公开(公告)号：US20070126122A1

公开(公告)日：2007-06-07

申请号：US11593150

申请日：2006-11-06

申请人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

发明人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

IPC分类号： H01L23/48

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side and its edge sides in the second plastic compound, the active upper side of the semiconductor device being in a coplanar area with the first and second plastic compounds.

摘要翻译： 这里描述了具有布线基板作为半导体器件堆叠的堆叠元件的半导体器件。 布线基板包括第一塑料化合物的塑料框架和第二塑料混合物的中心区域。 半导体芯片的后侧和其边缘侧嵌入第二塑料化合物中，半导体器件的有源上侧与第一和第二塑料化合物在共面区域中。

公开(公告)号：US20070117849A1

公开(公告)日：2007-05-24

申请号：US10574215

申请日：2004-09-16

申请人： Simon Goodman ,  Detlef Schuppan ,  Eleonora Patsenker ,  Yury Popov ,  Michael Bauer ,  Matthias Wiesner ,  Alfred Jonczyk

发明人： Simon Goodman ,  Detlef Schuppan ,  Eleonora Patsenker ,  Yury Popov ,  Michael Bauer ,  Matthias Wiesner ,  Alfred Jonczyk

IPC分类号： A61K31/4439 ,  A61K31/44

CPC分类号： A61K31/00

摘要： This invention relates to inhibition of αv integrins, especially αvβ3 and αvβ6 integrins, by specific antagonists, preferably non-peptidic antagonists, related compounds and compounds with comparable specificity, that downregulate fibrogenesis by inhibiting cell migration and production of pro-fibrogenic molecules (e.g., collagens, TIMP-1) and cytokines (e.g., CTGF) by activated hepatic stellate cells/myofibroblasts, activated epithelia and endothelia. These antagonists alone or in combination with other agents can effectively prevent, mitigate or even reverse development of advanced fibrosis, such as fibrosis/cirrhosis of the liver and fibrosis of other organs, such as lungs, kidneys, intestine, pancreas, skin and arteries.

摘要翻译： 本发明涉及通过特异性拮抗剂，优选非肽拮抗剂，相关化合物和具有相当特异性的化合物抑制alphav整合素，特别是alphavbeta3和alphavbeta6整联蛋白，通过抑制细胞迁移和产生促纤维化分子来下调纤维发生（例如， 胶原，TIMP-1）和活化的肝星状细胞/肌成纤维细胞，活化的上皮细胞和内皮细胞因子（例如CTGF）。 这些单独的或与其它药剂组合的拮抗剂可以有效地预防，减轻或甚至逆转晚期纤维化的发展，例如肝纤维化/肝硬化和其他器官如肺，肾，肠，胰腺，皮肤和动脉的纤维化。

公开(公告)号：US20070099345A1

公开(公告)日：2007-05-03

申请号：US11586740

申请日：2006-10-26

申请人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

发明人： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

IPC分类号： H01L21/00 ,  H01L23/24 ,  H01L23/48 ,  H01L23/22 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H05K1/0373 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/105 ,  H01L2224/96 ,  H01L2224/82

摘要： A method is described for producing through-contacts through a panel-shaped composite body including semiconductor chips and a plastic mass filled with conductive particles. The panel-shaped composite body is introduced between two high-voltage point electrodes. The point electrodes are oriented at positions at which through-contacts are to be introduced through the plastic mass. A high voltage is applied to the point electrodes thereby, forming the through-contacts through the plastic mass.

摘要翻译： 描述了一种用于通过包括半导体芯片和填充有导电颗粒的塑料块的面板形复合体制造穿孔的方法。 板状复合体被引入两个高压点电极之间。 点电极被定向在穿过接触件通过塑料块引入的位置。 因此，高电压施加到点电极，从而通过塑料块形成通孔。

公开(公告)号：US20070057372A1

公开(公告)日：2007-03-15

申请号：US11520035

申请日：2006-09-13

申请人： Michael Bauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut ,  Simon Jerebic ,  Bernd Rakow ,  Peter Strobel ,  Holger Woerner

发明人： Michael Bauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut ,  Simon Jerebic ,  Bernd Rakow ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  B23K35/262 ,  C21D9/50 ,  H01L23/49866 ,  H01L23/49883 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0212 ,  H05K2203/087 ,  H05K2203/1163 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.

