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公开(公告)号：US09296646B2
公开(公告)日：2016-03-29
申请号：US14464851
申请日：2014-08-21
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwsky
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
Abstract translation: 公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。 在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光穿过玻璃基板的厚度的至少一部分。 该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。 所应用的超声波能量的频率在40 kHz到192 kHz之间。
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52.发明申请公开(公告)号：US20150166395A1
公开(公告)日：2015-06-18
申请号：US14535754
申请日：2014-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
CPC classification number: B23K26/384 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。
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公开(公告)号：US20150165562A1
公开(公告)日：2015-06-18
申请号：US14529976
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/0006 , B23K26/0613 , B23K26/0624 , B23K26/0738 , B23K26/40 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/06 , B32B2250/02 , B32B2315/02 , Y02P40/57 , Y10T428/21 , Y10T428/24273 , Y10T428/24355
Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.
Abstract translation: 激光处理材料以形成分离部分的方法。 该方法包括将脉冲激光束聚焦到沿着光束传播方向观察的激光束焦线中，引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿孔或故障线 所述激光束焦线在所述材料内，并且将散焦的二氧化碳（CO 2）激光从所述多个孔的远端边缘引导到所述材料的近侧边缘。
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公开(公告)号：US20150165560A1
公开(公告)日：2015-06-18
申请号：US14536009
申请日：2014-11-07
Applicant: CORNING INCORPORATED
Inventor： Thomas Hackert , Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/082 , B23K26/0608 , B23K26/0622 , B23K26/359 , B23K26/382 , B23K26/389 , B23K26/53 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03B33/04 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24273
Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.
Abstract translation: 本发明涉及用于在透明材料（特别是玻璃）的薄衬底中切割和分离内部轮廓的方法。 该方法涉及利用超短脉冲激光器在衬底中形成穿孔或孔，其后可以使用CO 2激光束来促进穿孔线周围的完全分离。
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公开(公告)号：US20150060402A1
公开(公告)日：2015-03-05
申请号：US14464851
申请日：2014-08-21
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burkett , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwsky
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
Abstract translation: 公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。 在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光穿过玻璃基板的厚度的至少一部分。 该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。 所应用的超声波能量的频率在40 kHz到192 kHz之间。
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Patent Agency Ranking
公开(公告)号：US08841213B2
公开(公告)日：2014-09-23
申请号：US13389050
申请日：2011-07-19
Applicant: Hideki Shimoi , Keisuke Araki
Inventor： Hideki Shimoi , Keisuke Araki
IPC: H01L21/768
CPC classification number: B23K26/0853 , B23K26/0006 , B23K26/0622 , B23K26/53 , B23K26/55 , B23K2101/40 , B23K2103/56 , H01L21/30608 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H05K3/002 , H05K2203/107 , H01L2924/00
Abstract: A method for manufacturing an interposer equipped with a plurality of through-hole electrodes comprises a laser light converging step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a modified region in the object; an etching step of anisotropically etching the object after the laser light converging step so as to advance etching selectively along the modified region and form a plurality of through holes in the object, each through hole being tilted with respect to a thickness direction of the object and having a rectangular cross section; an insulating film forming step of forming an insulating film on an inner wall of each through hole after the etching step; and a through-hole electrode forming step of inserting a conductor into the through holes so as to form the through-hole electrodes after the insulating film forming step; wherein the plurality of through holes are arranged such that the through holes aligning in the tilted direction are staggered in a direction perpendicular to the tilted direction as seen from a main face of the object.
Abstract translation: 一种配备有多个通孔电极的插入件的制造方法，其特征在于，包括激光收敛步骤，将激光会聚在由硅制成的被处理片状物体上，以在物体中形成改质区域; 在激光聚光步骤之后对物体进行各向异性蚀刻的蚀刻步骤，以沿着改质区域选择性地进行蚀刻，并在物体中形成多个通孔，每个通孔相对于物体的厚度方向倾斜， 具有矩形截面; 绝缘膜形成步骤，在蚀刻步骤之后在每个通孔的内壁上形成绝缘膜; 以及通孔电极形成步骤，在绝缘膜形成步骤之后，将导体插入通孔中以形成通孔电极; 其中所述多个通孔被布置成使得沿着所述倾斜方向对齐的所述通孔在从所述物体的主面看时与所述倾斜方向垂直的方向交错。
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公开(公告)号：US20140217074A1
公开(公告)日：2014-08-07
申请号：US14250249
申请日：2014-04-10
Applicant: Gautam Thor
Inventor： Gautam Thor
CPC classification number: B23K26/55 , G03H1/0011 , G03H1/0236 , G03H1/0891 , G03H2001/0022 , G03H2001/0484 , G03H2001/261 , G03H2223/19 , G03H2260/62
Abstract: The innovation involves the use of a laser to ablate a calculated microstructure or employ an adaptation of maskless photolithography using a Digital Micromirror Device to serve as a Spatial Light Modulator to embed a covert diffraction screen, holding encrypted information under transparent surfaces of plastics or glass substrates. One method includes the steps of fragmenting the calculated diffraction screen into at least first and second parts that are placed in separate locations. In this method the binary pattern in each of the parts includes information representing a respective portion of the original image and needs to be interrogated simultaneously to provide a meaningful visual output: each part by itself being incapable of generating any meaningful information. The fragmentation method allows a public-private key type of secure system platform.
