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    Metal-clad laminates and method for producing same
    51.
    发明授权
    Metal-clad laminates and method for producing same 失效
    金属覆层压板及其制造方法

    公开(公告)号：US5300364A

    公开(公告)日：1994-04-05

    申请号：US849416

    申请日：1992-04-29

    Applicant: Hiroaki Hase ,  Kazutsune Kikuta ,  Atsushi Takahashi ,  Shiro Konotsune

    Inventor： Hiroaki Hase ,  Kazutsune Kikuta ,  Atsushi Takahashi ,  Shiro Konotsune

    IPC: B32B15/08 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/30 ,  H05K3/38

    CPC classification number: H05K1/0346 ,  B32B15/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681

    Abstract: The present invention provides a flexible metal-clad laminate obtained by directly applying a polyimide precursor to a metallic conductive foil, and then drying, heating and curing the precursor to form a polyimide film, this flexible metal-clad laminate being characterized in that the polyimide film is composed of two or more polyimide layers, the linear thermal expansion coefficient of at least one of the second and later polyimide layers is larger than that of the first layer brought into contact with the metallic conductive foil, and the requirements of the following formulae are met:3.0 t.sub.n and ##EQU1## wherein t.sub.n is the thickness (.mu.m) of the outermost layer (the nth layer) of the polyimide layers, t.sub.n-1 is the thickness (.mu.m) of the film comprising the first layer to the (n-1)th layer of the polyimide layers, and Q.sub.n-1 is a double value (cm) of the curvature radius of the curl of the film comprising the first layer to the (n-1)th layer of the polyimide layers and Rz is the average surface roughness (.mu.m) of the metallic conductive foil. This board does not curl immediately after curing, and the curl does not occur even after the formation of a circuit by etching.

    Abstract translation: PCT No.PCT / JP91 / 01176 Sec。 一九九二年四月二十九日 102（e）日期1992年4月29日PCT 1991年9月3日PCT PCT。 出版物WO92 / 0481100 本发明提供了一种柔性金属包覆层压板，其通过将聚酰亚胺前体直接施加到金属导电箔上，然后干燥，加热和固化前体以形成聚酰亚胺膜，该柔性金属包层 其特征在于，所述聚酰亚胺膜由两层以上的聚酰亚胺层构成，所述第二层和后述的聚酰亚胺层中的至少一层的线性热膨胀系数大于与所述金属导电箔接触的所述第一层的线性热膨胀系数， 满足以下公式的要求：3.0 tn和tn-1> tn和（*化学结构*）其中tn是（（my）m） 聚酰亚胺层的最外层（第n层）tn-1是包含第一层至第（n-1）层聚酰亚胺层的膜的厚度（（my）m），Qn-1 是包括第一个1a的膜的卷曲的曲率半径的双重值（cm） 对于第（n-1）层的聚酰亚胺层，Rz是金属导电箔的平均表面粗糙度（（my）m）。 该板在固化后不会立即卷曲，即使在通过蚀刻形成电路之后也不会发生卷曲。

    Flexible multilayer polyimide laminates
    54.
    发明授权
    Flexible multilayer polyimide laminates 失效
    柔性多层聚酰亚胺层压板

    公开(公告)号：US4675246A

    公开(公告)日：1987-06-23

    申请号：US746887

    申请日：1985-06-20

    Applicant: Ernst F. Kundinger ,  Erich Klimesch ,  Hans G. Zengel ,  Jeffrey D. Lasher

    Inventor： Ernst F. Kundinger ,  Erich Klimesch ,  Hans G. Zengel ,  Jeffrey D. Lasher

    IPC: B05D7/16 ,  H05K1/03 ,  B32B15/00

    CPC classification number: B05D7/16 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/066 ,  Y10T428/265 ,  Y10T428/2826 ,  Y10T428/294 ,  Y10T428/2947 ,  Y10T428/2967 ,  Y10T428/31681 ,  Y10T428/31721

    Abstract: The invention relates to laminates comprising at least one layer of an intractable, fully aromatic polyimide which, on one side, is directly bonded to a layer of a substrate and, on the other side, to a layer of a heat-sealable polyimide. The basic elements thus produced may be bonded to one another on the heat-sealable polyimide sides or one basic element may be bonded to another layer of substrate. Further layers may be bonded to one or both outside(s) of the laminates. The laminates may be produced by a novel temperature-controlled process. The substrates are preferably foils of metals or alloys. The multilayer laminates obtained are distinguished by outstanding mechanical, thermal and electrical properties. They may be used as reinforcing materials or for printed electrical circuits.

    Abstract translation: 本发明涉及包含至少一层难治性的完全芳族聚酰亚胺的层压材料，其一面直接结合到基材层上，另一侧则是可热封聚酰亚胺层。 由此制得的基本元素可以在可热封的聚酰亚胺侧上彼此结合，或者一个碱性元素可以结合到另一层基底上。 另外的层可以结合到层压体的一个或两个外部。 层压体可以通过新的温度控制方法制备。 基板优选为金属或合金的箔。 所获得的多层层压板通过出色的机械，热和电性能来区分。 它们可以用作增强材料或印刷电路。

    CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
    57.
    发明公开
    CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME 审中-公开

    公开(公告)号：US20240138077A1

    公开(公告)日：2024-04-25

    申请号：US18271544

    申请日：2021-04-25

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

    IPC: H05K3/46 ,  H05K1/11 ,  H05K3/00

    CPC classification number: H05K3/4688 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4697 ,  H05K2201/0358

    Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

    Catalyzed metal foil and uses thereof
    58.
    发明授权
    Catalyzed metal foil and uses thereof 有权

    公开(公告)号：US11877404B2

    公开(公告)日：2024-01-16

    申请号：US17208890

    申请日：2021-03-22

    Applicant: AVERATEK CORPORATION

    Inventor： Shinichi Iketani

    IPC: H05K3/46 ,  H05K3/06 ,  H05K3/00 ,  H05K3/18

    CPC classification number: H05K3/4652 ,  H05K3/0041 ,  H05K3/062 ,  H05K3/185 ,  H05K2201/0358 ,  H05K2203/0323 ,  H05K2203/0376 ,  H05K2203/0582 ,  H05K2203/06

    Abstract: Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 μm, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.

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