公开(公告)号：US20160212894A1

公开(公告)日：2016-07-21

申请号：US14991432

申请日：2016-01-08

Applicant: Innolux Corporation

Inventor： Wei-Jen Tsai ,  Hui-Lang Lee ,  Ying-Wen Yang

IPC: H05K9/00 ,  H05K5/00 ,  H05K1/02 ,  H05K5/04

CPC classification number: H05K9/0054 ,  H05K1/0215 ,  H05K1/0259 ,  H05K1/0271 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10128 ,  H05K2201/10257

Abstract: A display device includes a display panel, a circuit board, and a conductive element. The circuit board is adjacent to the display panel and electrically connected to the display panel. The circuit board has at least a conductive pattern configured at a ground zone, and the conductive pattern has a plurality of conductive portions spaced apart each other. The quantities of the conductive portions respectively arranged along a first direction and a second direction are plural, and the first direction is substantially perpendicular to the second direction. The conductive element is disposed on the conductive pattern, and the conductive element is electrically connected to the conductive portions.

Abstract translation: 显示装置包括显示面板，电路板和导电元件。 电路板与显示面板相邻并电连接到显示面板。 电路板至少具有配置在接地区的导电图案，导电图案具有彼此隔开的多个导电部。 分别沿第一方向和第二方向布置的导电部分的数量是多个，并且第一方向基本上垂直于第二方向。 导电元件设置在导电图案上，并且导电元件电连接到导电部分。

公开(公告)号：US20160050764A1

公开(公告)日：2016-02-18

申请号：US14923941

申请日：2015-10-27

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Rikihiro MARUYAMA ,  Kenshi KAI ,  Nobuyuki KANZAWA ,  Mitsutoshi SAWANO

IPC: H05K3/30

CPC classification number: H05K3/301 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49811 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K3/303 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2203/0278 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/41 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.

Abstract translation: 一种用于半导体器件的安装夹具包括：绝缘电路板定位夹具，通过将绝缘电路板容纳在预定位置来定位绝缘电路板;管状接触元件定位夹具，其具有在预定位置处的多个定位孔，以插入多个 管状接触元件和用于将插入到管状接触元件定位夹具中的各个定位孔中的多个管状接触元件按压的管状接触元件压入夹具。

公开(公告)号：US08767398B2

公开(公告)日：2014-07-01

申请号：US13021344

申请日：2011-02-04

Applicant: Robert E. Kodadek, III

Inventor： Robert E. Kodadek, III

IPC: H05K7/20

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

Abstract translation: 用于电气部件的热管理系统包括能够接收PCB的第一侧上的电子部件的印刷电路板（PCB）。 细长构件具有连接到PCB的第二侧的一端，以及远离PCB设置的另一端。 细长构件还具有有利于两端之间的流体连通的开放内部。 端部中的一个限定了PCB上的至少部分闭合的边界。 PCB包括邻近边界穿过的孔，使得在PCB的第一侧和PCB的第二侧之间以及沿着细长构件的至少一部分容易流体连通。

公开(公告)号：US08354594B2

公开(公告)日：2013-01-15

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card (1) comprising etched strip conductors (2) and wire conductors (6), which wire conductors run on and/or in the circuit board or card (1) between connection points (4). At least one of the wire conductors (6) has an essentially rectangular, for example, a square, cross-section.

Abstract translation: 本发明涉及一种包括蚀刻带状导体（2）和导线导体（6）的线印刷电路板或卡（1），其中导线在连接点之间和/或电路板或卡（1）之间延伸， 4）。 电线导体（6）中的至少一个具有基本上矩形的，例如正方形的横截面。

公开(公告)号：US20110194258A1

公开(公告)日：2011-08-11

申请号：US13021344

申请日：2011-02-04

Applicant: Robert E. Kodadek, III

Inventor： Robert E. Kodadek, III

IPC: H05K7/20

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

Abstract translation: 用于电气部件的热管理系统包括能够接收PCB的第一侧上的电气部件的印刷电路板（PCB）。 细长构件具有连接到PCB的第二侧的一端，以及远离PCB设置的另一端。 细长构件还具有有利于两端之间的流体连通的开放内部。 端部中的一个限定了PCB上的至少部分闭合的边界。 PCB包括邻近边界设置穿过的孔，使得在PCB的第一侧和PCB的第二侧之间以及沿着细长构件的至少一部分容易流体连通。

