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    METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTOR COMPONENTS
    74.
    发明申请
    METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTOR COMPONENTS 审中-公开
    用于生产多个半导体元件的方法

    公开(公告)号：US20130337593A1

    公开(公告)日：2013-12-19

    申请号：US13977407

    申请日：2011-12-15

    申请人： Hans-Christoph Gallmeier ,  Günter Spath ,  Herbert Brunner

    发明人： Hans-Christoph Gallmeier ,  Günter Spath ,  Herbert Brunner

    IPC分类号： H01L33/50

    CPC分类号： H01L33/50 ,  H01L33/0095 ,  H01L33/505 ,  H01L2224/48 ,  H01L2933/0041

    摘要： A method for producing a plurality of radiation-emitting semiconductor components (10) is specified, said components each comprising at least one semiconductor chip (1) and a converter lamina (2). For this purpose, this method involves providing a plurality of semiconductor chips (1) in the wafer assembly (10a), said semiconductor chips each being suitable for emitting a primary radiation. Moreover, a plurality of converter laminae (2) are provided on a common carrier (2a), said converter laminae each being suitable for converting the primary radiation into a secondary radiation, wherein a converter lamina (2) is in each case mounted on one semiconductor chip (1) or onto a plurality of semiconductor chips (1) by means of an automated method.

    摘要翻译： 规定了用于制造多个发光半导体部件（10）的方法，所述部件各自包括至少一个半导体芯片（1）和转换器层（2）。 为此，该方法包括在晶片组件（10a）中提供多个半导体芯片（1），所述半导体芯片各自适于发射初级辐射。 此外，多个转换器层（2）设置在公共载体（2a）上，所述转换器层各自适合于将初级辐射转换成次级辐射，其中转换器层（2）分别安装在一个 半导体芯片（1）或多个半导体芯片（1）上。

    Electromagnetic-radiation-emitting optoelectronic component and method for producing an optoelectronic component
    75.
    发明授权
    Electromagnetic-radiation-emitting optoelectronic component and method for producing an optoelectronic component 有权
    电磁辐射发射光电子元件及其制造方法

    公开(公告)号：US08476655B2

    公开(公告)日：2013-07-02

    申请号：US11992976

    申请日：2006-09-22

    申请人： Herbert Brunner ,  Kirstin Petersen

    发明人： Herbert Brunner ,  Kirstin Petersen

    IPC分类号： H01L33/00

    CPC分类号： H01L33/44 ,  H01L33/507 ,  H01L33/52 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optoelectronic component comprising a housing and a luminescence diode chip arranged in the housing is specified, which component emits a useful radiation. The housing has a housing material which is transmissive to the useful radiation and which is admixed with radiation-absorbing particles in a targeted manner for setting a predetermined radiant intensity or luminous intensity of the emitted useful radiation. The radiation-absorbing particles reduce the radiant intensity or the luminous intensity by a defined value in a targeted manner in order thus to set a predetermined radiant intensity or luminous intensity for the component. A method for producing an optoelectronic component of this type is additionally disclosed.

    摘要翻译： 规定了包括设置在壳体中的壳体和发光二极管芯片的光电子部件，该组件发射有用的辐射。 壳体具有对有用辐射透射的外壳材料，并且以有目标的方式与辐射吸收颗粒混合，以设定发射的有用辐射的预定辐射强度或发光强度。 放射线吸收粒子按目标方式按照规定的值降低辐射强度或发光强度，从而设定成分的规定的辐射强度或发光强度。 另外公开了一种用于制造这种类型的光电子部件的方法。

    Optoelectronic semiconductor chip fitted with a carrier
    77.
    发明授权
    Optoelectronic semiconductor chip fitted with a carrier 失效
    配有载体的光电半导体芯片

    公开(公告)号：US08450847B2

    公开(公告)日：2013-05-28

    申请号：US13126096

    申请日：2009-11-02

    申请人： Patrick Ninz ,  Herbert Brunner

    发明人： Patrick Ninz ,  Herbert Brunner

    IPC分类号： H01L23/498 ,  H01L23/10 ,  H01L23/04 ,  H01L23/58

    CPC分类号： H01L33/483 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L33/58 ,  H01L2924/0002 ,  H01S5/02272 ,  H01L2924/00

    摘要： A method for producing an optoelectronic device includes providing a carrier, applying at least one first metal layer on the carrier, providing at least one optical component, applying at least one second metal layer on the at least one optical component, and mechanically connecting the carrier to the at least one optical component by the at least one first and the at least one second metal layer, wherein the connecting includes friction welding or is friction welding.

