公开(公告)号：US07981788B2

公开(公告)日：2011-07-19

申请号：US11482854

申请日：2006-07-10

申请人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

发明人： Nobuyasu Muto ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at.Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

摘要翻译： 提高了半导体器件中的芯片布局的自由度，并且旨在提高封装密度。 由于可以通过通过球接合进行反向接合的过粘结而在存储芯片的焊盘上形成两个方向的线，因此可以通过球接合产生与楔形接合的连续接合接合相当的效果。 因此，可以提高芯片布局的自由度和基板3的引线布局的自由度，并且可以提高芯片层叠型半导体器件（存储卡）中的基板上的封装密度。

公开(公告)号：US07656014B2

公开(公告)日：2010-02-02

申请号：US11779801

申请日：2007-07-18

申请人： Yoshiyuki Tanigawa ,  Tamaki Wada

发明人： Yoshiyuki Tanigawa ,  Tamaki Wada

IPC分类号： H01L23/02

CPC分类号： H01L23/544 ,  B82Y10/00 ,  G11C5/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

摘要翻译： 提高了半导体器件的工艺成品率。 为此，提供了一种半导体器件，其包括具有安装在其上的半导体芯片的元件安装面的基板，该基板设置有多个连接引线，以及设置在树脂制成的盖上， 基板，以覆盖它们，盖具有第一主体部分，第二主体部分的厚度大于第一主体部分。 由于铭牌形式的产品信息刻在盖的第二主体部分的上表面侧，所以可以显示产品信息而不使用墨水标记，可以防止由于墨水引起的标记缺陷的发生 流出等，从而提高存储卡（半导体器件）的处理成品率。

公开(公告)号：US20080173995A1

公开(公告)日：2008-07-24

申请号：US11898456

申请日：2007-09-12

申请人： Bunshi Kuratomi ,  Fukumi Shimizu ,  Michiaki Sugiyama ,  Atsushi Fujishima ,  Tamaki Wada

发明人： Bunshi Kuratomi ,  Fukumi Shimizu ,  Michiaki Sugiyama ,  Atsushi Fujishima ,  Tamaki Wada

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/566 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09145 ,  H05K2201/10159 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is a need to provide a large capacity memory card for a portable communication device. A memory card 1 includes: a wiring board 2 mainly composed of a glass epoxy resin; multiple semiconductor chips (3C and 3F) mounted on a main surface of the memory card 1; and a mold resin 4 for encapsulating the wiring board 2 and the semiconductor chips (3C and 3F). The mold resin 4 is made of a thermosetting epoxy resin containing quartz filler. A back surface of the wiring board 2 is not covered with the mold resin 4 and is exposed to a back surface of the memory card 1. The back surface of the wiring board 2 is used to form multiple external connection terminals 7 electrically connected to the semiconductor chips (3C and 3F) . When the memory card 1 is attached to a card slot of a mobile phone, the external connection terminals 7 contact with a connector terminal contained in the card slot. This makes it possible to exchange signals between the memory card 1 and the mobile phone or to supply the power.

摘要翻译： 需要提供用于便携式通信设备的大容量存储卡。 存储卡1包括：主要由玻璃环氧树脂构成的布线板2; 安装在存储卡1的主表面上的多个半导体芯片（3C和3F） 以及用于封装布线板2和半导体芯片（3C和3F）的模制树脂4。 模制树脂4由含有石英填料的热固性环氧树脂制成。 配线基板2的背面未被模制树脂4覆盖，并暴露于存储卡1的背面。 布线板2的背面用于形成与半导体芯片（3C和3F）电连接的多个外部连接端子7。 当存储卡1附接到移动电话的卡槽时，外部连接端子7与包含在卡槽中的连接器端子接触。 这使得可以在存储卡1和移动电话之间交换信号或者提供电力。

公开(公告)号：US20070257346A1

公开(公告)日：2007-11-08

申请号：US11779801

申请日：2007-07-18

申请人： Yoshiyuki Tanigawa ,  Tamaki Wada

发明人： Yoshiyuki Tanigawa ,  Tamaki Wada

IPC分类号： H01L23/02

CPC分类号： H01L23/544 ,  B82Y10/00 ,  G11C5/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54406 ,  H01L2223/54486 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).

