公开(公告)号：US11901252B2

公开(公告)日：2024-02-13

申请号：US17883550

申请日：2022-08-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Han Wang ,  Ian Hu

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/48 ,  H01L21/683 ,  H01L25/10

CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/09 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/02372 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/107 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20240038677A1

公开(公告)日：2024-02-01

申请号：US17877795

申请日：2022-07-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L23/552 ,  H01L25/16 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L25/167 ,  H01L23/49861 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a protective element, and a sensor device. The protective element encapsulates the carrier. The sensor device is embedded in the carrier and the protective element. The sensor device includes a sensing portion and a protective portion adjacent to the sensing portion, and the protective portion of the sensor device has a first surface exposed from the protective element and the carrier.

公开(公告)号：US11887928B2

公开(公告)日：2024-01-30

申请号：US17555227

申请日：2021-12-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Shun Chang ,  Sheng-Wen Yang ,  Teck-Chong Lee ,  Yen-Liang Huang

IPC: H01L23/522 ,  H01L23/12 ,  H01L23/31

CPC classification number: H01L23/5226 ,  H01L23/12 ,  H01L23/31

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

公开(公告)号：US11882660B2

公开(公告)日：2024-01-23

申请号：US18095511

申请日：2023-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Fan Chen ,  Chien-Hao Wang

IPC: H05K1/18 ,  H01L21/48 ,  H01L23/538 ,  H01L21/56

CPC classification number: H05K1/183 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/5383 ,  H01L23/5386 ,  H01L2224/04105 ,  H01L2924/11 ,  H01L2924/15153 ,  H05K2201/10

Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

公开(公告)号：US11881448B2

公开(公告)日：2024-01-23

申请号：US17315067

申请日：2021-05-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung Yen ,  Bernd Karl Appelt ,  Kay Stefan Essig

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4814 ,  H01L23/49822

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first package and a second package. The first package includes a first substrate, an electronic component, a trace layer, and a first conductive structure. The first substrate has a first surface and a second surface opposite to the first surface. The electronic component is embedded in the first substrate. The trace layer has an uppermost conductive layer embedded in the first substrate and exposed from the first surface of the first substrate. The first conductive structure electrically connects the trace layer to the second surface of the first substrate. The second package is disposed on the first surface of the first substrate of the first package.

公开(公告)号：US11869828B2

公开(公告)日：2024-01-09

申请号：US17344842

申请日：2021-06-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Chi Chen ,  Ming-Han Wang

IPC: H01L23/48 ,  H01L23/00 ,  H01L27/146 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L23/562 ,  H01L27/14634

Abstract: A semiconductor package includes a first die. The first die includes a semiconductor substrate. The semiconductor substrate has a first surface, a second surface opposite to the first surface, and a through hole between the first surface and the second surface and having an inner wall. The inner wall has a first lever arm. A length of the first lever arm is less than a thickness of the semiconductor substrate.

公开(公告)号：US20230420418A1

公开(公告)日：2023-12-28

申请号：US17846642

申请日：2022-06-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen TING ,  Pao-Nan LEE ,  Jung Jui KANG ,  Chang Chi LEE

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L2225/06544 ,  H01L2225/06558 ,  H01L2225/06589

Abstract: An electronic device is provided. The electronic device includes a first die and a second die. The second die is disposed over the first die. A backside surface of the second die faces a backside surface of the first die. An active surface of the second die is configured to receive a first power. The second die is configured to provide the first die with a second power through the backside surface of the second die and the backside surface of the first die.

公开(公告)号：US20230413454A1

公开(公告)日：2023-12-21

申请号：US18239723

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K3/28 ,  H05K1/14

CPC classification number: H05K5/0017 ,  H05K5/065 ,  H05K1/181 ,  H05K9/0022 ,  H05K3/284 ,  H05K1/142 ,  H05K1/144 ,  H05K2203/1316 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/041 ,  H05K2203/1327

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US11837686B2

公开(公告)日：2023-12-05

申请号：US16706527

申请日：2019-12-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chanyuan Liu ,  Kuo-Hsien Liao ,  Alex Chi-Hong Chan ,  Fuh-Yuh Shih

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L33/60 ,  H01L33/52 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0058

Abstract: An optical device package includes a substrate, a light emitting device, a light detecting device, one or more electronic chips, a clear encapsulation layer and a patterned reflective layer. The substrate has a surface. The light emitting device is disposed on the surface of the substrate, the light detecting device is disposed on the surface of the substrate, and the light emitting device and the light detecting device have a gap. The one or more electronic chips are at least partially embedded in the substrate, and electrically connected to the light emitting device and the light detecting device. The clear encapsulation layer is disposed on the surface of the substrate and encapsulates the light emitting device and the light detecting device. The patterned reflective layer is disposed on an upper surface of the clear encapsulation layer and at least overlaps the gap between the light emitting device and the light detecting device in a projection direction perpendicular to the surface of the substrate.

公开(公告)号：US11837557B2

公开(公告)日：2023-12-05

申请号：US17537317

申请日：2021-11-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Peng Yang ,  Yuan-Feng Chiang ,  Po-Wei Lu

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/96 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/95001 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/15156 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/1431 ,  H01L2924/00012 ,  H01L2924/1433 ,  H01L2924/00012

Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.