摘要:
Passivation films 3a, 3b are formed to cover both surfaces of semiconductor substrate 1 which comprises terminal pads 2a, 2b on both surfaces. Openings 3c, 3d are provided at positions on passivation films 3a, 3b which match with terminal pads 2a, 2b. Throughholes 9 are formed inside of openings 3c, 3d to extend through terminal pad 2a, semiconductor substrate 1, and terminal pad 2b. Insulating layer 4 made of SiO2, SiN, SiO, or the like is formed on the inner surfaces of throughholes 9. Buffer layer 5 made of a conductive adhesive is formed to cover insulating layer 4 and terminal pads 2a, 2b in openings 3c, 3d. Further, conductive layer 6 made of a metal film is formed on buffer layer 5 by electrolytic plating, non-electrolytic plating, or the like.
摘要:
A video coding system receives as input a video sequence including a series of picture frames. One or more long term references are selected from the input video sequence, at least one of the long term references is a long term look-behind reference frame. Short term reference frames are also selected according to the standards. The frames are then re-ordered for encoding such that the long term look-behind reference is encoded first, followed by the remaining frames according to the conventional order dictated by the standards. Each frame is encoded according to motion estimation and motion compensation, and an intra prediction method that incorporates the use of the long term look-behind reference frame. Further, encoding of each long term look-behind reference frame includes quantization according to a controlled bit-rate. The bit-rate is increased for quantization of each long term look-behind reference frame, thereby increasing its quality. For each other frame, the bit rate is maintained at a normalized level.
摘要:
A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
摘要:
A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.
摘要:
The largest absolute value (LAV) is determined within a group of data. Based on the LAV, a difference table is identified that is to be used for selecting an optimal Huffman codebook for the group of data. The difference table is associated with two Huffman codebooks. Further, one or more indexes are calculated for the group of data using an expression associated with the two Huffman codebooks, and a size difference value is determined for the group of data using the calculated indexes and the difference table. Based on the determined size difference value, the optimal Huffman codebook is selected from the above two codebooks.
摘要:
An automatic disc changer has a casing for the automatic disc changer, and a plurality of disc holders arranged in the casing. The disc holder stores a plurality of disks in vertical positions. A reproducing device is provided in the casing to be moved along the disc holder. A movable frame is provided on the disc holder to be shifted by a pitch of the space in a direction of the arrangement of the disc holders. A plurality of guide projections are provided on the movable frame, which are disposed adjacent to ends of the holding plates. The guide projections are arranged by a pitch which is twice as much as the pitch of the space. Each guide projection has a triangular section, the bottom of which is approximately equal to a width of the space, so as to close a corresponding space.
摘要:
A cutting method to be applied to producing helical springs by cold-forming a thick high-strength wire having a tensile strength in the range of 1765 to 2157 N/mm.sup.2 and a diameter in the range of 8 to 16 mm on a coiling machine, and then the wire is cut at the end coil of the coiled portion to provide a helical spring. A predetermined range about a position on the wire at a distance coresponding to the length of wire in the helical spring from the free end of the wire fed to the coiling machine is heated to a temperature within a predetermined temperature range. Therefore, the end coil of the helical spring is formed by the heated portion of the wire, and hence the helical spring is cut off the wire at a position in the heated portion. Accordingly, the helical spring can be cut with the cutting mandrel and the cutting blade or the coiling machine by a small shearing force and, since the cut end is only a portion of the end coil of the helical spring, the mechanical properties of the helical spring are not affected by cutting in the least.
摘要翻译:一种通过在卷取机上冷成型拉伸强度为1765〜2157N / mm 2,直径为8〜16mm的厚的高强度丝来制造螺旋弹簧的切断方法, 然后在线圈部分的端部线圈处切断线以提供螺旋弹簧。 与馈送到卷取机的线的自由端的螺旋弹簧中的线的长度相对应的距离处的线上的位置的预定范围被加热到预定温度范围内的温度。 因此,螺旋弹簧的端部线圈由线的加热部分形成,因此螺旋弹簧在加热部分中的位置处被切断。 因此,螺旋弹簧可以用切割心轴和切割刀片或卷绕机通过小的剪切力切割,并且由于切割端仅是螺旋弹簧的端部线圈的一部分,所以螺旋弹簧的机械性能 春天不会受到切割的影响。
摘要:
The present invention relates to a high-strength spring steel and its manufacturing process. More specifically, it relates to a high-strength spring steel characterized in that it is obtained by heating the surface of the material steel to over the AC.sub.3 transformation point by the high-frequency induction heating or the like, stopping the heating and then decreasing the surface temperature of said material steel to below the Ar.sub.1 transformation point, this short-time heating of the surface being repeated to secure heating throughout the entire steel body or a condition close to it, under which the steel is quenched, whereby the crystal grains in the steel become increasingly finer from the core to the surface layer of the steel, the crystal grain size of the metal in the surface layer being extraordinarily fine; the invention also relates to the process of manufacturing the steel.
摘要:
A restriction indicator having a contactless switch device for indicating a restriction in filter elements of fluid filters having an intake side and a negative pressure side. The restriction indicator includes a photointerrupter having a light emitting device and a light receiving device. The light receiving device provides an electrical signal indicative of increased negative pressure in the negative pressure side.