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    Electronic device, interposer and method of manufacturing electronic device
    3.
    发明授权
    Electronic device, interposer and method of manufacturing electronic device 有权
    电子设备，插件和电子设备的制造方法

    公开(公告)号：US08964402B2

    公开(公告)日：2015-02-24

    申请号：US13331105

    申请日：2011-12-20

    申请人： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

    发明人： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

    IPC分类号： H05K7/00 ,  H05K1/11 ,  H01L23/498 ,  H05K3/34

    CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/09136 ,  H05K2201/10378 ,  H05K2201/10992 ,  Y02P70/613

    摘要： An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

    摘要翻译： 一种电子设备，包括：第一电极和第二电极的布线板;安装在所述布线板上的半导体器件，包括第一端子和第二端子，所述插入器设置在所述布线板和所述半导体器件之间，所述插入器包括： 所述导电焊盘和支撑所述导电焊盘的片材，所述导电焊盘具有在所述布线板的一侧上的第一表面和所述半导体器件的一侧上的第二表面;第一焊料，其将位于其中的所述第一电极的位于 所述插入件与所述第一端子位于所述区域的外侧，所述第二焊料将位于所述区域内的所述第二电极与所述导电焊盘的所述第一表面连接;以及第三焊料，其将位于所述区域内的所述第二端子与 导电垫的第二表面。

    ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    6.
    发明申请
    ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 有权
    电子设备，插接器和制造电子器件的方法

    公开(公告)号：US20120176759A1

    公开(公告)日：2012-07-12

    申请号：US13331105

    申请日：2011-12-20

    申请人： Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

    发明人： Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

    IPC分类号： H05K7/06 ,  H05K1/03 ,  B23K31/02 ,  H05K1/11

    CPC分类号： H01L23/49827 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/09136 ,  H05K2201/10378 ,  H05K2201/10992 ,  Y02P70/613

    摘要： An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

    摘要翻译： 一种电子设备，包括：第一电极和第二电极的布线板;安装在所述布线板上的半导体器件，包括第一端子和第二端子，所述插入器设置在所述布线板和所述半导体器件之间，所述插入器包括： 所述导电焊盘和支撑所述导电焊盘的片材，所述导电焊盘具有在所述布线板的一侧上的第一表面和所述半导体器件的一侧上的第二表面;第一焊料，其将位于其中的所述第一电极的位于 所述插入件与所述第一端子位于所述区域的外侧，所述第二焊料将位于所述区域内的所述第二电极与所述导电焊盘的所述第一表面连接;以及第三焊料，其将位于所述区域内的所述第二端子与 导电垫的第二表面。

    METHOD FOR PRODUCING POLISHING LIQUID COMPOSITION
    8.
    发明申请
    METHOD FOR PRODUCING POLISHING LIQUID COMPOSITION 有权
    生产抛光液体组合物的方法

    公开(公告)号：US20130283704A1

    公开(公告)日：2013-10-31

    申请号：US13996976

    申请日：2011-12-21

    申请人： Yasuhiro Yoneda ,  Kanji Sato

    发明人： Yasuhiro Yoneda ,  Kanji Sato

    IPC分类号： C09G1/02

    CPC分类号： C09G1/02 ,  C09K3/1463 ,  G11B5/8404

    摘要： Provided is a method for producing a polishing composition capable of reducing scratches and particles of an object to be polished, after polishing. It is a method for producing a polishing composition including a step of filtering with a filtration filter a silica particle dispersion containing colloidal silica whose primary particles have an average particle diameter in a range of 1 to 100 nm, wherein the filtration filter includes diatomite cationized by use of a polyvalent amine compound having 9 to 200 cationic groups in the molecule.

    摘要翻译： 本发明提供一种能够在研磨后能够减少被研磨物的划痕和微粒的抛光组合物的制造方法。 一种抛光组合物的制造方法，其特征在于，使用过滤器过滤含有一次粒子的平均粒径为1〜100nm的胶态二氧化硅的二氧化硅粒子分散体，其中，过滤器包括由硅藻土阳离子化的硅藻土 在分子中使用具有9至200个阳离子基团的多价胺化合物。

    Objective lens
    9.
    发明申请
    Objective lens 有权
    物镜

    公开(公告)号：US20070253073A1

    公开(公告)日：2007-11-01

    申请号：US11787068

    申请日：2007-04-13

    申请人： Yasutaka Terashima ,  Yasuhiro Yoneda ,  Teruo Yamashita ,  Hideaki Koyanagi

    发明人： Yasutaka Terashima ,  Yasuhiro Yoneda ,  Teruo Yamashita ,  Hideaki Koyanagi

