公开(公告)号：US20170133297A1

公开(公告)日：2017-05-11

申请号：US15414061

申请日：2017-01-24

Applicant: STMicroelectronics (Crolles 2) SAS ,  SOCPRA Sciences et Génie S.E.C.

Inventor： Louis-Michel Collin ,  Luc Guy Frechette ,  Sandrine Lhostis

IPC: H01L23/42 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/367

CPC classification number: H01L23/42 ,  H01L21/31116 ,  H01L21/481 ,  H01L21/4825 ,  H01L21/4853 ,  H01L21/4875 ,  H01L21/4878 ,  H01L21/52 ,  H01L21/54 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3157 ,  H01L23/3672 ,  H01L23/473 ,  H01L23/492 ,  H01L23/4952 ,  H01L23/49568 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13015 ,  H01L2224/13024 ,  H01L2224/13078 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/14051 ,  H01L2224/14151 ,  H01L2224/14152 ,  H01L2224/14154 ,  H01L2224/14177 ,  H01L2224/14517 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/27462 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29015 ,  H01L2224/29078 ,  H01L2224/29147 ,  H01L2224/30151 ,  H01L2224/30152 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/37002 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/1415

Abstract: An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are formed to extend from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.

公开(公告)号：US09648724B2

公开(公告)日：2017-05-09

申请号：US14956512

申请日：2015-12-02

Applicant: STMICROELECTRONICS (CROLLES 2) SAS ,  STMICROELECTRONICS SA

Inventor： Nicolas Hotellier ,  François Guyader ,  Vincent Fiori ,  Richard Fournel ,  Frédéric Gianesello

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H01L21/762 ,  H01L21/764

CPC classification number: H05K1/0216 ,  H01L21/762 ,  H01L21/7624 ,  H01L21/764 ,  H01L24/03 ,  H01L24/05 ,  H01L29/0657 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2924/00014 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0011 ,  H01L2224/05599

Abstract: An electronic device has a rear plate that includes a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers. An electronic structure is on the substrate front layer and includes electronic components and electrical connections. The substrate rear layer includes a solid local region and a hollowed-out local region. The hollowed-out local region extends over all of the substrate rear layer. The substrate rear layer does not cover at least one local zone of the dielectric intermediate layer corresponding to the hollowed-out local region.

公开(公告)号：US09647724B2

公开(公告)日：2017-05-09

申请号：US13714151

申请日：2012-12-13

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS

Inventor： Pascal Urard ,  Christophe Regnier ,  Daniel Gloria ,  Olivier Hinsinger ,  Philippe Cavenel ,  Lionel Balme

IPC: H04B7/00 ,  H04B5/00 ,  G06F21/35 ,  H04W12/06 ,  H04W12/08 ,  H04W4/00

CPC classification number: H04B5/0031 ,  G06F1/1694 ,  G06F1/1698 ,  G06F3/017 ,  G06F21/35 ,  H04B7/24 ,  H04L63/0869 ,  H04L63/18 ,  H04W4/008 ,  H04W4/80 ,  H04W12/06 ,  H04W12/08

Abstract: A wireless unit includes a first motion sensitive device; communications circuitry for wirelessly communicating with a further wireless unit; and a processing device configured to compare at least one first motion vector received from the first motion sensitive device with at least one second motion vector received from a second motion sensitive device of the further wireless unit.

公开(公告)号：US09638844B2

公开(公告)日：2017-05-02

申请号：US14305378

申请日：2014-06-16

Applicant: STMicroelectronics (Crolles 2) SAS ,  Commissariat a L'Energie Atomique et aux Energies Alternatives

Inventor： Romain Girard Desprolet ,  Sandrine Lhostis ,  Salim Boutami

IPC: G02B5/20 ,  H01L27/146 ,  G02B5/00 ,  B82Y20/00 ,  G02F1/1335

CPC classification number: G02B5/201 ,  B82Y20/00 ,  G02B5/008 ,  G02B5/204 ,  G02B2207/101 ,  G02F1/133509 ,  G02F1/133514 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627

Abstract: A spectral filter includes an assembly of filtering cells. Each cell has a same nanostructured pattern and a preferential direction of the pattern. This preferential direction is, for each cell, oriented approximately radially with respect to a single point of the spectral filter. Alternatively, this preferential direction is, for each cell, oriented approximately ortho-radially with respect to the single point of the spectral filter. The single point may be a center point. Alternatively, the single point may correspond to an optical axis of a lens element associated with the spectral filter.

