中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

844 records (took 0.027 seconds)

    Printed circuit board with tin pads
    61.
    发明授权
    Printed circuit board with tin pads 有权
    带锡垫的印刷电路板

    公开(公告)号：US08077472B2

    公开(公告)日：2011-12-13

    申请号：US12211035

    申请日：2008-09-15

    Applicant: Shu-Tzu Liu

    Inventor： Shu-Tzu Liu

    IPC: H05K5/00 ,  H05K1/09

    CPC classification number: H05K3/0094 ,  H05K1/0215 ,  H05K1/05 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10409 ,  H05K2203/043

    Abstract: A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole. The tin layer contacts the grounding component. The solder mask is formed between a periphery of the through hole and the tin layer. The solder mask is configured to prevent tin cream of the tin layer from flowing into the through hole.

    Abstract translation: 本公开的印刷电路板包括主体，锡层和焊料掩模。 主体限定了连接到接地部件的通孔。 锡层围绕通孔形成在主体的表面上。 锡层接触接地部件。 在通孔的周边和锡层之间形成焊料掩模。 焊锡掩模被配置为防止锡层的锡膏流入通孔。

    ELECTRONIC DEVICE
    64.
    发明申请
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号：US20110211322A1

    公开(公告)日：2011-09-01

    申请号：US12895162

    申请日：2010-09-30

    Applicant: Ted Ju

    Inventor： Ted Ju

    IPC: H05K7/00

    CPC classification number: H05K3/3436 ,  H05K2201/09136 ,  H05K2201/09909 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: An electronic device includes a printed circuit board, conductive portions coated with a solder paste, a chip module installed on the printed circuit board, contact portions formed at the bottom of the chip module and corresponding to the conductive portions respectively, and at least one support portion formed between the chip module and the printed circuit board and having an end coupled to the printed circuit board and another end coupled to the contact portion of the chip module. When the chip module and printed circuit board are deformed in a high-temperature process, the contact portions will still be in contact with the solder paste. Since the printed circuit board is warped upward at the middle and downward at the periphery in a soldering process, the support portion maintains a specific distance between the two to prevent excessive melted solder pastes from flowing towards the periphery or causing short circuits.

    Abstract translation: 电子设备包括印刷电路板，涂覆有焊膏的导电部分，安装在印刷电路板上的芯片模块，分别形成在芯片模块的底部并对应于导电部分的接触部分，以及至少一个支撑体 形成在所述芯片模块和所述印刷电路板之间并且具有耦合到所述印刷电路板的端部和耦合到所述芯片模块的所述接触部分的另一端部分。 当芯片模块和印刷电路板在高温过程中变形时，接触部分仍将与焊膏接触。 由于印刷电路板在焊接过程中在中间向上弯曲并且在周边向下弯曲，所以支撑部分保持两者之间的特定距离，以防止过度熔化的焊膏向周边流动或导致短路。

    Thin wafer detectors with improved radiation damage and crosstalk characteristics
    66.
    发明授权
    Thin wafer detectors with improved radiation damage and crosstalk characteristics 有权
    具有改善辐射损伤和串扰特性的薄晶片检测器

    公开(公告)号：US07880258B2

    公开(公告)日：2011-02-01

    申请号：US11081366

    申请日：2005-03-16

    Applicant: Peter Steven Bui ,  Narayan Dass Taneja

    Inventor： Peter Steven Bui ,  Narayan Dass Taneja

    IPC: H01L31/06 ,  H01L31/00

    CPC classification number: H01L27/14643 ,  B23K1/0016 ,  B23K2101/42 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14692 ,  H05K3/26 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10689 ,  H05K2201/10727

    Abstract: The present invention is directed toward a detector structure, detector arrays, and a method of detecting incident radiation. The present invention comprises several embodiments that provide for reduced radiation damage susceptibility, decreased affects of crosstalk, reduced dark current (current leakage) and increased flexibility in application. In one embodiment, a photodiode array comprises a substrate having at least a front side and a back side, a plurality of diode elements integrally formed in the substrate forming the array, wherein each diode element has a p+ fishbone pattern on the front side, and wherein the p+ fishbone pattern substantially reduces capacitance and crosstalk between adjacent photodiodes, a plurality of front surface cathode and anode contacts, and wire interconnects between diode elements made through a plurality of back surface contacts.