    IPC分类号： G02B3/00

    CPC分类号： C03C3/068 ,  C03B11/08 ,  C03B2215/49 ,  C03B2215/69 ,  C03C3/095 ,  Y02P40/57 ,  Y10T428/31504

    摘要： Lens aberration in an objective lens for recording and reproducing optical information, which is composed of a molded aspherical single lens, is inhibited while at the same time good lens productivity is attained. Also attained are excellent optical properties and high production efficiency in a mold processing step and a press molding step conducted to manufacture the lens. To this end there is provided an objective lens 1 having a convex aspherical surface formed at a first surface and a numerical aperture NA which satisfies the condition NA≧0.8. It is preferable to have an aspherical surface also at the second surface. A molding material that was premolded to a prescribed shape and is in a heated and softened state is press molded by using a pair of upper and lower molds having opposing molding surfaces, a molding surface shape is transferred by using a spherical molding material with a radius r and pressing the molding material between a pair of upper and lower molds, and the paraxial curvature radius R of the convex aspherical surface satisfies the following relation r/R≦1.35.

    摘要翻译： 用于记录和再现光学信息的物镜中的由模制的非球面单透镜组成的透镜像差被抑制，同时获得良好的透镜生产率。 在模具加工步骤和进行制造透镜的压制成型步骤中也获得了优异的光学性能和高生产效率。 为此，提供一种具有形成在第一表面上的凸非球面的物镜1和满足条件NA> = 0.8的数值孔径NA。 优选在第二表面也具有非球面。 将预成型为规定形状并处于加热软化状态的成型材料通过使用具有相对成型面的一对上下模具进行加压成型，通过使用具有半径的球形成型材料转印成型面形状 并且在一对上模和下模之间挤压成型材料，并且凸非球面的近轴曲率半径R满足以下关系r / R <= 1.35。

    Methods of manufacturing molded glass articles
    10.
    发明申请
    Methods of manufacturing molded glass articles 审中-公开
    制造模制玻璃制品的方法

    公开(公告)号：US20050172671A1

    公开(公告)日：2005-08-11

    申请号：US10602706

    申请日：2003-06-25

    申请人： Yasuhiro Yoneda ,  Hiroyuki Sawada

    发明人： Yasuhiro Yoneda ,  Hiroyuki Sawada

    IPC分类号： C03B11/00 ,  C03B11/08 ,  C03B11/12 ,  C03B11/16 ,  C03B29/02 ,  C03B35/00 ,  C03B40/04 ,  G02B3/00

    CPC分类号： C03B40/04 ,  C03B11/122 ,  C03B11/16 ,  C03B29/02 ,  C03B35/005 ,  C03B2215/60 ,  C03B2215/69 ,  C03B2215/72 ,  Y02P40/57

    摘要： Disclosed is methods of manufacturing optical elements such as optical glass lenses and to methods of manufacturing optical glass elements in which a heat softened optical glass material is press molded in a pressing mold with high precision. Optical pick up units is also disclosed and it comprises an object lens manufactured by the method. In the method, at least one of an upper mold and a lower mold having a shape such that when a glass material is in contact with the upper mold and the lower mold, a molding surface of at least one of the upper mold or the lower mold forms a closed space with a surface of the glass material. The method comprises the steps of supplying a glass material, at a temperature of less than a temperature at which the glass material exhibits a viscosity of 1011 poises, between the upper mold and the lower mold; heating the supplied glass material by thermal conduction by means of contact with the upper mold or lower mold on the side on which the space is formed; and moving at least one of the upper mold and the lower mold at an average moving rate of less than or equal to 10 mm/min at least for a distance h micrometers after the glass material becomes in contact with the upper mold and the lower mold, when a temperature of the pressing mold is at a predetermined temperature T2 within a range in which the glass material exhibits a viscosity of from 107.4 to 1010.5 poises, wherein a maximum height of the space in the direction of the moving of the movable mold is denoted as h micrometers.

    摘要翻译： 公开了制造诸如光学玻璃透镜的光学元件的方法以及制造光学玻璃元件的方法，其中将热软化的光学玻璃材料以高精度压模成型。 还公开了光学拾取单元，并且其包括通过该方法制造的物镜。 在该方法中，上模具和下模具中的至少一个具有使得当玻璃材料与上模具和下模具接触时的形状，上模具或下模具中的至少一个的模制表面 模具形成具有玻璃材料表面的封闭空间。 该方法包括以下步骤：在上模和下模之间的玻璃材料表现出10psi的粘度的温度以下的温度下供给玻璃材料; 通过与形成有空间的一侧上的上模具或下模具的接触通过热传导来加热供应的玻璃材料; 并且在玻璃材料与上模具和下模具接触之后，以小于或等于10mm / min的平均移动速度至少移动距离h微米移动上模具和下模具中的至少一个 当压模的温度在玻璃材料的粘度为10〜10〜10℃的范围内处于规定温度T 2时，其中 可移动模具的移动方向上的空间的最大高度表示为h微米。