摘要翻译： 描述了用于半导体器件的外部触点的外部接触材料及其制造方法。 外部接触材料包括无铅焊料。 在焊料材料中提供的是形成多个气孔的填​​料和/或具有布置在焊料材料的体积中的塑料颗粒。

公开(公告)号：US20070014788A1

公开(公告)日：2007-01-18

申请号：US11451583

申请日：2006-06-12

申请人： Ida Mathiasen ,  Michael Bauer ,  Jorn Muller

发明人： Ida Mathiasen ,  Michael Bauer ,  Jorn Muller

IPC分类号： A61K48/00 ,  A61K39/395

CPC分类号： A61K39/395

摘要： Described herein are methods of treating or preventing various diseases and disorders using modulators of laminin-5. Exemplary diseases and disorders are inflammatory bowel disease, including ulcerative colitis and Crohn's disease, as well as polycystic kidney disease and cancers associated with one or more of the aforementioned conditions. Exemplary laminin-5 modulators include monoclonal antibodies against the laminin-5 gamma2 chain and short interfering RNA (siRNA) sequences against nucleotide sequences encoding the laminin-5 gamma2 chain. Described are also combination treatments based on the administration of a laminin-5 modulator and at least one other therapeutic agent.

摘要翻译： 本文描述的是使用层粘连蛋白-5的调节剂治疗或预防各种疾病和病症的方法。 示例性疾病和病症是炎性肠病，包括溃疡性结肠炎和克罗恩病，以及与一种或多种上述病症相关的多囊肾病和癌症。 示例性的层粘连蛋白-5调节剂包括针对层粘连蛋白-5γ2链的单克隆抗体和针对编码层粘连蛋白-5γ2链的核苷酸序列的短干扰RNA（siRNA）序列。 还描述了基于施用层粘连蛋白-5调节剂和至少一种其它治疗剂的组合治疗。

公开(公告)号：US20060278155A1

公开(公告)日：2006-12-14

申请号：US10565865

申请日：2004-06-08

申请人： Bernd Soltendieck ,  Robert Hofmann ,  Gustav Hofmann ,  Andreas Medler ,  Mathias Kuhn ,  Michael Bauer

发明人： Bernd Soltendieck ,  Robert Hofmann ,  Gustav Hofmann ,  Andreas Medler ,  Mathias Kuhn ,  Michael Bauer

IPC分类号： G01P5/00

CPC分类号： G01C21/265 ,  B60K37/02 ,  B60K2350/1072 ,  B60K2350/2095 ,  G01C21/36 ,  G01C21/3632 ,  G01C21/3635 ,  G01C21/3647 ,  G01C21/3667 ,  G01C21/3679 ,  G02B27/01 ,  G02B27/0101 ,  G02B2027/0141

摘要： A display device for a motor vehicle, e.g., an instrument cluster, includes at least one first display device emitting image-forming light, and at least one illuminated and/or self-luminous electromechanical second display device. The first display device is arranged in a visual field of an observer. The second electromechanical display device is arranged at an angle to the first display device, and a combination element is provided between the first display device and the electromechanical display device, the combination device being transparent to the image-forming light in the first display device and reflective to the image-forming light of the electromechanical second display device.

摘要翻译： 用于机动车辆的显示装置，例如仪表盘，包括发射图像形成光的至少一个第一显示装置和至少一个照明和/或自发光机电第二显示装置。 第一显示装置被布置在观察者的视野中。 第二机电显示装置与第一显示装置成角度配置，并且在第一显示装置和机电显示装置之间设置有组合元件，该组合装置对于第一显示装置中的图像形成光是透明的， 反映在机电二次显示装置的图像形成光上。

公开(公告)号：US20060250781A1

公开(公告)日：2006-11-09

申请号：US10562252

申请日：2004-06-04

申请人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerter ,  Heinz Pape ,  Peter Strobe ,  Stephan Stoeckl