摘要翻译： 提高了半导体器件的工艺成品率。 为此，提供了一种半导体器件，其包括具有安装在其上的半导体芯片的元件安装面的基板，该基板设置有多个连接引线，以及设置在树脂制成的盖上， 基板，以覆盖它们，盖具有第一主体部分，第二主体部分的厚度大于第一主体部分。 由于铭牌形式的产品信息刻在盖的第二主体部分的上表面侧，所以可以显示产品信息而不使用墨水标记，可以防止由于墨水引起的标记缺陷的发生 流出等，从而提高存储卡（半导体器件）的处理成品率。

公开(公告)号：US20060108430A1

公开(公告)日：2006-05-25

申请号：US11326448

申请日：2006-01-06

申请人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

发明人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

IPC分类号： G06K19/06

CPC分类号： G06K19/07732 ,  B29C45/14647 ,  G06K19/077 ,  G06K19/07745 ,  H01L23/04 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/5388 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

公开(公告)号：US07012321B2

公开(公告)日：2006-03-14

申请号：US10377713

申请日：2003-03-04

申请人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

发明人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01R43/00

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

公开(公告)号：US20050184380A1

公开(公告)日：2005-08-25

申请号：US11114175

申请日：2005-04-26

申请人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

发明人： Kazuki Sakuma ,  Masayasu Kawamura ,  Yasushi Takahashi ,  Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano

IPC分类号： G11C8/00 ,  H01L23/02 ,  H01L23/495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.

公开(公告)号：US10087421B2

公开(公告)日：2018-10-02

申请号：US13883371

申请日：2011-11-09

申请人： Eiji Kobayashi ,  Tamaki Wada ,  Yasutaka Fujita ,  Norihiro Yoshinaga ,  Masako Doi ,  Yasuhiro Fujimoto ,  Takumi Teratani

发明人： Eiji Kobayashi ,  Tamaki Wada ,  Yasutaka Fujita ,  Norihiro Yoshinaga ,  Masako Doi ,  Yasuhiro Fujimoto ,  Takumi Teratani

IPC分类号： C12N5/071 ,  C07H3/04 ,  C12N5/0775 ,  A01N1/02 ,  A61K9/00 ,  A61K47/26 ,  A61K47/36 ,  A61K35/28 ,  C08B31/04 ,  C08B37/02

摘要： The present invention provides a mammalian stem cell suspension containing mammalian stem cells and at least one polysaccharide such as trehalose, and the like; a mammalian stem cell aggregation inhibitor containing polysaccharide such as trehalose, and the like; a method of suppressing aggregation of mammalian stem cells, containing suspending the mammalian stem cells in an aqueous physiological solution containing polysaccharide; an inhibitor of a decrease in the survival rate of mammalian stem cells containing polysaccharide such as trehalose and the like; a method of suppressing a decrease in the survival rate of mammalian stem cells, containing suspending the mammalian stem cells in an aqueous physiological solution containing polysaccharides, and the like.

公开(公告)号：US20110269268A1

公开(公告)日：2011-11-03

申请号：US13179468

申请日：2011-07-08

申请人： NOBUYASU MUTO ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

发明人： NOBUYASU MUTO ,  Naoki Kawanabe ,  Hiroshi Ono ,  Tamaki Wada

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at.Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

摘要翻译： 提高了半导体器件中的芯片布局的自由度，并且旨在提高封装密度。 由于可以通过通过球接合进行反向接合的过粘结而在存储芯片的焊盘上形成两个方向的线，因此可以通过球接合产生与楔形接合的连续接合接合相当的效果。 因此，可以提高芯片布局的自由度和基板3的引线布局的自由度，并且可以提高芯片层叠型半导体器件（存储卡）中的基板上的封装密度。

公开(公告)号：US20070126099A1

公开(公告)日：2007-06-07

申请号：US11565788

申请日：2006-12-01

申请人： Yoshitaka Aoki ,  Keiichi Tsutsui ,  Hirotaka Nishizawa ,  Tamaki Wada

发明人： Yoshitaka Aoki ,  Keiichi Tsutsui ,  Hirotaka Nishizawa ,  Tamaki Wada

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  B82Y10/00 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： To provide a memory card advantageous for coping with an increase of storage capacity. As an embodiment of the present invention, a memory card is formed in a rectangular thin-plate form, by a housing that is made of an insulated material and in that a recessed part is formed on the top surface being one surface in the thickness direction, and a rectangular multi-chip package contained in the recessed part. The housing has a rectangular bottom wall and side walls standing from three of the four sides of the bottom wall. In these side walls, two side walls face to each other, and the remaining one side wall connects one end part of these side walls. The recessed part is formed to be open upward and sideward by the bottom wall and the three side walls.

摘要翻译： 提供有利于应对存储容量的增加的存储卡。 作为本发明的一个实施例，存储卡通过由绝缘材料制成的壳体形成为矩形薄板形式，并且在顶表面上形成有一个在厚度方向上的一个表面的凹部 ，以及包含在凹部中的矩形多芯片封装。 壳体具有矩形底壁和从底壁的四个侧面中的三个侧面竖立的侧壁。 在这些侧壁中，两个侧壁彼此面对，并且剩余的一个侧壁连接这些侧壁的一个端部。 凹部形成为通过底壁和三个侧壁向上和向外敞开。