Abstract translation: 该创新涉及使用激光来消融计算的微结构或使用数字微镜器件进行无掩模光刻的适应，以用作空间光调制器以嵌入隐蔽衍射屏幕，将加密信息保持在塑料或玻璃基板的透明表面下 。 一种方法包括将所计算的衍射屏幕分段成放置在分开的位置的至少第一和第二部分的步骤。 在该方法中，每个部分中的二进制模式包括表示原始图像的相应部分的信息，并且需要被同时询问以提供有意义的视觉输出：每个部分本身不能产生任何有意义的信息。 分片方法允许公钥 - 私钥类型的安全系统平台。
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公开(公告)号：US08546723B2
公开(公告)日：2013-10-01
申请号：US11521533
申请日：2006-09-15
Applicant: Thomas M. Brown , Carl Hayton
Inventor： Thomas M. Brown , Carl Hayton
CPC classification number: H01L51/0021 , B23K26/0006 , B23K26/382 , B23K26/389 , B23K26/40 , B23K26/55 , B23K2101/42 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/42 , B23K2103/50 , B23K2103/54 , H01L21/268 , H01L21/31116 , H01L21/31138 , H01L21/76802 , H01L51/0541
Abstract: A method for generating via-hole interconnections by laser ablation, wherein the layers to be removed and ablated from the substrate are essentially transparent to the laser radiation, but the laser light is absorbed in an underlying absorbing layer with a sufficiently high optical density at the laser wavelength.
Abstract translation: 一种用于通过激光烧蚀产生通孔互连的方法，其中要从衬底去除和消融的层对于激光辐射基本上是透明的，但是激光在具有足够高的光密度的下面的吸收层中被吸收 激光波长。
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公开(公告)号：US20130249530A1
公开(公告)日：2013-09-26
申请号：US13893761
申请日：2013-05-14
Applicant: Wisconsin Alumni Research Foundation
Inventor： Robert H. Blick , Minrui Yu
IPC: G01N27/00
CPC classification number: G01N27/00 , B23K26/066 , B23K26/18 , B23K26/382 , B23K26/40 , B23K26/55 , B23K2103/50 , Y10T428/24273 , Y10T428/24281 , Y10T428/24612
Abstract: A method of forming extremely small pores in a substrate may be used to produce, for example, an apparatus for the study of biological molecules, by providing a small pore in a piezoelectric substrate having electrodes, the latter that may be energized to change the pore dimensions.
Abstract translation: 在基板中形成极小孔的方法可以用于制备例如用于研究生物分子的装置，通过在具有电极的压电基板中提供小孔，后者可以通电以改变孔 尺寸。
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公开(公告)号：US20120308765A1
公开(公告)日：2012-12-06
申请号：US13566092
申请日：2012-08-03
Applicant: Osamu NUKAGA , Seiji SAMUKAWA , Masakazu SUGIYAMA
Inventor： Osamu NUKAGA , Seiji SAMUKAWA , Masakazu SUGIYAMA
CPC classification number: B23K26/0624 , B23K26/0006 , B23K26/384 , B23K26/389 , B23K26/40 , B23K26/53 , B23K26/55 , B23K2103/50 , H01L21/30604 , H01L21/30608 , H01L21/3065 , Y10T428/24
Abstract: A nanostructure forming method includes: preparing a substrate having an appropriate processing value; applying laser beam having a pulse duration of picosecond order or less to a planar surface oriented in a propagation direction of the laser beam and a direction perpendicular to a polarization direction (electric field direction) of the laser beam in the interior of the substrate at an irradiation intensity which is close to the appropriate processing value of the substrate; forming a structure-modified portion at a focus at which the laser beam is concentrated and in a region which is close to the focus; and forming a nanostructure formed of a nano-hole by selectively etching the structure-modified portion.
Abstract translation: 纳米结构形成方法包括：制备具有适当处理值的基材; 对于在激光束的传播方向上定向的平面表面和垂直于基板内部的激光束的偏振方向（电场方向）的方向，施加具有皮秒级或更小脉冲持续时间的激光束， 接近基板的适当处理值的照射强度; 在激光束集中的焦点处和在靠近焦点的区域中形成结构改性部分; 以及通过选择性地蚀刻所述结构改性部分，形成由纳米孔形成的纳米结构。
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