公开(公告)号：US07790595B2

公开(公告)日：2010-09-07

申请号：US11428705

申请日：2006-07-05

申请人： Tatsuhiko Asakawa ,  Shuichi Tanaka ,  Hideo Imai

发明人： Tatsuhiko Asakawa ,  Shuichi Tanaka ,  Hideo Imai

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device comprises (a) forming a resin layer that includes at least a plurality of a first and a second resin parts, being separated from each other, over a semiconductor substrate having an electrode pad and a passivation film; (b) forming a resin projection in which the first and the second resin parts are integrated by curing the resin layer; and (c) forming a conductive layer that is being connected electrically to the electrode pad and extending over the resin projection, wherein in process (a), the second resin part is formed at least between the electrode pad and the first resin part at a width less than the first resin part.

摘要翻译： 一种制造半导体器件的方法包括：（a）在具有电极焊盘和钝化膜的半导体衬底上形成树脂层，所述树脂层至少包括多个彼此分离的第一和第二树脂部分， （b）通过固化树脂层形成树脂突起，其中第一和第二树脂部分被一体化; 和（c）形成与电极焊盘电连接并延伸到树脂突起上的导电层，其中在工艺（a）中，第二树脂部分至少形成在电极焊盘和第一树脂部分之间， 宽度小于第一树脂部分。

公开(公告)号：US20100171216A1

公开(公告)日：2010-07-08

申请号：US12728474

申请日：2010-03-22

申请人： Shuichi Tanaka

发明人： Shuichi Tanaka

IPC分类号： H01L23/488

CPC分类号： H01L24/13 ,  G02F1/1345 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion.

摘要翻译： 电子设备包括具有布线图案的半导体器件和布线基板。 半导体器件包括：具有电极的半导体芯片; 设置在所述半导体芯片的表面上的凸形树脂突起，所述表面具有所述电极; 以及具有多个电耦合部分的布线，所述多个电耦合部分在树脂突起上对准并电耦合到电极。 半导体器件被安装到布线基板，使得电耦合部分和布线图案彼此接触并电耦合。 与布线图案接触的多个电耦合部分包括在树脂突起的纵向方向上突出的弯曲或弯曲形状。

公开(公告)号：US07714436B2

公开(公告)日：2010-05-11

申请号：US12186587

申请日：2008-08-06

申请人： Shuichi Tanaka

发明人： Shuichi Tanaka

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  G02F1/1345 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion.

摘要翻译： 电子设备包括具有布线图案的半导体器件和布线基板。 半导体器件包括：具有电极的半导体芯片; 设置在所述半导体芯片的表面上的凸形树脂突起，所述表面具有所述电极; 以及具有多个电耦合部分的布线，所述多个电耦合部分在树脂突起上对准并电耦合到电极。 半导体器件被安装到布线基板，使得电耦合部分和布线图案彼此接触并电耦合。 与布线图案接触的多个电耦合部分包括在树脂突起的纵向方向上突出的弯曲或弯曲形状。

公开(公告)号：US07629671B2

公开(公告)日：2009-12-08

申请号：US11481332

申请日：2006-07-05

申请人： Shuichi Tanaka

发明人： Shuichi Tanaka

IPC分类号： H01L29/06 ,  H01L21/00

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014

摘要： A semiconductor device including a semiconductor substrate having a plurality of electrodes, a resin protrusion formed on the semiconductor substrate, and an interconnect electrically connected to the electrodes and formed to extend over the resin protrusion. A depression is formed in a top surface of the resin protrusion. The interconnect has a cut portion disposed over at least part of the depression.

摘要翻译： 一种半导体器件，包括具有多个电极的半导体衬底，形成在所述半导体衬底上的树脂突起，以及与所述电极电连接并形成为在所述树脂突起上延伸的互连。 在树脂突起的上表面形成有凹陷部。 互连具有设置在凹部的至少一部分上的切割部分。

公开(公告)号：US07429704B2

公开(公告)日：2008-09-30

申请号：US11332878

申请日：2006-01-13

申请人： Hiroki Kato ,  Shuichi Tanaka

发明人： Hiroki Kato ,  Shuichi Tanaka

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L24/13 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provided is an electronic component including a pad provided on an active surface of a rectangular chip substrate, a resin protrusion provided along sides of the chip substrate, and a conductive portion which is electrically connected to the pad and which is formed out of a conductive film covering the surface of the resin protrusion. The resin protrusion includes a protruded body extending linearly and a plurality of the resin protrusions are provided on at least one side of the chip substrate to form a clearance in an intermediate portion of the side.