公开(公告)号：US20110063812A1

公开(公告)日：2011-03-17

申请号：US12853647

申请日：2010-08-10

Applicant: Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

Inventor： Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

IPC: H05K7/02 ,  H05K3/30

CPC classification number: H05K3/3426 ,  G01R31/2853 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/4006 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/73253 ,  H01L2224/81054 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/10984 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/4913

Abstract: An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member.

Abstract translation: 电子设备包括：电路板，具有形成在其主表面上的第一电极，半导体器件设置在电路板的主表面上，该半导体器件具有形成在与主表面相对的表面上的第二电极， 电连接在第一和第二电极之间的连接构件。 连接构件包括中空圆柱形构件和设置在中空圆柱形构件内的导电构件。

公开(公告)号：US07755200B2

公开(公告)日：2010-07-13

申请号：US12210920

申请日：2008-09-15

Applicant: Hau Nguyen

Inventor： Hau Nguyen

IPC: H01L23/48

CPC classification number: B23K3/0623 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/40 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T428/24612

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract translation: 本发明涉及形成焊点连接的方法和装置。 一个实施例涉及一种改进的焊球。 焊球包括具有内部开口的穿孔金属外壳。 焊接材料包住外壳并填充其内部开口。 焊球可以被施加到诸如集成电路管芯的电气装置上，以在器件上形成焊料凸块。 焊料凸点又可用于在器件和合适的衬底（例如印刷电路板）之间形成改进的焊点连接。 在一些应用中，形成焊接接头，而不需要向衬底的表面施加额外的焊料。 本发明还包括不同的焊料凸块布置和使用这种布置来形成器件和衬底之间的焊接连接的方法。

公开(公告)号：US20080128158A1

公开(公告)日：2008-06-05

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card comprising conductors that run on and/or in the circuit board or card between connection points. In order to improve circuit boards of this type, the invention provides for at least one of the conductors to have a rectangular or square cross-section.

Abstract translation: 本发明涉及一种线印刷电路板或卡，其包括在连接点之间在电路板或卡上延伸和/或运行的导体。 为了改进这种类型的电路板，本发明提供至少一个导体具有矩形或正方形的横截面。

公开(公告)号：US20050266702A1

公开(公告)日：2005-12-01

申请号：US11139846

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R4/02 ,  H01R12/00 ,  H01R13/24 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环都焊接到基板和设备。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20030060066A1

公开(公告)日：2003-03-27

申请号：US10255373

申请日：2002-09-26

Applicant: NEC Corporation

Inventor： Tomoko Harada

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/0116 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  H01L2924/00

Abstract: A solder ball achieves a desired quantity of solder material for a solder joint easily without increasing the thickness of a solder layer formed to cover a core. The solder ball comprises a conductive core having depressions on its outer surface, and a solder layer formed to cover the outer surface of the core in such a way as to fill the depressions of the core. Thus, the quantity of the solder material included in the ball is supplemented by the solder material filled into the depressions. Preferably, the core has a higher melting point than the solder layer and wettability to the solder layer. The core may have a cavity in its inside, thereby forming a shell-shaped core. The core may be made of a porous metal body having pores, in which part of the pores reaches the outer surface of the core, thereby forming the depressions.

Abstract translation: 焊球容易获得所需量的用于焊接接头的焊料材料，而不增加形成覆盖芯的焊料层的厚度。 焊球包括在其外表面上具有凹陷的导电芯，以及形成为以填充芯的凹陷的方式覆盖芯的外表面的焊料层。 因此，包含在球中的焊料材料的量由填充到凹部中的焊料材料补充。 优选地，芯具有比焊料层更高的熔点和对焊料层的润湿性。 芯可以在其内部具有空腔，从而形成壳形芯。 芯可以由具有孔的多孔金属体制成，其中一部分孔到达芯的外表面，从而形成凹陷。