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    Induction Welded Waterproofing
    64.
    发明申请
    Induction Welded Waterproofing 失效
    感应焊接防水

    公开(公告)号：US20120152437A1

    公开(公告)日：2012-06-21

    申请号：US13291614

    申请日：2011-11-08

    申请人： Robert Cisneros

    发明人： Robert Cisneros

    IPC分类号： B32B38/18 ,  B32B3/06 ,  E04F13/07

    CPC分类号： B29D99/001 ,  B32B3/06 ,  B32B37/00 ,  B32B2038/166 ,  B32B2307/718 ,  B32B2307/7246 ,  B32B2309/02 ,  B32B2310/0812 ,  B32B2419/00 ,  E02D31/02 ,  E21D11/383 ,  Y10T156/10 ,  Y10T428/24008

    摘要： In accordance with an embodiment of the disclosure, A water-proofing laminate includes a drainboard having a first surface positioned against a hydraulic source and a second surface opposed to the first surface, a fastener plate positioned against the second surface of the drainboard securing the drainboard to the hydraulic surface, the fastener plate comprising a conductive element and a thermoplastic resin, and a self-healing hydraulic barrier comprising a thermoplastic surface adjoined to a geotextile and carrying a water-absorbent material, the thermoplastic surface inductively welded to the fastener plate.

    摘要翻译： 根据本公开的实施例，防水层压板包括排水板，其具有抵靠液压源定位的第一表面和与第一表面相对的第二表面，紧固板，其抵靠排水板的第二表面定位，固定排水板 所述紧固板包括导电元件和热塑性树脂，以及自愈液压屏障，其包括邻接于土工布的热塑性表面并且携带吸水材料，所述热塑性表面感应地焊接到所述紧固件板。

    Process for manufacturing printed circuit boards and a machine for this purpose
    65.
    发明授权
    Process for manufacturing printed circuit boards and a machine for this purpose 有权
    为此制造印刷电路板和机器的工艺

    公开(公告)号：US07565736B2

    公开(公告)日：2009-07-28

    申请号：US10549040

    申请日：2004-03-02

    申请人： Victor Lazaro Gallego ,  Jose Antonio Cubeiro Gonzalez

    发明人： Victor Lazaro Gallego ,  Jose Antonio Cubeiro Gonzalez

    IPC分类号： H05K3/36 ,  H05K3/20 ,  H05K3/10

    CPC分类号： B32B15/14 ,  B32B37/04 ,  B32B37/06 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2309/68 ,  B32B2310/0812 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/4611 ,  H05K2203/101 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

    摘要： Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board composition formed by one or more metal sheets, by one or more layers of insulating material impregnated with polymerizable resins and/or by one or more printed circuit boards with an engraved Image of a circuit, are arranged between the press plates of a press and is pressed, subjecting said press packet to the action of a variable induction magnetic field which generates induced currents in each metal plate and sheet of the press packet, causing the heating of said plates and sheets, in turn causing the heating by thermal conduction of the layers of insulating material, melting and liquefying the resins in said layers of insulating material and adhering the insulating material to the metal sheets, so that, an raising the temperature even more, the polymerizable resins in the layers of insulating material are then polymerized, resulting, after the cooling of the press packet, in one or more rigid boards suitable for making printed electronic circuits. The machine to carry out the above process comprises a variable induction magnetic field generating device adapted to generate induced currents in the press packet's metal plates and sheets, causing them to heat, and means of controlling the Operation of the magnetic field generating device and controlling the temperature and pressure to which the press packet is subjected.

    摘要翻译： 用于制造印刷电路板的工艺和机器，其中包括由至少两个金属材料压板组成的印刷电路板，其间布置有由一个或多个金属板形成的印刷电路板组合物，所述印刷电路板组合物通过一层或多层浸渍有可聚合的 树脂和/或通过一个或多个印刷电路板，具有电路雕刻图像，被布置在印刷机的压板之间并被压制，使所述印刷包受到产生感应电流的可变感应磁场的作用 每个金属板和压片的片材，导致所述板和片的加热，从而导致绝缘材料层的热传导的加热，熔化和液化所述绝缘材料层中的树脂并粘附绝缘材料 使金属片材的温度升高，绝缘层内的聚合性树脂 然后将材料聚合，在挤压包的冷却之后，在适于制造印刷电子电路的一个或多个刚性板中。 执行上述处理的机器包括可变感应磁场产生装置，适于在压力分组的金属板和片材中产生感应电流，使其发热，以及控制磁场产生装置的操作和控制 温度和压力的压力。

    Paper products and processes of producing them
    67.
    发明申请
    Paper products and processes of producing them 审中-公开
    造纸产品及其生产工艺

    公开(公告)号：US20070000602A1

    公开(公告)日：2007-01-04

    申请号：US11478231

    申请日：2006-06-29

    申请人： Clyde Sprague

    发明人： Clyde Sprague

    IPC分类号： B32B37/00

    CPC分类号： B65D85/322 ,  B27N3/007 ,  B27N5/00 ,  B31B50/59 ,  B32B37/1207 ,  B32B2305/70 ,  B32B2310/0812 ,  B32B2317/12 ,  B32B2607/00 ,  Y10T428/31993

    摘要： A product and process of making it, wherein small pieces or shreds of paper (12, 12a, 54) or other material are bonded together to form a panel (11, 51, L, V) or other shaped product (70, 80). The pieces or shreds of paper or other material may be randomly oriented in three-dimensions to form a sparse, light and airy core (13), or flat pieces of paper or other material may be laminated in layers to form a denser core (53). Various energy sources (33) may be used to activate or set a bonding agent used to bond the pieces or shreds together, and energy susceptors may be mixed in the bonding agent to promote induction heating when energy is applied, and/or to manipulate the pieces of paper or other material during manufacture. The core may be formed into a flat panel (11, 51, L), or into various three-dimensional shapes (70, 80). The panel is formed into a desired shape prior to activating or setting the bonding agent. Liners (15, 16, 58, 59) may be applied to the panel.