摘要翻译： 本发明提供一种电子部件，其包括设置在矩形芯片基板的有源面上的焊盘，沿着芯片基板的侧面设置的树脂突出部和与该焊盘电连接并由导电膜形成的导电部 覆盖树脂突起的表面。 树脂突起包括直线延伸的突出体，并且多个树脂突起设置在芯片基板的至少一侧上，以在侧面的中间部分中形成间隙。

公开(公告)号：US07348269B2

公开(公告)日：2008-03-25

申请号：US11311800

申请日：2005-12-19

申请人： Shuichi Tanaka ,  Mitsuru Kuribayashi

发明人： Shuichi Tanaka ,  Mitsuru Kuribayashi

IPC分类号： H01L21/44

CPC分类号： H01L21/288 ,  G02F1/13452 ,  G02F2001/13456 ,  H01L24/11 ,  H01L24/13 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/13624 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13671 ,  H01L2224/13684 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/00014

摘要： A method for manufacturing a semiconductor device with a bump electrode wherein the bump electrode includes a resin material as a core and at least a top surface covered with a conductive film. The method includes placing the resin material on a substrate on which an electrode terminal is formed by an inkjet method, and forming an interconnecting metal that connects the electrode terminal to a top surface of the resin material.

摘要翻译： 一种用于制造具有凸块电极的半导体器件的方法，其中所述凸块电极包括作为芯的树脂材料和至少覆盖有导电膜的顶表面。 该方法包括通过喷墨方法将树脂材料放置在其上形成有电极端子的基板上，并且形成将电极端子连接到树脂材料的顶表面的互连金属。

公开(公告)号：US07166920B2

公开(公告)日：2007-01-23

申请号：US11103412

申请日：2005-04-11

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.

摘要翻译： 一种电子部件，其通过活性表面上的焊盘与相对基板电连接，其特征在于，所述有源面上的树脂凸块和所述树脂凸块上的导电膜构成凸起电极，并且多个凸块电极为电气 连接到一个垫。

公开(公告)号：US07143504B2

公开(公告)日：2006-12-05

申请号：US10679948

申请日：2003-10-06

申请人： Shuichi Tanaka

发明人： Shuichi Tanaka

IPC分类号： H01F7/06

CPC分类号： G02F1/13452 ,  H01J2211/46 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49199

摘要： A method of manufacturing a display structure includes the steps of arranging at least a display area, an extension area, and an IC mounting area on a display substrate, connecting a flexible tape substrate to the extension area of the display substrate, separating a part of the display substrate by cutting at a cutting portion which is a part under the flexible tape substrate on the extension area of the display substrate, and disposing a cutting substrate which is the separated part, on a back side which is opposite to a side where a display is mounted, of the display substrate.

摘要翻译： 一种制造显示结构的方法包括以下步骤：在显示基板上至少布置显示区域，扩展区域和IC安装区域，将柔性带基板连接到显示基板的延伸区域，将一部分 通过在显示基板的延伸区域处的作为柔性带基板下方的部分的切割部分切割显示基板，并且在与该显示基板的一侧相反的背面上设置作为分离部分的切割基板 显示器被安装在显示器基板上。

公开(公告)号：US07122896B2

公开(公告)日：2006-10-17

申请号：US10914121

申请日：2004-08-10

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/48 ,  H01L29/40 ,  B23K31/02

CPC分类号： H05K3/325 ,  H01L23/49816 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/07811 ,  H01L2924/12044 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00

摘要： To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.

摘要翻译： 为了提供电子部件的低成本安装结构，并且增加突起电极和形成在基板上的端子之间的导电连接的可靠性，在电子部件的安装结构中，凸块电极包括由 内部树脂和覆盖芯的表面的导电膜。 凸起电极直接与端子导电接触，并且以平面方式弹性变形以与基板的表面接触。 密封树脂填充在凸起电极和端子之间的导电接触部分周围，以保持凸起电极和端子。

公开(公告)号：US20050230773A1

公开(公告)日：2005-10-20

申请号：US11103412

申请日：2005-04-11

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/485 ,  H01L31/0203

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.

摘要翻译： 一种电子部件，其通过活性表面上的焊盘与相对基板电连接，其特征在于，所述有源面上的树脂凸块和所述树脂凸块上的导电膜构成凸起电极，并且多个凸块电极为电气 连接到一个垫。