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    CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL
    54.
    发明申请
    CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL 审中-公开
    导电精细颗粒和各向异性导电材料

    公开(公告)号：US20110031449A1

    公开(公告)日：2011-02-10

    申请号：US12851829

    申请日：2010-08-06

    Applicant: Nana Enomoto ,  Kunihiko Akai

    Inventor： Nana Enomoto ,  Kunihiko Akai

    IPC: H01B1/22 ,  B32B5/16

    CPC classification number: H01B1/02 ,  H05K3/321 ,  H05K2201/0218 ,  Y10T428/2991

    Abstract: The invention provides conductive fine particles with a satisfactory monodisperse property, low cost, resistance to migration and excellent conductivity. Conductive fine particles having core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface, wherein the phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A, the phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater.

    Abstract translation: 本发明提供具有满意的单分散性，低成本，耐迁移性和优异的导电性的导电性细颗粒。 具有涂覆有含有镍和磷的金属镀覆膜层的核心颗粒表面的导电性微粒和包含钯层作为外表面的多层导电层，其中金属镀膜层的区域A中的磷含量， 与核心颗粒表面的整个金属镀覆膜层的厚度不超过20％的距离为整个区域A的7-15重量％，金属的区域B中的磷含量 在钯层侧的镀金属镀膜层的表面的整个金属镀膜层的厚度不大于10％的距离为0.1-3重量％ 的整个区域B，并且整个金属镀膜层的磷含量为7重量％以上。

    Electrically conductive adhesive
    55.
    发明授权
    Electrically conductive adhesive 有权
    导电胶

    公开(公告)号：US07785500B2

    公开(公告)日：2010-08-31

    申请号：US12092453

    申请日：2006-10-31

    Applicant: Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

    Inventor： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

    IPC: H01B1/22 ,  C09J9/02

    CPC classification number: C09J9/02 ,  H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2203/0425

    Abstract: The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

    Abstract translation: 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。

    Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts
    58.
    发明申请
    Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts 审中-公开
    导电膏和基板使用它来安装电子零件

    公开(公告)号：US20080261049A1

    公开(公告)日：2008-10-23

    申请号：US11573133

    申请日：2005-07-29

    Applicant: Hiroki Hayashi ,  Ayako Taira ,  Satoshi Ebana

    Inventor： Hiroki Hayashi ,  Ayako Taira ,  Satoshi Ebana

    IPC: B32B15/092 ,  H01B1/22

    CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0272 ,  Y10T428/31529

    Abstract: The conductive paste of the invention comprises a conductive powder and a binder component, wherein the conductive powder is composed of metal powder which is copper powder or copper alloy powder partially covered on the surface with silver, and is either a mixture of roughly spherical metal powder and flat metal powder, or roughly spherical or flat metal powder alone, and wherein the binder component contains a mixture of an epoxy resin and an imidazole compound with a hydroxyl group or a mixture of an epoxy resin and an imidazole compound with a carboxyl group.

    Abstract translation: 本发明的导电膏包括导电粉末和粘合剂组分，其中导电粉末由金属粉末组成，铜粉末或铜合金粉末部分地被银表面覆盖，并且是大致球形的金属粉末 和扁平金属粉末，或单独的大致球形或扁平金属粉末，并且其中粘合剂组分含有环氧树脂和具有羟基的咪唑化合物或环氧树脂和具有羧基的咪唑化合物的混合物的混合物。

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