    Abstract translation: 本发明涉及检测器结构，检测器阵列和检测入射辐射的方法。 本发明包括几个实施例，其提供减少的辐射损伤敏感性，降低的串扰影响，降低的暗电流（电流泄漏）和增加的应用灵活性。 在一个实施例中，光电二极管阵列包括至少具有前侧和背面的基板，在形成阵列的基板中一体形成的多个二极管元件，其中每个二极管元件在前侧具有p +鱼骨图案，以及 其中所述p +鱼骨图案基本上减小了相邻光电二极管之间的电容和串扰，多个前表面阴极和阳极触点以及通过多个后表面触点制成的二极管元件之间的导线互连。

    Self-assembly of elements using microfluidic traps
    67.
    发明授权
    Self-assembly of elements using microfluidic traps 有权
    使用微流体阱的元件的自组装

    公开(公告)号：US07874474B2

    公开(公告)日：2011-01-25

    申请号：US12358152

    申请日：2009-01-22

    Applicant: Samuel Kim ,  Ehsan Saeedi ,  Babak Amirparviz

    Inventor： Samuel Kim ,  Ehsan Saeedi ,  Babak Amirparviz

    IPC: H05K1/18 ,  H05K3/20

    CPC classification number: B23K1/0016 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01322 ,  H01L2924/15788 ,  H05K1/189 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0776 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A self-assembly process is disclosed for integrating free standing microcomponents onto a template having a plurality of binding sites, an interconnect network, and trapping structures disposed downstream of the binding sites. The self-assembly is accomplished by flowing a fluid medium containing the microcomponents over the template such that some of the microcomponents are trapped at binding sites. The template may be simultaneously (or subsequently) heated to melt a binder such as a solder spot at each of the binding sites, and then cooled to connect the trapped microcomponents to the interconnect network. In one embodiment, removable blocking elements are disposed upstream of some of the binding sites, for example formed from photoresist. After assembling a first set of microcomponents, the blocking elements are removed, and a second set of microcomponents in a fluid medium are flowed over the template for assembly into the newly unblocked binding sites.

    Abstract translation: 公开了一种自组装过程，用于将独立的微组件整合到具有多个结合位点的模板上，互连网络和布置在结合位点下游的捕获结构。 通过将含有微量组分的流体介质流过模板来实现自组装，使得一些微组分被捕获在结合位点。 模板可以同时（或随后）加热以熔化粘合剂，例如在每个结合位点处的焊点，然后冷却以将捕获的微组件连接到互连网络。 在一个实施例中，可移除的阻挡元件设置在例如由光致抗蚀剂形成的一些结合位点的上游。 在组装第一组微组件之后，去除阻挡元件，并且将流体介质中的第二组微组件流过模板以用于组装到新的未阻塞的结合位点。

    Flexible base material and flexible image-displaying device resistant to plastic deformation
    69.
    发明授权
    Flexible base material and flexible image-displaying device resistant to plastic deformation 有权
    柔性基材和抗塑性变形的柔性图像显示装置

    公开(公告)号：US07787097B2

    公开(公告)日：2010-08-31

    申请号：US11791232

    申请日：2005-02-22

    Applicant: Tasuku Satoh

    Inventor： Tasuku Satoh

    IPC: G02F1/1333 ,  G09G3/00

    CPC classification number: G02F1/133305 ,  G09F9/30 ,  H01L51/0097 ,  H01L51/52 ,  H01L2251/5338 ,  H05K1/0281 ,  H05K2201/09909 ,  H05K2201/2009 ,  Y02E10/549 ,  Y10T428/24355

    Abstract: An anti-deformation structure is formed on the surface of a flexible plate-shaped part. The anti-deformation structure includes protrusions and depressions formed on the surface of the plate-shaped part. The protrusions and depressions has a shape in which adjacent protrusions become in contact with each other in the state when the plate-shaped part is deformed within a range of elastic deformation, restricting further greater deformation, and thus, preventing excessive deformation leading to permanent deformation and raising the resistance to the stress. The flexible base material can be applied to flexible image-displaying devices.

    Abstract translation: 在柔性板状部件的表面上形成抗变形结构。 抗变形结构包括形成在板状部分的表面上的突起和凹陷。 突起和凹陷具有在板状部在弹性变形的范围内变形的状态下相邻的突起彼此接触的形状，限制进一步的更大的变形，并且因此防止过度的变形导致永久变形 并提高对压力的抵抗力。 柔性基材可应用于柔性图像显示装置。

Patent Agency Ranking