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78 条记录 (耗时 0.046 秒)

    Semiconductor device and method of fabrication thereof
    62.
    发明授权
    Semiconductor device and method of fabrication thereof 失效
    半导体装置及其制造方法

    公开(公告)号：US5279985A

    公开(公告)日：1994-01-18

    申请号：US945260

    申请日：1992-09-15

    申请人： Satoshi Kamiyama

    发明人： Satoshi Kamiyama

    IPC分类号： H01B3/12 ,  H01L21/02 ,  H01L21/28 ,  H01L21/822 ,  H01L21/8242 ,  H01L27/04 ,  H01L27/108 ,  H01L29/43 ,  H01L21/70

    CPC分类号： H01L28/40 ,  Y10S148/014 ,  Y10S148/163

    摘要： The present invention relates to a semiconductor device and a method of fabrication of the same, said semiconductor device including a capacitive structure comprising of a lower layer electrode consisting of a silicon material, a capacitive insulating film consisting of a tantalum oxide film and an upper layer electrode, said upper layer electrode comprising at least a titanium nitride film for covering said capacitive insulating film. Said method of fabrication comprises the steps of: forming the lower layer electrode; forming the capacitive insulating film for covering said lower layer electrode; and forming the titanium nitride film for covering said capacitive insulating film.

    摘要翻译： 半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法，所述半导体器件包括电容结构，该电容结构包括由硅材料构成的下层电极，由氧化钽膜构成的电容绝缘膜和上层 电极，所述上层电极至少包括用于覆盖所述电容绝缘膜的氮化钛膜。 所述制造方法包括以下步骤：形成下层电极; 形成用于覆盖所述下层电极的电容绝缘膜; 以及形成用于覆盖所述电容绝缘膜的氮化钛膜。

    PRESSURE REGULATOR
    65.
    发明申请
    PRESSURE REGULATOR 审中-公开
    压力调节器

    公开(公告)号：US20110048553A1

    公开(公告)日：2011-03-03

    申请号：US11996955

    申请日：2006-07-25

    申请人： Yasuaki Nakamura ,  Hideto Usui ,  Satoshi Kamiyama ,  Mitsuo Hirotomi

    发明人： Yasuaki Nakamura ,  Hideto Usui ,  Satoshi Kamiyama ,  Mitsuo Hirotomi

    IPC分类号： F16K7/00

    CPC分类号： G05D16/0661 ,  Y10T137/7904

    摘要： A pressure regulator includes a housing having an inlet port through which pressurized fluid at a primary pressure is supplied, and a discharge port through which pressurized fluid at a secondary pressure lower than the primary pressure is discharged, and at the same time having a flow passage formed therein to extend from the inlet port to the discharge port, and a pressure control mechanism which is disposed on the flow passage to reduce the primary pressure to the secondary pressure. The pressure control mechanism includes a movable body including a diaphragm which is displaced in response to change in the pressure of the fluid and the movable body is provided with an abutment portion which is brought into abutment against a part of the housing to prevent the movable body from being excessively displaced when the primary pressure becomes excessively high.

    摘要翻译： 压力调节器包括壳体，该壳体具有供给初级压力的加压流体的入口端口以及排出低于初级压力的次级压力的加压流体的排出口，同时具有流路 形成在其中以从入口端口延伸到排放口;以及压力控制机构，其布置在流动通道上以将初级压力降低到次级压力。 压力控制机构包括：移动体，其包括响应于流体的压力变化而移位的隔膜，并且可移动体设置有邻接部分，抵靠部分抵靠壳体的一部分以防止移动体 当初级压力变得过高时，不会发生过度位移。