公开(公告)号：US09601382B2

公开(公告)日：2017-03-21

申请号：US14940325

申请日：2015-11-13

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics (Crolles 2) SAS

Inventor： Stephane Monfray ,  Ronald K. Sampson ,  Nicolas Loubet

IPC: H01L21/336 ,  H01L21/8234 ,  H01L29/78 ,  H01L29/66 ,  H01L21/02 ,  H01L21/84 ,  H01L29/10 ,  H01L29/165 ,  H01L29/06

CPC classification number: H01L21/823431 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/02573 ,  H01L21/823418 ,  H01L21/823468 ,  H01L21/823481 ,  H01L21/845 ,  H01L29/0673 ,  H01L29/1083 ,  H01L29/165 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/7848 ,  H01L29/785

Abstract: Elongated fins of a first semiconductor material are insulated from and formed over an underlying substrate layer (of either SOI or bulk type). Elongated gates of a second semiconductor material are then formed to cross over the elongated fins at channel regions, and the gate side walls are covered by sidewall spacers. A protective material is provided to cover the underlying substrate layer and define sidewall spacers on side walls of the elongated fins between the elongated gates. The first semiconductor material and insulating material of the elongated fins located between the protective material sidewall spacers (but not under the elongated gates) is removed to form trenches aligned with the channel regions. Additional semiconductor material is then epitaxially grown inside each trench between the elongated gates to form source-drain regions adjacent the channel regions formed by the elongated fins of the first semiconductor material located under the elongated gates.

公开(公告)号：US20170075148A1

公开(公告)日：2017-03-16

申请号：US15084645

申请日：2016-03-30

Applicant: STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Charles BAUDOT ,  Maurin DOUIX ,  Frédéric BOEUF ,  Sébastien CREMER

IPC: G02F1/025

CPC classification number: G02F1/025 ,  G02F2001/0151

Abstract: An E/O phase modulator may include a waveguide having an insulating substrate, a single-crystal silicon strip and a polysilicon strip of a same thickness and doped with opposite conductivity types above the insulating substrate, and an insulating interface layer between the single-crystal silicon strip and polysilicon strip. Each of the single-crystal silicon strip and polysilicon strip may be laterally continued by a respective extension, and a respective electrical contact coupled to each extension.

Abstract translation: E / O相位调制器可以包括具有绝缘衬底，单晶硅条和相同厚度的多晶硅条的波导，并且在绝缘衬底之上掺杂相反导电类型，并且在单晶之间的绝缘界面层 硅带和多晶硅条。 单晶硅带和多晶硅条中的每一个可以通过相应的延伸部横向连续，并且相应的电触点耦合到每个延伸部。

公开(公告)号：US20170059776A1

公开(公告)日：2017-03-02

申请号：US15352127

申请日：2016-11-15

Applicant: STMICROELECTRONICS (CROLLES 2) SAS ,  STMICROELECTRONICS S.R.L.

Inventor： ANTONIO FINCATO ,  CHARLES BAUDOT

IPC: G02B6/12 ,  G02F1/01 ,  G02B6/293

CPC classification number: G02B6/12033 ,  G02B6/12011 ,  G02B6/12014 ,  G02B6/12016 ,  G02B6/12026 ,  G02B6/29307 ,  G02B6/2938 ,  G02F1/011 ,  G02F1/0115 ,  G02F2201/58 ,  G02F2203/50 ,  H04J14/02

Abstract: An arrayed waveguide grating multiplexer/demultiplexer includes an array of optical waveguides ordered in sequence from a shortest waveguide up to a longest waveguide, and identical phase shifters configured to be controlled by a same control signal. Each phase shifter increases/decreases an optical path of an optical waveguide by the same quantity based on the control control signal.

