公开(公告)号：US07659736B2

公开(公告)日：2010-02-09

申请号：US11761912

申请日：2007-06-12

Applicant: Benjamin N. Eldridge ,  Barbara Vasquez ,  Makarand S. Shinde ,  Gaetan L. Mathieu ,  A. Nicholas Sporck

Inventor： Benjamin N. Eldridge ,  Barbara Vasquez ,  Makarand S. Shinde ,  Gaetan L. Mathieu ,  A. Nicholas Sporck

IPC: G01R31/02

CPC classification number: G01R31/2889 ,  G01R1/0416 ,  G01R1/07307

Abstract: A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.

Abstract translation: 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。

公开(公告)号：US07622935B2

公开(公告)日：2009-11-24

申请号：US11551545

申请日：2006-10-20

Applicant: Eric D. Hobbs ,  Alexander H. Slocum ,  Benjamin N. Eldridge ,  Keith J. Breinlinger ,  Shawn Powell

Inventor： Eric D. Hobbs ,  Alexander H. Slocum ,  Benjamin N. Eldridge ,  Keith J. Breinlinger ,  Shawn Powell

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2893

Abstract: A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

Abstract translation: 探针卡组件可以包括探针头组件和布线衬底。 探针头组件可以包括多个探针，其设置成接触设置在测试壳体中的保持器上的电子设备。 布线基板可以包括与测试控制器的电接口以及构成电接口和探针之间的电气路径的多个电线，并且布线基板可以包括其上设置有电接口的第一部分和第二部分 组成探头组件的部分。 布线基板的第二部分能够相对于布线基板的第一部分移动。

公开(公告)号：US07616016B2

公开(公告)日：2009-11-10

申请号：US12060753

申请日：2008-04-01

Applicant: Benjamin N. Eldridge ,  Igor Y. Khandros ,  A. Nicholas Sporck

Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  A. Nicholas Sporck

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US20090263986A1

公开(公告)日：2009-10-22

申请号：US12495405

申请日：2009-06-30

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

IPC: H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/14 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.

Abstract translation: 包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。 第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。 在一个方面，互连具有适于直接接触半导体器件的尺寸。 可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。 在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

公开(公告)号：US07553165B2

公开(公告)日：2009-06-30

申请号：US12120112

申请日：2008-05-13

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

IPC: H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/14 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.

Abstract translation: 包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。 第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。 在一个方面，互连具有适于直接接触半导体器件的尺寸。 可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。 在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

公开(公告)号：US07548055B2

公开(公告)日：2009-06-16

申请号：US11696582

申请日：2007-04-04

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Charles A. Miller ,  A. Nicholas Sporck

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Charles A. Miller ,  A. Nicholas Sporck

IPC: G01R31/28

CPC classification number: G01R1/0491 ,  G01R1/073 ,  G01R31/3025

Abstract: A method and apparatus for testing a set of electronic devices can comprise placing electronic devices into a test station. A plurality of testers can provide test data to the test station. The test station can test the electronic devices using test data received from the plurality of testers. One of the testers can communication with another of the testers regarding the testing of the electronic devices. Probes can be used to contact the electronic devices, and one of the electronic devices can be contacted by more than one of the probes.

Abstract translation: 用于测试一组电子设备的方法和装置可以包括将电子设备放置在测试台中。 多个测试者可以向测试台提供测试数据。 测试台可以使用从多个测试器接收的测试数据来测试电子设备。 其中一个测试人员可以与其他测试人员进行电子设备测试的通信。 探针可用于接触电子设备，并且其中一个电子设备可以被多个探针接触。

公开(公告)号：US20090079452A1

公开(公告)日：2009-03-26

申请号：US11861559

申请日：2007-09-26

Applicant: Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: G01R1/073 ,  G01R31/02 ,  H01L21/68

CPC classification number: G01R31/2891 ,  G01R1/06716 ,  G01R1/07342 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L21/682 ,  Y10T29/49002

Abstract: A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

Abstract translation: 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构，使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

公开(公告)号：US07482822B2

公开(公告)日：2009-01-27

申请号：US11461734

申请日：2006-08-01

Applicant: Timothy E. Cooper ,  Benjamin N. Eldridge ,  Carl V. Reynolds ,  Ravindra Vaman Shenoy

Inventor： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Carl V. Reynolds ,  Ravindra Vaman Shenoy

IPC: G01R31/02

CPC classification number: G01R31/2887 ,  G01R3/00 ,  G01R31/2886

Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

Abstract translation: 公开了用于测试半导体器件的方法和装置。 相对于探针卡组件的探针，超行程停止限制要测试的设备的行程。 采用反馈控制技术来控制装置和探针卡组件的相对运动。 探针卡组件包括用于吸收相对于探针卡组件的待测试装置的过度行进的柔性基座。

公开(公告)号：US07471094B2

公开(公告)日：2008-12-30

申请号：US11165833

申请日：2005-06-24

Applicant: Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

Inventor： Eric D. Hobbs ,  Benjamin N. Eldridge ,  Lunyu Ma ,  Gaetan L. Mathieu ,  Steven T. Murphy ,  Makarand S. Shinde ,  Alexander H. Slocum

IPC: G01R31/02

CPC classification number: G01R31/2886 ,  G01R1/073 ,  G01R31/31905 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49208 ,  Y10T29/49222

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract translation: 探针卡组件包括附接到安装组件的多个探针基板。 每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。 调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。 调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。 调节机构可以进一步改变一个或多个探针基板的形状。 因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

公开(公告)号：US07459795B2

公开(公告)日：2008-12-02

申请号：US10922486

申请日：2004-08-19

Applicant: Benjamin N. Eldridge ,  Bruce Jeffrey Barbara

Inventor： Benjamin N. Eldridge ,  Bruce Jeffrey Barbara

IPC: H01L21/60

CPC classification number: G01R3/00 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/30111 ,  Y10T29/49121 ,  Y10T29/49147 ,  Y10T29/49224 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a space transformer substrate. The support substrates with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate to improve yield. The resilient spring contacts are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts are epoxied to the support substrate and the release layer removed. The support substrate can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided beneath the spring contacts for improved impedance matching.

Abstract translation: 提供了用于晶片测试探测的弹性弹簧触点，其可以以非常精细的间距间隔制造并且精确地位于支撑基板上。 弹性接触结构适于引线接合到空间变压器基板上的电路。 具有附接弹簧触点的支撑基板可以一起大量制造，并在连接到空间变压器基板之前进行切割和测试，以提高产量。 弹性弹簧触点使用光刻技术制造，以在将弹簧触点环氧化为支撑基底并且去除释放层之前在释放层上形成触点。 支撑衬底可以是透明的，以允许触点的对准和下面的光学部件的测试。 支撑基板可以包括设置在弹簧触点下方的接地平面，用于改善阻抗匹配。