公开(公告)号：US20080007927A1

公开(公告)日：2008-01-10

申请号：US11611538

申请日：2006-12-15

Applicant: Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

Inventor： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC: H05K1/18 ,  H05K3/02

CPC classification number: H05K1/0218 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2402 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4652 ,  H05K2201/09981 ,  H05K2203/0733 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein a electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.

Abstract translation: 一种多层印刷电路板，其中，在容纳半导体元件的树脂绝缘层，另一树脂绝缘层和导体电路上形成有通过通孔电连接的导体电路，其中电磁屏蔽层形成在 环绕用于容纳半导体元件的凹部或凹部的内壁面的树脂绝缘层，并且半导体元件嵌入在凹部中。

公开(公告)号：US08933556B2

公开(公告)日：2015-01-13

申请号：US12895126

申请日：2010-09-30

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H01L23/053 ,  H01L23/12 ,  H05K1/11 ,  H05K3/46 ,  H05K3/40

CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/116 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09854 ,  Y10T156/1056

Abstract: A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.

Abstract translation: 布线板包括具有第一表面和第二表面并且包括第一，第二和第三绝缘层从第一表面朝向第二表面的顺序的层叠体。 第一绝缘层具有穿过第一绝缘层的第一孔，并且包括在第一孔中由电镀制成的第一导体。 第二绝缘层具有穿过第二绝缘层的第二孔，并且包括在第二孔中由导电膏制成的第二导体。 第三绝缘层具有穿过第三绝缘层的第三孔，并且包括在第三孔中由电镀制成的第三导体。 第一，第二和第三导体沿着相同的轴定位并且彼此电连续。

公开(公告)号：US08648263B2

公开(公告)日：2014-02-11

申请号：US12050771

申请日：2008-03-18

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H01R12/04

CPC classification number: H05K3/4691 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A wiring board and a method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) penetrates the base substrate.

Abstract translation: 一种布线板和形成布线板的方法，该布线板包括第一基板，具有比第一基板的安装面积小的安装面积的第二基板以及层叠在第一基板和第二基板之间的基底基板， 衬底延伸超过第二衬底的边缘。 IVH（间隙通孔）穿透基底。

公开(公告)号：US08525038B2

公开(公告)日：2013-09-03

申请号：US13112016

申请日：2011-05-20

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/03

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括柔性基板和形成在柔性基板上的导体图案，邻近柔性基板设置的非柔性基板，包括无机材料并覆盖柔性基板的绝缘层和 非柔性基板，绝缘层暴露柔性板的至少一部分，形成在绝缘层上的导体图案，以及将柔性基板的导体图案与导体图案连接在绝缘层上的镀层。

公开(公告)号：US08522429B2

公开(公告)日：2013-09-03

申请号：US13187995

申请日：2011-07-21

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H01K3/10

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536

Abstract: A method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract translation: 一种形成布线板的方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。

公开(公告)号：US08479389B2

公开(公告)日：2013-07-09

申请号：US12574309

申请日：2009-10-06

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H01K3/10 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a flex-rigid wiring board including disposing a flexible board comprising a flexible substrate and a conductor pattern formed over the flexible substrate and a non-flexible substrate adjacent to each other, covering a boundary between the flexible board and the non-flexible substrate with an insulating layer comprising an inorganic material, providing a conductor pattern on the insulating layer, forming a via hole opening which passes through the insulating layer and reaches the conductor pattern of the flexible board, and plating the via hole opening to form a via connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 一种挠性刚性布线板的制造方法，其特征在于，在柔性基板和柔性基板上形成的柔性基板和导体图案之间设置柔性基板，以及相互邻接的非柔性基板， 具有包含无机材料的绝缘层的柔性基板，在绝缘层上提供导体图案，形成穿过绝缘层并到达柔性板的导体图案的通孔开口，以及电镀通孔开口形成 通过连接柔性板的导体图案和绝缘层上的导体图案。

公开(公告)号：US08476531B2

公开(公告)日：2013-07-02

申请号：US13238429

申请日：2011-09-21

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。

公开(公告)号：US08399775B2

公开(公告)日：2013-03-19

申请号：US12403220

申请日：2009-03-12

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/055 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49124

Abstract: A flex-rigid wiring board includes a first rigid substrate, a second rigid substrate arranged at a distance from the first rigid substrate to provide a space between the first and second rigid substrates and a flexible substrate. The flexible substrate includes a first tip portion connected to the first rigid substrate, and a second tip portion connected to the second rigid substrate such that the first and second rigid substrates are connected to each other by way of the flexible substrate. At least one bending portion is formed between the first and second tip portions of the flexible substrate, each of the at least one bending portions is provided in the space between the first and second rigid substrates.

Abstract translation: 柔性刚性布线板包括第一刚性基板，布置在与第一刚性基板相距一定距离处的第二刚性基板，以在第一和第二刚性基板之间提供空间和柔性基板。 柔性基板包括连接到第一刚性基板的第一末端部分和连接到第二刚性基板的第二末端部分，使得第一和第二刚性基板通过柔性基板相互连接。 在柔性基板的第一和第二末端部分之间形成至少一个弯曲部分，所述至少一个弯曲部分中的每一个设置在第一和第二刚性基板之间的空间中。

公开(公告)号：US20130025914A1

公开(公告)日：2013-01-31

申请号：US13538095

申请日：2012-06-29

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/4694 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/2072 ,  Y10T29/49126

Abstract: A wiring board has wiring board has a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion and having a conductor electrically connected to the conductor in the first rigid wiring board, and an insulation layer formed over the first rigid wiring board and the second rigid wiring board. The first rigid wiring board has a wall surface defining the accommodation portion and having a concavo-convex shaped portion, and the second rigid wiring board has a side surface facing against the wall surface of the first rigid wiring board and having a concavo-convex shaped portion such that the concavo-convex shaped portion of the side surface of the second rigid wiring board engages with the concavo-convex shaped portion of the wall surface of the first rigid wiring board.

Abstract translation: 布线基板具有布线基板，具有具有收容部和导体的第一刚性布线基板，容纳在收纳部中的第二刚性布线基板，具有与第一刚性布线基板中的导体电连接的导体，绝缘层 形成在第一刚性布线板和第二刚性布线板上。 第一刚性布线板具有限定容纳部分并具有凹凸形状部分的壁表面，并且第二刚性布线板具有面对第一刚性布线板的壁表面的侧表面，并且具有凹凸形状 使得第二刚性布线板的侧面的凹凸形状部分与第一刚性布线板的壁表面的凹凸形状部分接合。

公开(公告)号：US08359738B2

公开(公告)日：2013-01-29

申请号：US13215653

申请日：2011-08-23

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H05K1/0366 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer.

Abstract translation: 一种制造布线板的方法，包括形成第一布线板，第一板的形成包括形成基板，在基板的表面上形成第一绝缘层，在基板的相对表面上形成第二绝缘层，形成 在一个层中的通孔，并且在第一区域中切割第一层，并且在与第一区域偏移的第二区域中切割第二层，以形成层压到第二基板的第一基板，其中介于其间的基板，第二基板 具有比第一基板更小的安装面积，使得第一基板延伸超过第二基板的边缘，将柔性构件连接到基板，并且将构件连接到第二布线板以连接第一和第二板。 一个或多个绝缘层是非柔性层。