Abstract translation: 阵列波导光栅复用器/解复用器包括从最短波导到最长波导顺序排列的光波导阵列，以及被配置为由相同控制信号控制的相同移相器。 每个移相器基于控制控制信号增加/减少光波导的光路相同量。

公开(公告)号：US20170005130A1

公开(公告)日：2017-01-05

申请号：US15266405

申请日：2016-09-15

Applicant: STMICROELECTRONICS (CROLLES 2) SAS

Inventor： François ROY ,  Frédéric LALANNE ,  Pierre Emmanuel Marie MALINGE

IPC: H01L27/146

CPC classification number: H01L27/14643 ,  H01L27/14612 ,  H01L27/14636 ,  H01L27/14638 ,  H01L27/14641 ,  H01L27/14689 ,  H04N5/378

Abstract: An image sensor device may include an array of image sensing pixels arranged in rows and columns. Each image sensing pixel may include an image sensing photodiode, a first source follower transistor coupled to the image sensing photodiode, and a switch coupled to the image sensing photodiode. Each image sensor device may include a second source follower transistor coupled to the switch, and a row selection transistor coupled to the first and second source follower transistors.

公开(公告)号：US20170005129A1

公开(公告)日：2017-01-05

申请号：US15266345

申请日：2016-09-15

Applicant: STMICROELECTRONICS (CROLLES 2) SAS

Inventor： François ROY ,  Frédèric LALANNE ,  Pierre Emmanuel Marie MALINGE

IPC: H01L27/146

CPC classification number: H01L27/14643 ,  H01L27/14612 ,  H01L27/14636 ,  H01L27/14638 ,  H01L27/14641 ,  H01L27/14689 ,  H04N5/378

Abstract: An image sensor device may include an array of image sensing pixels arranged in rows and columns. Each image sensing pixel may include an image sensing photodiode, a first source follower transistor coupled to the image sensing photodiode, and a switch coupled to the image sensing photodiode. Each image sensor device may include a second source follower transistor coupled to the switch, and a row selection transistor coupled to the first and second source follower transistors.

Abstract translation: 图像传感器装置可以包括以行和列排列的图像感测像素阵列。 每个图像感测像素可以包括图像感测光电二极管，耦合到图像感测光电二极管的第一源极跟随器晶体管，以及耦合到图像感测光电二极管的开关。 每个图像传感器装置可以包括耦合到开关的第二源极跟随器晶体管，以及耦合到第一和第二源极跟随器晶体管的行选择晶体管。

公开(公告)号：US20170003462A1

公开(公告)日：2017-01-05

申请号：US14755437

申请日：2015-06-30

Applicant: STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Patrick LEMAITRE ,  Jean-Francois CARPENTIER

IPC: G02B6/42 ,  G02B6/34

CPC classification number: G02B6/4225 ,  G02B6/124 ,  G02B6/34 ,  G02B6/4222 ,  G02B6/4227 ,  G02B6/4249 ,  G02B6/425

Abstract: A method is for aligning an electro-optic device. The method may include initially positioning an optical fiber array adjacent to optical grating couplers, and actively aligning the optical fiber array relative to the optical grating couplers in a yaw direction and a roll direction to determine a yaw and roll alignment at a first operating wavelength. The method may include actively aligning the optical fiber array relative to optical grating couplers in an x direction and a y direction to determine a first x and y alignment at the first operating wavelength, determining a second operating wavelength, and actively aligning the optical fiber array again relative to the optical grating couplers in the x direction and y direction to determine a second x and y alignment at the second operating wavelength.