    摘要翻译： 一种制造光电子器件的方法包括提供载体，在载体上施加至少一个第一金属层，提供至少一个光学部件，在至少一个光学部件上施加至少一个第二金属层，以及机械连接载体 通过所述至少一个第一和所述至少一个第二金属层到所述至少一个光学部件，其中所述连接包括摩擦焊接或者是摩擦焊接。

    Optoelectronic Component and Method for Producing an Optoelectronic Component
    78.
    发明申请
    Optoelectronic Component and Method for Producing an Optoelectronic Component 有权
    光电子元件的制造方法

    公开(公告)号：US20130113010A1

    公开(公告)日：2013-05-09

    申请号：US13695606

    申请日：2011-04-11

    申请人： Herbert Brunner ,  Hans-Christoph Gallmeier ,  Simon Jerebic ,  Stephan Preuss ,  Hansjörg Schöll

    发明人： Herbert Brunner ,  Hans-Christoph Gallmeier ,  Simon Jerebic ,  Stephan Preuss ,  Hansjörg Schöll

    IPC分类号： H01L33/60 ,  H01L33/00

    CPC分类号： H01L33/60 ,  H01L33/005 ,  H01L33/46 ,  H01L33/486 ,  H01L33/508 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

    摘要： An optoelectronic component comprising an optoelectronic semiconductor chip (104) having a contact side (106) and a radiation coupling-out side (108) situated opposite; a chip carrier (102), on which the semiconductor chip (104) is applied via its contact side (106); a radiation conversion element (110) applied on the radiation coupling-out side (108); and a reflective potting compound (112), which is applied on the chip carrier (102) and laterally encloses the semiconductor chip (104) and the radiation conversion element (110); wherein the potting compound (112) adjoins an upper edge of the radiation conversion element (110) in a substantially flush fashion, such that a top side of the radiation conversion element (110) is free of the potting compound (112).

    摘要翻译： 一种光电子部件，包括具有相对设置的接触侧（106）和辐射耦合出侧（108）的光电子半导体芯片（104） 芯片载体（102），其上通过其接触侧（106）施加半导体芯片（104）; 辐射转换元件（110），其施加在辐射耦合输出侧（108）上; 以及反射封装化合物（112），其被施加在所述芯片载体（102）上并横向封闭所述半导体芯片（104）和所述辐射转换元件（110）; 其中所述封装化合物（112）以基本上齐平的方式邻接所述辐射转换元件（110）的上边缘，使得所述辐射转换元件（110）的顶侧没有所述封装化合物（112）。

    Illuminating Device
    79.
    发明申请
    Illuminating Device 有权
    照明装置

    公开(公告)号：US20110049551A1

    公开(公告)日：2011-03-03

    申请号：US12809729

    申请日：2008-12-11

    申请人： Burkard Wiesmann ,  Herbert Brunner ,  Joerg Strauss ,  Julius Muschaweck ,  Kirstin Petersen

    发明人： Burkard Wiesmann ,  Herbert Brunner ,  Joerg Strauss ,  Julius Muschaweck ,  Kirstin Petersen

    IPC分类号： H01L33/50

    CPC分类号： H01L33/50 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A lighting device (1) comprises at least one element (2) emitting light which is at least in part visible, and at least one conversion medium (3), which converts at least part of the radiation emitted by the element (2) into radiation of another frequency. In addition, the lighting device (1) comprises at least one filter medium (4) which filters at least part of the radiation, and which is configured such that the quantity of the conversion medium (4) to be used is reduced for at least one predetermined colour saturation and/or one predetermined hue. This means that, compared with a light source corresponding to the lighting device (1) apart from the filter medium (4), savings are made in conversion medium (3) while achieving the same colour saturation or the same hue. Light of a predetermined colour saturation or of a predetermined hue may be efficiently generated by such a lighting device (1) and the lighting device (1) may be inexpensively produced. In operation, it also has high light intensities and a long service life.

    摘要翻译： 照明装置（1）包括发射至少部分可见的光的至少一个元件（2）和至少一个转换介质（3），其将由元件（2）发射的辐射的至少一部分转换成 另一个频率的辐射。 此外，照明装置（1）包括至少一个过滤介质（4），其过滤至少部分辐射，并且被配置为使得要使用的转化介质（4）的量至少减少 一个预定的色彩饱和度和/或一个预定色调。 这意味着与对应于照明装置（1）的与过滤介质（4）相对应的光源相比，在转换介质（3）中节省了同样的颜色饱和度或相同的色相。 可以通过这种照明装置（1）有效地生成预定色彩饱和度的光或预定色调的光，并且可以廉价地制造照明装置（1）。 使用寿命长，光线强度高，使用寿命长。

    Diode housing
    80.
    发明授权
    Diode housing 有权
    二极管外壳

    公开(公告)号：US07696590B2

    公开(公告)日：2010-04-13

    申请号：US12055863

    申请日：2008-03-26

    申请人： Gunter Waitl ,  Herbert Brunner

    发明人： Gunter Waitl ,  Herbert Brunner

    IPC分类号： H01L31/02 ,  H01L21/50

    CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

    摘要翻译： 设置容纳半导体芯片的壳体。 外壳和芯片可用于发送和/或接收辐射。 外壳的热门应用可能在发光二极管中。 壳体包括被冲压成两个电隔离部分的导体条。 壳体还包括从壳体的顶部向内延伸的腔体。 导体部分包括暴露在空腔底部的相应区域。 半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。 导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。 在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。 电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。 通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。 类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露的导体实现的内部辐射反射。