    摘要翻译： 一种产品及其制造方法，其中将小片或纸片（12,12a，54）或其他材料粘合在一起以形成面板（11,51，L，V）或其他成形产品（70,80） ）。 纸或其他材料的碎片或碎片可以是三维无规取向以形成稀疏，光和通风的芯（13），或者可以将平片的纸或其它材料层压成层以形成更密的芯（53 ）。 可以使用各种能量源（33）来激活或设置用于将碎片或碎片粘合在一起的粘合剂，并且能量感受器可以在粘合剂中混合以在施加能量时促进感应加热，和/或操纵 制造过程中的纸张或其他材料。 芯可以形成为平板（11,51，L），或形成各种三维形状（70,80）。 在激活或设置粘合剂之前，将面板形成所需的形状。 衬垫（15,16,68,59）可以施加到面板上。

    Process for manufacturing printed circuit boards and a machine for this purpose
    68.
    发明申请
    Process for manufacturing printed circuit boards and a machine for this purpose 有权

    公开(公告)号：US20060213613A1

    公开(公告)日：2006-09-28

    申请号：US10549040

    申请日：2004-03-02

    申请人： Victor Gallego ,  Jose Cubeiro Gonzalez

    发明人： Victor Gallego ,  Jose Cubeiro Gonzalez

    IPC分类号： B65C9/25 ,  B32B37/00 ,  H05B7/00

    CPC分类号： B32B15/14 ,  B32B37/04 ,  B32B37/06 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2309/68 ,  B32B2310/0812 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/4611 ,  H05K2203/101 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

    摘要： Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board composition formed by one or more metal sheets, by one or more layers of insulating material impregnated with polymerizable resins and/or by one or more printed circuit boards with an engraved Image of a circuit, are arranged between the press plates of a press and is pressed, subjecting said press packet to the action of a variable induction magnetic field which generates induced currents in each metal plate and sheet of the press packet, causing the heating of said plates and sheets, in turn causing the heating by thermal conduction of the layers of insulating material, melting and liquefying the resins in said layers of insulating material and adhering the insulating material to the metal sheets, so that, an raising the temperature even more, the polymerizable resins in the layers of insulating material are then polymerized, resulting, after the cooling of the press packet, in one or more rigid boards suitable for making printed electronic circuits. The machine to carry out the above process comprises a variable induction magnetic field generating device adapted to generate induced currents in the press packet's metal plates and sheets, causing them to heat, and means of controlling the Operation of the magnetic field generating device and controlling the temperature and pressure to which the press packet is subjected.

    Procedure for soldering the constituent layers of a multilayer printed circuit and the machine used for same
    70.
    发明申请
    Procedure for soldering the constituent layers of a multilayer printed circuit and the machine used for same 有权
    用于焊接多层印刷电路的构成层和用于其的机器的步骤

    公开(公告)号：US20050023275A1

    公开(公告)日：2005-02-03

    申请号：US10498236

    申请日：2002-05-27

    申请人： Victor Lazaro Gallego

    发明人： Victor Lazaro Gallego

    IPC分类号： H05K1/02 ,  H05K3/46 ,  H05B6/10

    CPC分类号： H05K1/0212 ,  B32B37/0084 ,  B32B37/065 ,  B32B2310/0812 ,  B32B2457/08 ,  H05K3/4638 ,  H05K2203/065 ,  H05K2203/101

    摘要： Procedure for soldering the constituent layers of a multilayer printed circuit and machine for performing it. The procedure is applicable to circuits made up of layers containing the circuit image (2, 3, 4, 5,) that have perimetral strips (9) including reserve areas (11), superimposed and separated from each other by isolating layers (6, 7 and 8). The procedure includes the following steps: i) place a heater circuit (13) composed of a flat winding with at least one turn in short-circuit (14) in each reserve area (11); ii) superimpose the layers that contain the circuit image (2, 3, 4, 5,) and the isolating layers (6, 7 and 8) in alternating order; iii) secure the position of the layers relative to the others, thereby creating groups (12) of reserve areas (11); iv) place induction electrodes (18) over the groups (12) of reserve areas; v) soldering each one of the groups (12) by application of a magnetic field of variable induction.

    摘要翻译： 用于焊接多层印刷电路的组成层和执行它的机器的步骤。 该程序适用于由包含电路图像（2,3,4,5））的层组成的电路，所述电路图像包括通过隔离层（6,6）叠加并隔开的包括预留区域（11）的周边条带（9） 7和8）。 该程序包括以下步骤：i）在每个储备区域（11）中放置由平面绕组组成的加热器电路（13），其中短路（14）至少有一圈; ii）以交替的顺序叠加包含电路图像（2,3,4,5）和隔离层（6,7和8）的层; iii）确保层相对于其他层的位置，从而创建储备区（11）的组（12）; iv）将感应电极（18）放置在储备区域的组（12）上; v）通过施加可变感应磁场焊接组（12）中的每一个。