发明人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerter ,  Heinz Pape ,  Peter Strobe ,  Stephan Stoeckl

IPC分类号： H05K1/09

CPC分类号： H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

公开(公告)号：US20060216535A1

公开(公告)日：2006-09-28

申请号：US11389921

申请日：2006-03-27

申请人： Walter Gunter ,  Michael Bauer ,  Siegfried Schmitzer

发明人： Walter Gunter ,  Michael Bauer ,  Siegfried Schmitzer

IPC分类号： B32B27/32 ,  B32B27/34 ,  B29C47/06 ,  B29C47/88 ,  B29C47/92

CPC分类号： B29C55/28 ,  B29C48/0016 ,  B29C48/0018 ,  B29C48/08 ,  B29C48/09 ,  B29C48/10 ,  B29C48/1472 ,  B29C48/151 ,  B29C48/21 ,  B29C48/30 ,  B29C48/335 ,  B29C48/90 ,  B29C48/901 ,  B29C48/92 ,  B29C55/023 ,  B29C66/8122 ,  B29C2791/007 ,  B29C2948/92704 ,  B29C2948/92923 ,  B29K2023/00 ,  B29K2023/06 ,  B29K2023/12 ,  B29K2077/00 ,  B29K2105/04 ,  B29K2105/256 ,  B32B5/18 ,  B32B7/10 ,  B32B25/08 ,  B32B25/20 ,  B32B27/065 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/34 ,  B32B2266/025 ,  B32B2266/0257 ,  B32B2270/00 ,  B32B2307/412 ,  B32B2307/518 ,  B32B2307/5825 ,  B32B2307/702 ,  B32B2307/734 ,  B32B2405/00 ,  B32B2519/00 ,  Y10T428/31725 ,  Y10T428/31931 ,  B29K2883/00

摘要： Process for the production of an oriented plastic film from polyolefins and/or combinations of polyolefins and polyamide that are manufactured by the extrusion and/or coextrusion blowing process, where initial biaxial orientation is carried out during the blowing process and this is followed by another orientation operation.

摘要翻译： 通过挤出和/或共挤吹制法制造聚烯烃和/或聚烯烃和聚酰胺的组合的定向塑料膜的方法，其中在吹塑过程中进行初始双轴取向，然后是另一取向 操作。

公开(公告)号：US20050278309A1

公开(公告)日：2005-12-15

申请号：US10858947

申请日：2004-06-02

申请人： Perry Evans ,  Susan Dalton ,  Michael Bauer

发明人： Perry Evans ,  Susan Dalton ,  Michael Bauer

IPC分类号： G06F7/00 ,  G06F17/30

CPC分类号： G06F16/9537

摘要： A system and method for searching records. One embodiment includes a method for searching comprising: receiving a search a term comprising a product term and a geography limitation; identifying a normalized term corresponding to the product term; identify a first set of records corresponding to the normalized term; sorting the first set of records according to the geography limitation; returning at least some of the first set of records according to the sort; identifying navigation links corresponding to the normalized term; identifying a second set of records corresponding to at least one of the navigation links; and returning at least some of the second set of records.

摘要翻译： 用于搜索记录的系统和方法。 一个实施例包括一种用于搜索的方法，包括：接收搜索包括产品项和地理限制的术语; 识别对应于产品项的标准化术语; 识别与归一化术语相对应的第一组记录; 根据地理限制对第一组记录进行排序; 根据排序返回至少一些第一组记录; 识别与归一化术语相对应的导航链接; 识别对应于所述导航链路中的至少一个的第二组记录; 并返回至少一些第二组记录。

公开(公告)号：US06940156B2

公开(公告)日：2005-09-06

申请号：US10673968

申请日：2003-09-29

申请人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

发明人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

IPC分类号： H01L23/485 ,  H01L23/02

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.

摘要翻译： 电子模块包含具有柔性芯片触点的半导体芯片。 柔性芯片触点设置在最上面的金属化层上并且具有尺寸稳定的接触板，其通过弹性体嵌入化合物中的导电部件连接到最上面的金属化层上的接触表面。