursor and conductor forming paste, the grain growth control additive results in a substantially void free via filled with metal having a fine grain morphology.

摘要翻译： 描述了制备含有晶粒生长控制添加剂的金属颗粒粉末的方法。 将粉末，金属颗粒（例如铜颗粒）与添加剂颗粒如氧化铝颗粒的粉末混合。 将混合物在高能球磨机中研磨，以提供基本均匀分布有添加剂颗粒的金属颗粒。 球磨粉末含有细长的高纵横比颗粒。 通过喷射冲击研磨，高纵横比颗粒的尺寸减小。 喷射冲击研磨粉末可用于在制造用于半导体芯片封装应用的金属化陶瓷衬底的过程中形成导体形成膏。 喷射冲击研磨的粉末具有足够小的颗粒，以在陶瓷衬底的生坯陶瓷前体中的金属化层之间填充通孔。 在烧结陶瓷前体和导体形成浆料的组合期间，晶粒生长控制添加剂导致填充有具有细晶粒形态的金属的基本上无空隙的通孔。